JP7528246B2 - 可撓性基板、検査治具 - Google Patents

可撓性基板、検査治具 Download PDF

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Publication number
JP7528246B2
JP7528246B2 JP2022559070A JP2022559070A JP7528246B2 JP 7528246 B2 JP7528246 B2 JP 7528246B2 JP 2022559070 A JP2022559070 A JP 2022559070A JP 2022559070 A JP2022559070 A JP 2022559070A JP 7528246 B2 JP7528246 B2 JP 7528246B2
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JP
Japan
Prior art keywords
connector
spring
flexible board
flexible substrate
tongue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022559070A
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English (en)
Japanese (ja)
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JPWO2022091930A1 (https=
JPWO2022091930A5 (https=
Inventor
久史 鈴木
力 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Publication of JPWO2022091930A1 publication Critical patent/JPWO2022091930A1/ja
Publication of JPWO2022091930A5 publication Critical patent/JPWO2022091930A5/ja
Application granted granted Critical
Publication of JP7528246B2 publication Critical patent/JP7528246B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • G01R31/69—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board of terminals at the end of a cable or a wire harness; of plugs; of sockets, e.g. wall sockets or power sockets in appliances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2022559070A 2020-10-27 2021-10-21 可撓性基板、検査治具 Active JP7528246B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020179352 2020-10-27
JP2020179352 2020-10-27
PCT/JP2021/038915 WO2022091930A1 (ja) 2020-10-27 2021-10-21 可撓性基板、検査治具

Publications (3)

Publication Number Publication Date
JPWO2022091930A1 JPWO2022091930A1 (https=) 2022-05-05
JPWO2022091930A5 JPWO2022091930A5 (https=) 2023-07-12
JP7528246B2 true JP7528246B2 (ja) 2024-08-05

Family

ID=81382336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022559070A Active JP7528246B2 (ja) 2020-10-27 2021-10-21 可撓性基板、検査治具

Country Status (7)

Country Link
US (1) US20230397329A1 (https=)
EP (1) EP4240119A4 (https=)
JP (1) JP7528246B2 (https=)
KR (1) KR20230093435A (https=)
CN (1) CN116458270A (https=)
TW (1) TW202218491A (https=)
WO (1) WO2022091930A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025521709A (ja) 2022-07-27 2025-07-10 エルジー エナジー ソリューション リミテッド 二次電池の製造方法、製造装置及びそれにより製造された二次電池

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000214184A (ja) 1999-01-26 2000-08-04 Micronics Japan Co Ltd プロ―ブ装置
JP2001208774A (ja) 2000-01-26 2001-08-03 Toko Inc 電子部品の特性測定用治具の接触子

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2759193B2 (ja) * 1989-07-28 1998-05-28 東京エレクトロン株式会社 プローブ測定方法
JPH06230032A (ja) * 1993-02-04 1994-08-19 Toho Denshi Kk プローブ基板
JPH10104271A (ja) * 1996-09-30 1998-04-24 Fujikura Ltd コンタクトプローブ及びその製造方法
KR100379817B1 (ko) * 1997-07-16 2003-08-06 데이꼬꾸 쓰신 고교 가부시키가이샤 가요성기판상에전자부품을장착하기위한구조
JP2000131342A (ja) * 1998-10-20 2000-05-12 Fujitsu Ltd 電子部品用コンタクタ
KR101077277B1 (ko) * 2009-11-04 2011-10-27 (주)이노웍스 디스플레이 패널의 점등 검사용으로 사용되는 프로브 장치
US9709599B2 (en) * 2014-01-09 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Membrane probe card
US10764999B2 (en) * 2014-06-30 2020-09-01 Panasonic Intellectual Property Management Co., Ltd. Flexible substrate
JP2020191170A (ja) * 2019-05-20 2020-11-26 日本航空電子工業株式会社 コネクタ検査装置、コネクタモジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000214184A (ja) 1999-01-26 2000-08-04 Micronics Japan Co Ltd プロ―ブ装置
JP2001208774A (ja) 2000-01-26 2001-08-03 Toko Inc 電子部品の特性測定用治具の接触子

Also Published As

Publication number Publication date
CN116458270A (zh) 2023-07-18
TW202218491A (zh) 2022-05-01
JPWO2022091930A1 (https=) 2022-05-05
US20230397329A1 (en) 2023-12-07
EP4240119A4 (en) 2024-10-09
KR20230093435A (ko) 2023-06-27
EP4240119A1 (en) 2023-09-06
WO2022091930A1 (ja) 2022-05-05

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