KR102692696B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

Info

Publication number
KR102692696B1
KR102692696B1 KR1020237017247A KR20237017247A KR102692696B1 KR 102692696 B1 KR102692696 B1 KR 102692696B1 KR 1020237017247 A KR1020237017247 A KR 1020237017247A KR 20237017247 A KR20237017247 A KR 20237017247A KR 102692696 B1 KR102692696 B1 KR 102692696B1
Authority
KR
South Korea
Prior art keywords
processing
substrate
support tray
container body
processing space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237017247A
Other languages
English (en)
Korean (ko)
Other versions
KR20230085211A (ko
Inventor
노리타케 스미
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20230085211A publication Critical patent/KR20230085211A/ko
Application granted granted Critical
Publication of KR102692696B1 publication Critical patent/KR102692696B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67303—
    • H01L21/67017—
    • H01L21/67242—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020237017247A 2020-11-30 2021-11-26 기판 처리 장치 및 기판 처리 방법 Active KR102692696B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-197880 2020-11-30
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法
PCT/JP2021/043391 WO2022114127A1 (ja) 2020-11-30 2021-11-26 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20230085211A KR20230085211A (ko) 2023-06-13
KR102692696B1 true KR102692696B1 (ko) 2024-08-07

Family

ID=81755637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237017247A Active KR102692696B1 (ko) 2020-11-30 2021-11-26 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP7557352B2 (https=)
KR (1) KR102692696B1 (https=)
CN (1) CN116529862A (https=)
TW (1) TWI804076B (https=)
WO (1) WO2022114127A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020127513A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機
JP2020127512A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471740B2 (ja) 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus
KR20110072353A (ko) * 2009-12-22 2011-06-29 주식회사 아토 기판처리장치의 기판처리방법
JP6015738B2 (ja) 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
KR102055712B1 (ko) * 2015-10-04 2019-12-13 어플라이드 머티어리얼스, 인코포레이티드 감소된 용적의 처리 챔버
JP2017157746A (ja) * 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP6922048B2 (ja) 2016-11-04 2021-08-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6755776B2 (ja) * 2016-11-04 2020-09-16 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP2018082043A (ja) * 2016-11-16 2018-05-24 東京エレクトロン株式会社 基板処理装置
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
JP6906416B2 (ja) * 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
JP7038524B2 (ja) * 2017-11-14 2022-03-18 東京エレクトロン株式会社 基板処理装置の洗浄装置および洗浄方法
JP7304738B2 (ja) * 2019-05-17 2023-07-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471740B2 (ja) 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
CN116529862A (zh) 2023-08-01
JP2022086069A (ja) 2022-06-09
TWI804076B (zh) 2023-06-01
TW202236479A (zh) 2022-09-16
KR20230085211A (ko) 2023-06-13
WO2022114127A1 (ja) 2022-06-02
JP7557352B2 (ja) 2024-09-27

Similar Documents

Publication Publication Date Title
TWI765553B (zh) 基板處理裝置及基板處理方法
US20100022093A1 (en) Vacuum processing apparatus, method of operating same and storage medium
US12222159B2 (en) Apparatus and method for treating substrate
KR20100122893A (ko) 로드락 장치 및 기판 냉각 방법
CN104299934A (zh) Efem、装载端口
KR102859634B1 (ko) 기판 처리 방법
KR102692696B1 (ko) 기판 처리 장치 및 기판 처리 방법
US20140157722A1 (en) Lid opening/closing system for closed container, and substrate processing method using the same
KR101935953B1 (ko) 기판 처리 장치 및 방법
KR101964655B1 (ko) 기판 처리 장치 및 방법
KR20160147162A (ko) 기판 처리 장치 및 기판 처리 방법
US20230162994A1 (en) Apparatus for treating substrate
KR20230140584A (ko) 기판 처리 방법 및 기판 처리 장치
JP7237042B2 (ja) 流体供給ユニット及びこれを有する基板処理装置
KR101500050B1 (ko) 피처리체의 냉각 방법, 냉각 장치 및 컴퓨터 판독 가능한 기억 매체
JP2021125471A (ja) 基板処理装置
JP2010114101A (ja) 基板処理装置および基板処理方法
KR102622987B1 (ko) 기판 처리 장치 및 이에 제공되는 필러 부재
KR102378336B1 (ko) 베이크 장치 및 베이크 방법
KR20230035835A (ko) 기판처리방법
KR102864225B1 (ko) 기판 처리 장치, 기판 처리 시스템 및 기판 처리 방법
KR20250130143A (ko) 기판 처리 장치
KR20240098774A (ko) 초임계 유체 공급 시스템
KR20240075328A (ko) 유체 공급 부재 및 이를 포함하는 기판 처리 장치
KR20240072057A (ko) 기판 처리 방법 및 기판 처리 시스템

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000