TWI804076B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI804076B
TWI804076B TW110144510A TW110144510A TWI804076B TW I804076 B TWI804076 B TW I804076B TW 110144510 A TW110144510 A TW 110144510A TW 110144510 A TW110144510 A TW 110144510A TW I804076 B TWI804076 B TW I804076B
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TW
Taiwan
Prior art keywords
substrate
processing
aforementioned
processing space
container body
Prior art date
Application number
TW110144510A
Other languages
English (en)
Chinese (zh)
Other versions
TW202236479A (zh
Inventor
墨周武
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202236479A publication Critical patent/TW202236479A/zh
Application granted granted Critical
Publication of TWI804076B publication Critical patent/TWI804076B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110144510A 2020-11-30 2021-11-30 基板處理裝置及基板處理方法 TWI804076B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-197880 2020-11-30
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
TW202236479A TW202236479A (zh) 2022-09-16
TWI804076B true TWI804076B (zh) 2023-06-01

Family

ID=81755637

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110144510A TWI804076B (zh) 2020-11-30 2021-11-30 基板處理裝置及基板處理方法

Country Status (5)

Country Link
JP (1) JP7557352B2 (https=)
KR (1) KR102692696B1 (https=)
CN (1) CN116529862A (https=)
TW (1) TWI804076B (https=)
WO (1) WO2022114127A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020127513A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機
JP2020127512A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170098537A1 (en) * 2015-10-04 2017-04-06 Applied Materials, Inc. Reduced volume processing chamber
US20170256398A1 (en) * 2016-03-03 2017-09-07 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
CN109585330A (zh) * 2017-09-28 2019-04-05 台湾积体电路制造股份有限公司 晶圆冷却系统
US20190148182A1 (en) * 2017-11-14 2019-05-16 Tokyo Electron Limited Cleaning apparatus and cleaning method of substrate processing apparatus
JP2020170873A (ja) * 2016-11-04 2020-10-15 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus
KR20110072353A (ko) * 2009-12-22 2011-06-29 주식회사 아토 기판처리장치의 기판처리방법
JP5471740B2 (ja) * 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置
JP6015738B2 (ja) 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
JP6755776B2 (ja) * 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP2018082043A (ja) * 2016-11-16 2018-05-24 東京エレクトロン株式会社 基板処理装置
JP6906416B2 (ja) * 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
JP7304738B2 (ja) * 2019-05-17 2023-07-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170098537A1 (en) * 2015-10-04 2017-04-06 Applied Materials, Inc. Reduced volume processing chamber
US20170256398A1 (en) * 2016-03-03 2017-09-07 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and storage medium
JP2020170873A (ja) * 2016-11-04 2020-10-15 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
CN109585330A (zh) * 2017-09-28 2019-04-05 台湾积体电路制造股份有限公司 晶圆冷却系统
US20190148182A1 (en) * 2017-11-14 2019-05-16 Tokyo Electron Limited Cleaning apparatus and cleaning method of substrate processing apparatus

Also Published As

Publication number Publication date
CN116529862A (zh) 2023-08-01
JP2022086069A (ja) 2022-06-09
KR102692696B1 (ko) 2024-08-07
TW202236479A (zh) 2022-09-16
KR20230085211A (ko) 2023-06-13
WO2022114127A1 (ja) 2022-06-02
JP7557352B2 (ja) 2024-09-27

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