JP7535198B2 - 回路基板及びその製造方法、並びにパワーモジュール - Google Patents

回路基板及びその製造方法、並びにパワーモジュール Download PDF

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Publication number
JP7535198B2
JP7535198B2 JP2023550661A JP2023550661A JP7535198B2 JP 7535198 B2 JP7535198 B2 JP 7535198B2 JP 2023550661 A JP2023550661 A JP 2023550661A JP 2023550661 A JP2023550661 A JP 2023550661A JP 7535198 B2 JP7535198 B2 JP 7535198B2
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Prior art keywords
recess
circuit board
plate
main surface
ceramic plate
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Japanese (ja)
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JPWO2023190244A1 (https=
JPWO2023190244A5 (https=
Inventor
知広 ▲濱▼岡
聖治 小橋
厚樹 五十嵐
晃正 湯浅
貴裕 中村
善幸 江嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023550661A 2022-03-31 2023-03-24 回路基板及びその製造方法、並びにパワーモジュール Active JP7535198B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022060336 2022-03-31
JP2022060336 2022-03-31
PCT/JP2023/011995 WO2023190244A1 (ja) 2022-03-31 2023-03-24 回路基板及びその製造方法、並びにパワーモジュール

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JPWO2023190244A1 JPWO2023190244A1 (https=) 2023-10-05
JPWO2023190244A5 JPWO2023190244A5 (https=) 2024-03-08
JP7535198B2 true JP7535198B2 (ja) 2024-08-15

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WO (1) WO2023190244A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158611A (ja) 2007-12-25 2009-07-16 Kyocera Corp 回路基板及びこれを用いたパッケージ並びに電子装置
JP2010206090A (ja) 2009-03-05 2010-09-16 Nec Corp 半導体装置
JP2013118299A (ja) 2011-12-05 2013-06-13 Mitsubishi Materials Corp パワーモジュール用基板
JP2014086581A (ja) 2012-10-24 2014-05-12 Nippon Steel & Sumikin Electronics Devices Inc 半導体素子収納用パッケージ
JP2017011216A (ja) 2015-06-25 2017-01-12 京セラ株式会社 回路基板および電子装置
JP2021150455A (ja) 2020-03-18 2021-09-27 三菱マテリアル株式会社 金属部材の仮止め方法、接合体の製造方法、及び、絶縁回路基板の製造方法
JP2022000871A (ja) 2018-07-31 2022-01-04 京セラ株式会社 電気回路基板及びパワーモジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158611A (ja) 2007-12-25 2009-07-16 Kyocera Corp 回路基板及びこれを用いたパッケージ並びに電子装置
JP2010206090A (ja) 2009-03-05 2010-09-16 Nec Corp 半導体装置
JP2013118299A (ja) 2011-12-05 2013-06-13 Mitsubishi Materials Corp パワーモジュール用基板
JP2014086581A (ja) 2012-10-24 2014-05-12 Nippon Steel & Sumikin Electronics Devices Inc 半導体素子収納用パッケージ
JP2017011216A (ja) 2015-06-25 2017-01-12 京セラ株式会社 回路基板および電子装置
JP2022000871A (ja) 2018-07-31 2022-01-04 京セラ株式会社 電気回路基板及びパワーモジュール
JP2021150455A (ja) 2020-03-18 2021-09-27 三菱マテリアル株式会社 金属部材の仮止め方法、接合体の製造方法、及び、絶縁回路基板の製造方法

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WO2023190244A1 (ja) 2023-10-05

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