JP7493309B2 - 炭化ケイ素体を有する半導体デバイスおよび製造方法 - Google Patents
炭化ケイ素体を有する半導体デバイスおよび製造方法 Download PDFInfo
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- JP7493309B2 JP7493309B2 JP2019089784A JP2019089784A JP7493309B2 JP 7493309 B2 JP7493309 B2 JP 7493309B2 JP 2019089784 A JP2019089784 A JP 2019089784A JP 2019089784 A JP2019089784 A JP 2019089784A JP 7493309 B2 JP7493309 B2 JP 7493309B2
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Description
101 第1の表面
102 第2の表面
103 側面
104 面法線
110 ソース領域
111 第1のソース部分
112 第2のソース部分
120 ボディ領域
121 主領域
130 ドリフト構造体
131 ドリフト領域
137 電流拡散領域
139 接触構造体
149 接触領域
150 トレンチ・ゲート構造体
160 遮蔽領域
170 半導体メサ
171 第1のメサ側壁
172 第2のメサ側壁
191 第1の方向
192 第2の方向
202 第1の層間絶縁膜部分
203 第2の誘電体層
205 層間絶縁膜層
210 層間絶縁膜
310 第1の負荷電極
311 接触層
315 主金属構造体
316 トレンチ接触部
320 第2の負荷電極
330 ゲート構造体
334 ゲート・パッド
336 ゲート導電線
400 ゲート電極
420 半導体層
421 多結晶層
425 多結晶半導体材料
450 金属構造体
451 第1の層
452 第2の層
455 充填構造体
471 犠牲酸化物層
472 第1の犠牲材料
475 第2の犠牲材料
490 ゲート誘電体
491 ゲート誘電体層
500 半導体デバイス
610 中央領域
611 第1のレジスト・マスク
615 第1のレジスト・マスク開口部
620 第2のレジスト・マスク
630 第3のレジスト・マスク
690 エッジ領域
700 炭化ケイ素基板
701 主表面
702 接触領域
711 事前ケイ素化部分
750 ゲート・トレンチ
755 補助トレンチ
810 第1の金属層
815 金属充填層
816 残りの部分
820 第1の補助金属層
830 接触金属層
840 ニッケル・アルミニウム層
850 第2の補助金属層
880 モリブデン含有層
902 炭化ケイ素基板を設ける
904 ゲート電極がトレンチ内に形成される
Claims (19)
- 半導体デバイスであって、
炭化ケイ素体(100)の第1の表面(101)から前記炭化ケイ素体(100)内に延在するゲート電極(400)と、
前記ゲート電極(400)と前記炭化ケイ素体(100)との間のゲート誘電体(490)と、
前記炭化ケイ素体(100)と接触している接触層(311)と、
を備え、
前記ゲート電極(400)が、金属構造体(450)、および前記金属構造体(450)と前記ゲート誘電体(490)との間に半導体層(420)を含み、
前記金属構造体(450)は、前記炭化ケイ素体(100)の前記第1の表面(101)と同一平面またはそれより上にある上面を有し、
前記金属構造体(450)の前記上面は層間絶縁膜で覆われていて、
前記接触層(311)が、ニッケル・アルミニウムを含む、半導体デバイス。 - 前記半導体層(420)が、ドープ多結晶ケイ素および/または真性多結晶ケイ素のうち少なくとも一方を含む、請求項1に記載の半導体デバイス。
- 前記半導体層(420)が、pドープ多結晶ケイ素を含む、請求項1または2に記載の半導体デバイス。
- 前記金属構造体(450)が第1の層(451)を備え、前記第1の層(451)が、前記半導体層(420)と接触しており、少なくとも第1の遷移金属を含む、請求項1~3のいずれか一項に記載の半導体デバイス。
- 前記第1の層(451)がさらに窒素を含む、請求項4に記載の半導体デバイス。
- 前記第1の遷移金属が、モリブデン、チタン、またはタンタルである、請求項4または5に記載の半導体デバイス。
- 前記金属構造体(450)が充填構造体(455)を備え、前記第1の層(451)が前記充填構造体(455)と前記半導体層(420)との間に配置され、前記充填構造体が第2の遷移金属を含み、前記充填構造体が、少なくとも1つの主成分において前記第1の層(451)とは異なる、請求項4~6のいずれか一項に記載の半導体デバイス。
- 前記第2の遷移金属がタングステンであり、かつ/または前記第1の遷移金属とは異なる、請求項7に記載の半導体デバイス。
- 前記接触層(311)が、チタン、窒化チタン、タンタル、および/または窒化タンタルを含み、前記金属構造体(450)の前記第1の層(451)が、チタン、窒化チタン、タンタル、および/または窒化タンタルを含む、請求項4~8のいずれか一項に記載の半導体デバイス。
- 前記金属構造体(450)の前記第1の層(451)が、モリブデンおよび/または窒化モリブデンを含む、請求項4~8のいずれか一項に記載の半導体デバイス。
- 第2の層(452)が、前記第1の層(451)と前記充填構造体(455)との間に配置され、前記第2の層(452)が、少なくとも第3の遷移金属を含み、前記第2の層(452)が、少なくとも1つの主成分において前記第1の層(451)とは異なる、請求項7または8に記載の半導体デバイス。
- 前記炭化ケイ素体(100)が、ドリフト構造体(130)、ソース領域(110)、およびボディ領域(120)を備え、前記ボディ領域(120)が、前記ドリフト構造体(130)との第1のpn接合部(pn1)、および前記ソース領域(110)との第2のpn接合部(pn2)を形成し、前記ソース領域(110)が、前記ボディ領域(120)と前記第1の表面(101)との間に配置され、前記ボディ領域(120)が、前記ゲート誘電体(490)と接触している、請求項1~11のいずれか一項に記載の半導体デバイス。
- 前記炭化ケイ素体(100)の前記第1の表面(101)上にゲート構造体(330)をさらに備え、前記ゲート構造体(330)および前記ゲート電極(400)が、最大でも2つの接触領域において電気的に接続され、前記接触領域が、第1の方向(191)に沿って互いに離間している、請求項1~12のいずれか一項に記載の半導体デバイス。
- 前記炭化ケイ素体(100)の前記第1の表面(101)上に第1の負荷電極(310)をさらに備え、前記ゲート構造体(330)が、前記第1の負荷電極(310)と前記炭化ケイ素体(100)の側面(103)との間に配置される、請求項13に記載の半導体デバイス。
- 前記ゲート構造体(330)が、ゲート・パッド(334)および少なくとも1つのゲート導電線(336)を備え、前記ゲート導電線(336)が前記ゲート・パッド(334)と接続されている、請求項13または14に記載の半導体デバイス。
- 前記炭化ケイ素体(100)が、複数のゲート電極(400)を備え、前記ゲート電極(400)のそれぞれが、第1の方向(191)に沿って長手方向の延在を有し、前記ゲート電極(400)が、前記第1の方向(191)と直交する方向に互いに離間している、請求項1~15のいずれか一項に記載の半導体デバイス。
- 半導体デバイスを製造する方法であって、
炭化ケイ素基板(700)を設けるステップであって、ゲート・トレンチ(750)が、前記炭化ケイ素基板(700)の主表面(701)から、前記炭化ケイ素基板(700)内に延在し、ゲート誘電体(490)が、前記ゲート・トレンチ(750)の少なくとも1つの側壁に形成されるステップと、
前記ゲート・トレンチ(750)内にゲート電極(400)を形成するステップであって、前記ゲート電極(400)が、金属構造体(450)、および前記金属構造体(450)と前記ゲート誘電体(490)との間に半導体層(420)を備えるステップと、
を含み、
前記ゲート電極(400)を形成するステップが、前記半導体層(420)および前記主表面(701)上に第1の金属層(810)を堆積させるステップを含み、
前記第1の金属層(810)が、遷移金属および/または遷移金属窒化物を含み、
前記主表面(701)上の接触層(311)および前記金属構造体(450)の第1の層(451)が、前記第1の金属層(810)の各部分から形成される、方法。 - 接触層(311)が、前記主表面(701)上に形成され、次いで、前記金属構造体(450)の第1の層(451)が、前記半導体層(420)上に形成され、前記接触層(311)が、金属シリサイドおよび/またはニッケル・アルミニウムを含む、請求項17に記載の方法。
- 前記金属構造体(450)の第1の層(451)が、前記半導体層(420)上に形成され、次いで、接触層(311)が、前記主表面(701)上に形成され、前記第1の層(451)が、遷移金属ならびに/もしくは遷移金属窒化物を含み、前記接触層(311)が、遷移金属ならびに/もしくは遷移金属窒化物を含むか、または、前記第1の層(451)が、モリブデンならびに/もしくは窒化モリブデンを含み、前記接触層(311)が、ニッケル・アルミニウムを含む、請求項17に記載の方法。
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