JPWO2024111507A1 - - Google Patents
Info
- Publication number
- JPWO2024111507A1 JPWO2024111507A1 JP2024519885A JP2024519885A JPWO2024111507A1 JP WO2024111507 A1 JPWO2024111507 A1 JP WO2024111507A1 JP 2024519885 A JP2024519885 A JP 2024519885A JP 2024519885 A JP2024519885 A JP 2024519885A JP WO2024111507 A1 JPWO2024111507 A1 JP WO2024111507A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022188502 | 2022-11-25 | ||
| PCT/JP2023/041332 WO2024111507A1 (ja) | 2022-11-25 | 2023-11-16 | 接合体及びその製造方法、集合基板、並びにパワーモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111507A1 true JPWO2024111507A1 (https=) | 2024-05-30 |
| JPWO2024111507A5 JPWO2024111507A5 (https=) | 2024-10-23 |
Family
ID=91195656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024519885A Ceased JPWO2024111507A1 (https=) | 2022-11-25 | 2023-11-16 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024111507A1 (https=) |
| WO (1) | WO2024111507A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110953A (ja) * | 1999-10-07 | 2001-04-20 | Sumitomo Metal Electronics Devices Inc | 半導体モジュール用基板及びその製造方法 |
| JP2006062930A (ja) * | 2004-08-30 | 2006-03-09 | Sumitomo Metal Electronics Devices Inc | セラミックと金属との接合体及びその製造方法 |
| JP2007053349A (ja) * | 2005-07-20 | 2007-03-01 | Mitsubishi Materials Corp | 絶縁基板および絶縁基板の製造方法並びにパワーモジュール用基板およびパワーモジュール |
| JP5664679B2 (ja) * | 2013-03-07 | 2015-02-04 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3156364B2 (ja) * | 1992-04-03 | 2001-04-16 | イビデン株式会社 | 電子部品搭載用基板及びそれに用いる半田フレーム |
| JP2001332854A (ja) * | 2000-05-24 | 2001-11-30 | Toshiba Corp | セラミックス回路基板 |
| JP6747897B2 (ja) * | 2016-07-15 | 2020-08-26 | 京セラ株式会社 | 複合基板および電子装置 |
| JP7574697B2 (ja) * | 2021-03-01 | 2024-10-29 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
-
2023
- 2023-11-16 JP JP2024519885A patent/JPWO2024111507A1/ja not_active Ceased
- 2023-11-16 WO PCT/JP2023/041332 patent/WO2024111507A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110953A (ja) * | 1999-10-07 | 2001-04-20 | Sumitomo Metal Electronics Devices Inc | 半導体モジュール用基板及びその製造方法 |
| JP2006062930A (ja) * | 2004-08-30 | 2006-03-09 | Sumitomo Metal Electronics Devices Inc | セラミックと金属との接合体及びその製造方法 |
| JP2007053349A (ja) * | 2005-07-20 | 2007-03-01 | Mitsubishi Materials Corp | 絶縁基板および絶縁基板の製造方法並びにパワーモジュール用基板およびパワーモジュール |
| JP5664679B2 (ja) * | 2013-03-07 | 2015-02-04 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024111507A1 (ja) | 2024-05-30 |
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