JP7485700B2 - 基板処理方法、記憶媒体、及び基板処理装置 - Google Patents

基板処理方法、記憶媒体、及び基板処理装置 Download PDF

Info

Publication number
JP7485700B2
JP7485700B2 JP2021571124A JP2021571124A JP7485700B2 JP 7485700 B2 JP7485700 B2 JP 7485700B2 JP 2021571124 A JP2021571124 A JP 2021571124A JP 2021571124 A JP2021571124 A JP 2021571124A JP 7485700 B2 JP7485700 B2 JP 7485700B2
Authority
JP
Japan
Prior art keywords
substrate
coating
parameters
processing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021571124A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021145175A1 (fr
Inventor
淳司 中村
正一 寺田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2021145175A1 publication Critical patent/JPWO2021145175A1/ja
Application granted granted Critical
Publication of JP7485700B2 publication Critical patent/JP7485700B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP2021571124A 2020-01-16 2020-12-23 基板処理方法、記憶媒体、及び基板処理装置 Active JP7485700B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020004972 2020-01-16
JP2020004972 2020-01-16
PCT/JP2020/048136 WO2021145175A1 (fr) 2020-01-16 2020-12-23 Procédé de traitement de substrat, milieu de stockage et appareil de traitement de substrat

Publications (2)

Publication Number Publication Date
JPWO2021145175A1 JPWO2021145175A1 (fr) 2021-07-22
JP7485700B2 true JP7485700B2 (ja) 2024-05-16

Family

ID=76863683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021571124A Active JP7485700B2 (ja) 2020-01-16 2020-12-23 基板処理方法、記憶媒体、及び基板処理装置

Country Status (3)

Country Link
JP (1) JP7485700B2 (fr)
TW (1) TW202133223A (fr)
WO (1) WO2021145175A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000237669A (ja) 1999-02-23 2000-09-05 Central Glass Co Ltd スピンコート法による薄膜の形成装置及び形成方法
JP2005235950A (ja) 2004-02-18 2005-09-02 Tokyo Electron Ltd 塗布処理装置及び塗布処理方法
JP2008177410A (ja) 2007-01-19 2008-07-31 Fujitsu Ltd 塗布液の塗布方法及び半導体装置の製造方法
JP2016147246A (ja) 2015-02-13 2016-08-18 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092726A (ja) * 1996-09-18 1998-04-10 Toshiba Microelectron Corp レジスト塗布装置及びレジスト塗布方法
JP3831096B2 (ja) * 1997-10-17 2006-10-11 株式会社リコー 塗布膜形成方法及び塗布膜形成装置
JP3453073B2 (ja) * 1998-10-14 2003-10-06 東京エレクトロン株式会社 塗布処理装置
JP4184317B2 (ja) * 2004-03-05 2008-11-19 シーケーディ株式会社 液滴塗布方法および液滴塗布装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000237669A (ja) 1999-02-23 2000-09-05 Central Glass Co Ltd スピンコート法による薄膜の形成装置及び形成方法
JP2005235950A (ja) 2004-02-18 2005-09-02 Tokyo Electron Ltd 塗布処理装置及び塗布処理方法
JP2008177410A (ja) 2007-01-19 2008-07-31 Fujitsu Ltd 塗布液の塗布方法及び半導体装置の製造方法
JP2016147246A (ja) 2015-02-13 2016-08-18 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Also Published As

Publication number Publication date
JPWO2021145175A1 (fr) 2021-07-22
TW202133223A (zh) 2021-09-01
WO2021145175A1 (fr) 2021-07-22

Similar Documents

Publication Publication Date Title
JP5503564B2 (ja) 処理装置の異常判定システム及びその異常判定方法
US7938587B2 (en) Substrate processing method, computer storage medium and substrate processing system
US20090254226A1 (en) Temperature setting method of heat processing plate, temperature setting apparatus of heat processing plate, program, and computer-readable recording medium recording program thereon
CN109817549A (zh) 基片处理装置和涂敷单元的参数的调整方法以及存储介质
JP7485700B2 (ja) 基板処理方法、記憶媒体、及び基板処理装置
JPH10275755A (ja) レジスト塗布現像装置とレジスト塗布現像方法
US7910863B2 (en) Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate
JP6955928B2 (ja) 熱処理装置、熱処理方法及び記憶媒体
TW201937307A (zh) 基板處理裝置、基板處理方法及記錄媒體
TW201932207A (zh) 基板處理裝置、基板處理方法及記錄媒體
US11809091B2 (en) Substrate processing apparatus and processing condition adjustment method
KR102628747B1 (ko) 현상 처리 장치, 현상 처리 방법 및 기억 매체
KR20180073481A (ko) 기판 처리 장치 및 기판 처리 방법
US20230197480A1 (en) Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and computer-readable recording medium
TWI830812B (zh) 基板處理之條件設定支援方法、基板處理系統、記錄媒體及學習模型
JP7473407B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP7361130B2 (ja) 基板処理装置、基板処理方法、及び記憶媒体
JP2024027989A (ja) 特徴量推定方法、推定プログラム、及び、特徴量推定装置
JP2022175009A (ja) 基板処理方法、記憶媒体、及び基板処理装置
JP7482018B2 (ja) 推定モデル作成装置、推定モデル作成方法、及び記憶媒体
JP6765009B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
WO2022168756A1 (fr) Procédé d'analyse d'épaisseur de film, dispositif d'analyse d'épaisseur de film et support d'enregistrement
US20210090919A1 (en) Substrate processing control method, substrate processing apparatus and storage medium
TW201903839A (zh) 處理配方之評估方法、記錄媒體、處理配方評估用之支援裝置及液體處理裝置
TWI837781B (zh) 學習裝置、資訊處理裝置、基板處理裝置、基板處理系統、學習方法、配方決定方法及學習程式

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230815

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231016

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240215

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240409

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240502

R150 Certificate of patent or registration of utility model

Ref document number: 7485700

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150