JP7480848B2 - 導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法 - Google Patents

導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法 Download PDF

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JP7480848B2
JP7480848B2 JP2022542831A JP2022542831A JP7480848B2 JP 7480848 B2 JP7480848 B2 JP 7480848B2 JP 2022542831 A JP2022542831 A JP 2022542831A JP 2022542831 A JP2022542831 A JP 2022542831A JP 7480848 B2 JP7480848 B2 JP 7480848B2
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conductive film
particles
mxene
less
layer
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JPWO2022034853A1 (https=
JPWO2022034853A5 (https=
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義人 早田
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2022542831A 2020-08-13 2021-08-05 導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法 Active JP7480848B2 (ja)

Applications Claiming Priority (3)

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JP2020136819 2020-08-13
JP2020136819 2020-08-13
PCT/JP2021/029151 WO2022034853A1 (ja) 2020-08-13 2021-08-05 導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法

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JPWO2022034853A1 JPWO2022034853A1 (https=) 2022-02-17
JPWO2022034853A5 JPWO2022034853A5 (https=) 2023-04-19
JP7480848B2 true JP7480848B2 (ja) 2024-05-10

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JP2022542831A Active JP7480848B2 (ja) 2020-08-13 2021-08-05 導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法

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US (1) US20230217635A1 (https=)
JP (1) JP7480848B2 (https=)
CN (1) CN116134978B (https=)
WO (1) WO2022034853A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119110976A (zh) * 2022-05-16 2024-12-10 株式会社村田制作所 导电性二维粒子及其制造方法、导电性膜、导电性糊剂、以及导电性复合材料
EP4535375A4 (en) * 2022-06-01 2026-04-22 Murata Manufacturing Co ELECTRODE AND ELECTRODE MANUFACTURING METHOD

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107058851A (zh) 2016-12-29 2017-08-18 上海大学 一种二维片层材料增强的金属基复合材料
KR101966582B1 (ko) 2018-02-02 2019-04-05 성균관대학교산학협력단 2차원 맥세인 박막의 제조방법
CN110698847A (zh) 2019-10-21 2020-01-17 西北工业大学 水性聚氨酯-MXene电磁屏蔽仿生纳米复合材料膜及制备方法
US20200163261A1 (en) 2018-01-05 2020-05-21 Korea Institute Of Science And Technology Method for manufacturing electromagnetic interference shielding film
US20200240000A1 (en) 2017-10-16 2020-07-30 Drexel University Mxene layers as substrates for growth of highly oriented perovskite thin films

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5145938B2 (ja) * 2005-09-16 2013-02-20 大日本印刷株式会社 帯電防止防眩フィルム
JP5387034B2 (ja) * 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
EP3197832B1 (en) * 2014-09-25 2022-06-22 Drexel University Physical forms of mxene materials exhibiting novel electrical and optical characteristics
JP6460383B2 (ja) * 2014-12-11 2019-01-30 Dic株式会社 導電性積層体及びその製造方法
JP2017191928A (ja) * 2016-04-11 2017-10-19 株式会社リコー 電気機械変換電子部品、液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置
KR20200102535A (ko) * 2016-04-22 2020-08-31 한국과학기술연구원 Emi 차폐용 2차원 금속 탄화물, 질화물 및 탄질화물 필름 및 복합체
US20180338396A1 (en) * 2017-05-16 2018-11-22 Murata Manufacturing Co., Ltd. Electronic component having electromagnetic shielding and method for producing the same
US11202398B2 (en) * 2017-09-28 2021-12-14 Murata Manufacturing Co., Ltd. Electromagnetic shielding material and method for producing the same
US11312631B2 (en) * 2017-09-28 2022-04-26 Murata Manufacturing Co., Ltd. Aligned film and method for producing the same
CN110972477A (zh) * 2018-12-28 2020-04-07 株式会社亚都玛科技 MXene粒子材料、MXene粒子材料的制造方法和二次电池
CN111312434B (zh) * 2020-02-27 2021-05-04 北京化工大学 基于金属纳米线的多层结构透明电磁屏蔽膜及其制备方法与应用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107058851A (zh) 2016-12-29 2017-08-18 上海大学 一种二维片层材料增强的金属基复合材料
US20200240000A1 (en) 2017-10-16 2020-07-30 Drexel University Mxene layers as substrates for growth of highly oriented perovskite thin films
US20200163261A1 (en) 2018-01-05 2020-05-21 Korea Institute Of Science And Technology Method for manufacturing electromagnetic interference shielding film
KR101966582B1 (ko) 2018-02-02 2019-04-05 성균관대학교산학협력단 2차원 맥세인 박막의 제조방법
CN110698847A (zh) 2019-10-21 2020-01-17 西北工业大学 水性聚氨酯-MXene电磁屏蔽仿生纳米复合材料膜及制备方法

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JPWO2022034853A1 (https=) 2022-02-17
CN116134978B (zh) 2025-10-21
CN116134978A (zh) 2023-05-16
WO2022034853A1 (ja) 2022-02-17
US20230217635A1 (en) 2023-07-06

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