JPWO2024111503A1 - - Google Patents
Info
- Publication number
- JPWO2024111503A1 JPWO2024111503A1 JP2024521298A JP2024521298A JPWO2024111503A1 JP WO2024111503 A1 JPWO2024111503 A1 JP WO2024111503A1 JP 2024521298 A JP2024521298 A JP 2024521298A JP 2024521298 A JP2024521298 A JP 2024521298A JP WO2024111503 A1 JPWO2024111503 A1 JP WO2024111503A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022188495 | 2022-11-25 | ||
| JP2022188495 | 2022-11-25 | ||
| PCT/JP2023/041299 WO2024111503A1 (ja) | 2022-11-25 | 2023-11-16 | 接合体及びその製造方法、集合基板、並びにパワーモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111503A1 true JPWO2024111503A1 (https=) | 2024-05-30 |
| JP7545615B1 JP7545615B1 (ja) | 2024-09-04 |
Family
ID=91195657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521298A Active JP7545615B1 (ja) | 2022-11-25 | 2023-11-16 | 接合体及びその製造方法、集合基板、並びにパワーモジュール |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7545615B1 (https=) |
| WO (1) | WO2024111503A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0935286A4 (en) * | 1997-05-26 | 2008-04-09 | Sumitomo Electric Industries | COPPER CIRCUIT CONNECTING SUBSTRATE AND ITS MANUFACTURE |
| JP2004307307A (ja) * | 2003-04-10 | 2004-11-04 | Hitachi Metals Ltd | セラミックス回路基板とその製造方法 |
| JP2004342635A (ja) * | 2003-05-13 | 2004-12-02 | Hitachi Metals Ltd | セラミックス基板接合用金属板およびセラミックス回路基板 |
| JP4345066B2 (ja) * | 2005-05-24 | 2009-10-14 | 日立金属株式会社 | セラミックス回路基板及びこれを用いたパワー半導体モジュール |
| JP5887907B2 (ja) * | 2011-12-15 | 2016-03-16 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法および製造装置 |
| JP6747897B2 (ja) * | 2016-07-15 | 2020-08-26 | 京セラ株式会社 | 複合基板および電子装置 |
| WO2021149789A1 (ja) * | 2020-01-23 | 2021-07-29 | デンカ株式会社 | セラミックス－銅複合体、及びセラミックス－銅複合体の製造方法 |
| JP7574697B2 (ja) * | 2021-03-01 | 2024-10-29 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
-
2023
- 2023-11-16 JP JP2024521298A patent/JP7545615B1/ja active Active
- 2023-11-16 WO PCT/JP2023/041299 patent/WO2024111503A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP7545615B1 (ja) | 2024-09-04 |
| WO2024111503A1 (ja) | 2024-05-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240409 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20240409 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240528 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240702 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240820 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240823 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7545615 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |