JPWO2022034853A1 - - Google Patents
Info
- Publication number
- JPWO2022034853A1 JPWO2022034853A1 JP2022542831A JP2022542831A JPWO2022034853A1 JP WO2022034853 A1 JPWO2022034853 A1 JP WO2022034853A1 JP 2022542831 A JP2022542831 A JP 2022542831A JP 2022542831 A JP2022542831 A JP 2022542831A JP WO2022034853 A1 JPWO2022034853 A1 JP WO2022034853A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
- Conductive Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020136819 | 2020-08-13 | ||
| JP2020136819 | 2020-08-13 | ||
| PCT/JP2021/029151 WO2022034853A1 (ja) | 2020-08-13 | 2021-08-05 | 導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022034853A1 true JPWO2022034853A1 (https=) | 2022-02-17 |
| JPWO2022034853A5 JPWO2022034853A5 (https=) | 2023-04-19 |
| JP7480848B2 JP7480848B2 (ja) | 2024-05-10 |
Family
ID=80247888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022542831A Active JP7480848B2 (ja) | 2020-08-13 | 2021-08-05 | 導電性膜、粒子状物質、スラリーおよび導電性膜の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230217635A1 (https=) |
| JP (1) | JP7480848B2 (https=) |
| CN (1) | CN116134978B (https=) |
| WO (1) | WO2022034853A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119110976A (zh) * | 2022-05-16 | 2024-12-10 | 株式会社村田制作所 | 导电性二维粒子及其制造方法、导电性膜、导电性糊剂、以及导电性复合材料 |
| EP4535375A4 (en) * | 2022-06-01 | 2026-04-22 | Murata Manufacturing Co | ELECTRODE AND ELECTRODE MANUFACTURING METHOD |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107058851A (zh) * | 2016-12-29 | 2017-08-18 | 上海大学 | 一种二维片层材料增强的金属基复合材料 |
| KR101966582B1 (ko) * | 2018-02-02 | 2019-04-05 | 성균관대학교산학협력단 | 2차원 맥세인 박막의 제조방법 |
| CN110698847A (zh) * | 2019-10-21 | 2020-01-17 | 西北工业大学 | 水性聚氨酯-MXene电磁屏蔽仿生纳米复合材料膜及制备方法 |
| US20200163261A1 (en) * | 2018-01-05 | 2020-05-21 | Korea Institute Of Science And Technology | Method for manufacturing electromagnetic interference shielding film |
| US20200240000A1 (en) * | 2017-10-16 | 2020-07-30 | Drexel University | Mxene layers as substrates for growth of highly oriented perovskite thin films |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5145938B2 (ja) * | 2005-09-16 | 2013-02-20 | 大日本印刷株式会社 | 帯電防止防眩フィルム |
| JP5387034B2 (ja) * | 2009-02-20 | 2014-01-15 | 大日本印刷株式会社 | 導電性基板 |
| EP3197832B1 (en) * | 2014-09-25 | 2022-06-22 | Drexel University | Physical forms of mxene materials exhibiting novel electrical and optical characteristics |
| JP6460383B2 (ja) * | 2014-12-11 | 2019-01-30 | Dic株式会社 | 導電性積層体及びその製造方法 |
| JP2017191928A (ja) * | 2016-04-11 | 2017-10-19 | 株式会社リコー | 電気機械変換電子部品、液体吐出ヘッド、液体吐出ユニット及び液体を吐出する装置 |
| KR20200102535A (ko) * | 2016-04-22 | 2020-08-31 | 한국과학기술연구원 | Emi 차폐용 2차원 금속 탄화물, 질화물 및 탄질화물 필름 및 복합체 |
| US20180338396A1 (en) * | 2017-05-16 | 2018-11-22 | Murata Manufacturing Co., Ltd. | Electronic component having electromagnetic shielding and method for producing the same |
| US11202398B2 (en) * | 2017-09-28 | 2021-12-14 | Murata Manufacturing Co., Ltd. | Electromagnetic shielding material and method for producing the same |
| US11312631B2 (en) * | 2017-09-28 | 2022-04-26 | Murata Manufacturing Co., Ltd. | Aligned film and method for producing the same |
| CN110972477A (zh) * | 2018-12-28 | 2020-04-07 | 株式会社亚都玛科技 | MXene粒子材料、MXene粒子材料的制造方法和二次电池 |
| CN111312434B (zh) * | 2020-02-27 | 2021-05-04 | 北京化工大学 | 基于金属纳米线的多层结构透明电磁屏蔽膜及其制备方法与应用 |
-
2021
- 2021-08-05 WO PCT/JP2021/029151 patent/WO2022034853A1/ja not_active Ceased
- 2021-08-05 CN CN202180060354.3A patent/CN116134978B/zh active Active
- 2021-08-05 JP JP2022542831A patent/JP7480848B2/ja active Active
-
2023
- 2023-01-24 US US18/158,600 patent/US20230217635A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107058851A (zh) * | 2016-12-29 | 2017-08-18 | 上海大学 | 一种二维片层材料增强的金属基复合材料 |
| US20200240000A1 (en) * | 2017-10-16 | 2020-07-30 | Drexel University | Mxene layers as substrates for growth of highly oriented perovskite thin films |
| US20200163261A1 (en) * | 2018-01-05 | 2020-05-21 | Korea Institute Of Science And Technology | Method for manufacturing electromagnetic interference shielding film |
| KR101966582B1 (ko) * | 2018-02-02 | 2019-04-05 | 성균관대학교산학협력단 | 2차원 맥세인 박막의 제조방법 |
| CN110698847A (zh) * | 2019-10-21 | 2020-01-17 | 西北工业大学 | 水性聚氨酯-MXene电磁屏蔽仿生纳米复合材料膜及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7480848B2 (ja) | 2024-05-10 |
| CN116134978B (zh) | 2025-10-21 |
| CN116134978A (zh) | 2023-05-16 |
| WO2022034853A1 (ja) | 2022-02-17 |
| US20230217635A1 (en) | 2023-07-06 |
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