JP7545615B1 - 接合体及びその製造方法、集合基板、並びにパワーモジュール - Google Patents

接合体及びその製造方法、集合基板、並びにパワーモジュール Download PDF

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Publication number
JP7545615B1
JP7545615B1 JP2024521298A JP2024521298A JP7545615B1 JP 7545615 B1 JP7545615 B1 JP 7545615B1 JP 2024521298 A JP2024521298 A JP 2024521298A JP 2024521298 A JP2024521298 A JP 2024521298A JP 7545615 B1 JP7545615 B1 JP 7545615B1
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Japan
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plate
ceramic plate
metal plate
main surface
metal
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JP2024521298A
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Japanese (ja)
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JPWO2024111503A1 (https=
Inventor
篤士 酒井
朋幸 原田
賢久 上島
賢太郎 中山
智也 山口
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Ceramic Products (AREA)
JP2024521298A 2022-11-25 2023-11-16 接合体及びその製造方法、集合基板、並びにパワーモジュール Active JP7545615B1 (ja)

Applications Claiming Priority (3)

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JP2022188495 2022-11-25
JP2022188495 2022-11-25
PCT/JP2023/041299 WO2024111503A1 (ja) 2022-11-25 2023-11-16 接合体及びその製造方法、集合基板、並びにパワーモジュール

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JPWO2024111503A1 JPWO2024111503A1 (https=) 2024-05-30
JP7545615B1 true JP7545615B1 (ja) 2024-09-04

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WO (1) WO2024111503A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998054761A1 (en) * 1997-05-26 1998-12-03 Sumitomo Electric Industries, Ltd. Copper circuit junction substrate and method of producing the same
JP2004342635A (ja) * 2003-05-13 2004-12-02 Hitachi Metals Ltd セラミックス基板接合用金属板およびセラミックス回路基板
JP2005268821A (ja) * 2005-05-24 2005-09-29 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
JP2013125908A (ja) * 2011-12-15 2013-06-24 Mitsubishi Materials Corp パワーモジュール用基板の製造方法および製造装置
JP2018011020A (ja) * 2016-07-15 2018-01-18 京セラ株式会社 複合基板および電子装置
WO2021149789A1 (ja) * 2020-01-23 2021-07-29 デンカ株式会社 セラミックス－銅複合体、及びセラミックス－銅複合体の製造方法
JP2022132865A (ja) * 2021-03-01 2022-09-13 三菱マテリアル株式会社 絶縁回路基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004307307A (ja) * 2003-04-10 2004-11-04 Hitachi Metals Ltd セラミックス回路基板とその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998054761A1 (en) * 1997-05-26 1998-12-03 Sumitomo Electric Industries, Ltd. Copper circuit junction substrate and method of producing the same
JP2004342635A (ja) * 2003-05-13 2004-12-02 Hitachi Metals Ltd セラミックス基板接合用金属板およびセラミックス回路基板
JP2005268821A (ja) * 2005-05-24 2005-09-29 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
JP2013125908A (ja) * 2011-12-15 2013-06-24 Mitsubishi Materials Corp パワーモジュール用基板の製造方法および製造装置
JP2018011020A (ja) * 2016-07-15 2018-01-18 京セラ株式会社 複合基板および電子装置
WO2021149789A1 (ja) * 2020-01-23 2021-07-29 デンカ株式会社 セラミックス－銅複合体、及びセラミックス－銅複合体の製造方法
JP2022132865A (ja) * 2021-03-01 2022-09-13 三菱マテリアル株式会社 絶縁回路基板の製造方法

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WO2024111503A1 (ja) 2024-05-30

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