JP7494946B2 - ヒータ制御装置 - Google Patents

ヒータ制御装置 Download PDF

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Publication number
JP7494946B2
JP7494946B2 JP2022578150A JP2022578150A JP7494946B2 JP 7494946 B2 JP7494946 B2 JP 7494946B2 JP 2022578150 A JP2022578150 A JP 2022578150A JP 2022578150 A JP2022578150 A JP 2022578150A JP 7494946 B2 JP7494946 B2 JP 7494946B2
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Japan
Prior art keywords
temperature
heating element
power
heating
substrate
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JP2022578150A
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English (en)
Japanese (ja)
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JPWO2022163214A5 (https=
JPWO2022163214A1 (https=
Inventor
成伸 先田
良平 藤見
功一 木村
克裕 板倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Publication date
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Publication of JPWO2022163214A1 publication Critical patent/JPWO2022163214A1/ja
Publication of JPWO2022163214A5 publication Critical patent/JPWO2022163214A5/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00Details of electric heating devices
    • H05B1/02Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227Applications
    • H05B1/023Industrial applications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/0004Devices wherein the heating current flows through the material to be heated

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Control Of Resistance Heating (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
JP2022578150A 2021-01-29 2021-12-20 ヒータ制御装置 Active JP7494946B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021012977 2021-01-29
JP2021012977 2021-01-29
PCT/JP2021/047141 WO2022163214A1 (ja) 2021-01-29 2021-12-20 ヒータ制御装置

Publications (3)

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JPWO2022163214A1 JPWO2022163214A1 (https=) 2022-08-04
JPWO2022163214A5 JPWO2022163214A5 (https=) 2023-09-21
JP7494946B2 true JP7494946B2 (ja) 2024-06-04

Family

ID=82654454

Family Applications (1)

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JP2022578150A Active JP7494946B2 (ja) 2021-01-29 2021-12-20 ヒータ制御装置

Country Status (3)

Country Link
JP (1) JP7494946B2 (https=)
KR (1) KR102900018B1 (https=)
WO (1) WO2022163214A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102844318B1 (ko) * 2023-12-19 2025-08-08 주식회사 에스지에스코리아 멀티 존 히터의 제어 장치 및 제어 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000235886A (ja) 1998-12-14 2000-08-29 Tokyo Electron Ltd 加熱手段の温度制御装置および温度制御方法
JP2009074148A (ja) 2007-09-21 2009-04-09 Tokyo Electron Ltd 成膜装置
WO2012165174A1 (ja) 2011-06-01 2012-12-06 シャープ株式会社 抵抗加熱ヒータの劣化検出装置および方法
JP2020506539A (ja) 2017-01-20 2020-02-27 ラム リサーチ コーポレーションLam Research Corporation 熱制御素子を用いるesc温度推定のための仮想測定方法
US20200255945A1 (en) 2018-05-07 2020-08-13 Lam Research Corporation Use of voltage and current measurements to control dual zone ceramic pedestals

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012253222A (ja) * 2011-06-03 2012-12-20 Hitachi Kokusai Electric Inc 抵抗加熱式ヒータの寿命予測方法及び熱処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000235886A (ja) 1998-12-14 2000-08-29 Tokyo Electron Ltd 加熱手段の温度制御装置および温度制御方法
JP2009074148A (ja) 2007-09-21 2009-04-09 Tokyo Electron Ltd 成膜装置
WO2012165174A1 (ja) 2011-06-01 2012-12-06 シャープ株式会社 抵抗加熱ヒータの劣化検出装置および方法
JP2020506539A (ja) 2017-01-20 2020-02-27 ラム リサーチ コーポレーションLam Research Corporation 熱制御素子を用いるesc温度推定のための仮想測定方法
US20200255945A1 (en) 2018-05-07 2020-08-13 Lam Research Corporation Use of voltage and current measurements to control dual zone ceramic pedestals

Also Published As

Publication number Publication date
WO2022163214A1 (ja) 2022-08-04
KR102900018B1 (ko) 2025-12-12
KR20230124728A (ko) 2023-08-25
JPWO2022163214A1 (https=) 2022-08-04

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