JP7469864B2 - 位置決め装置、露光装置、および物品の製造方法 - Google Patents
位置決め装置、露光装置、および物品の製造方法 Download PDFInfo
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- JP7469864B2 JP7469864B2 JP2019192133A JP2019192133A JP7469864B2 JP 7469864 B2 JP7469864 B2 JP 7469864B2 JP 2019192133 A JP2019192133 A JP 2019192133A JP 2019192133 A JP2019192133 A JP 2019192133A JP 7469864 B2 JP7469864 B2 JP 7469864B2
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- stage
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 10
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- 239000004065 semiconductor Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000007796 conventional method Methods 0.000 description 1
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- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019192133A JP7469864B2 (ja) | 2019-10-21 | 2019-10-21 | 位置決め装置、露光装置、および物品の製造方法 |
TW109134697A TWI811569B (zh) | 2019-10-21 | 2020-10-07 | 定位裝置、曝光裝置及物品之製造方法 |
KR1020200134888A KR20210047259A (ko) | 2019-10-21 | 2020-10-19 | 위치결정 장치, 노광 장치, 및 물품의 제조 방법 |
CN202011134936.5A CN112764319A (zh) | 2019-10-21 | 2020-10-21 | 定位装置、曝光装置以及物品的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019192133A JP7469864B2 (ja) | 2019-10-21 | 2019-10-21 | 位置決め装置、露光装置、および物品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021067775A JP2021067775A (ja) | 2021-04-30 |
JP7469864B2 true JP7469864B2 (ja) | 2024-04-17 |
Family
ID=75637210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019192133A Active JP7469864B2 (ja) | 2019-10-21 | 2019-10-21 | 位置決め装置、露光装置、および物品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7469864B2 (zh) |
KR (1) | KR20210047259A (zh) |
CN (1) | CN112764319A (zh) |
TW (1) | TWI811569B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241478A (ja) | 2003-02-04 | 2004-08-26 | Nikon Corp | 露光方法及びその装置、並びにデバイス製造方法 |
JP2009141190A (ja) | 2007-12-07 | 2009-06-25 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2010161116A (ja) | 2009-01-06 | 2010-07-22 | Canon Inc | 位置決め装置、それを用いた露光装置及びデバイスの製造方法 |
JP2012209401A (ja) | 2011-03-29 | 2012-10-25 | Canon Inc | 計測装置、リソグラフィ装置及びデバイスの製造方法。 |
JP2017111243A (ja) | 2015-12-15 | 2017-06-22 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、及び物品の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3089802B2 (ja) * | 1992-04-01 | 2000-09-18 | 株式会社ニコン | ステージの位置計測装置、投影露光装置及び投影露光方法 |
JPH1137895A (ja) * | 1997-07-17 | 1999-02-12 | Nikon Corp | 反射率測定センサの検査方法 |
JP2001160531A (ja) * | 1999-12-01 | 2001-06-12 | Canon Inc | ステージ装置 |
JP4125315B2 (ja) * | 2005-10-11 | 2008-07-30 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
JP5002613B2 (ja) * | 2009-03-31 | 2012-08-15 | 株式会社東芝 | Xyステージ装置 |
JP5679850B2 (ja) * | 2011-02-07 | 2015-03-04 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
NL2015639A (en) * | 2014-11-28 | 2016-09-20 | Asml Netherlands Bv | Encoder, position measurement system and lithographic apparatus. |
JP6916616B2 (ja) * | 2016-12-13 | 2021-08-11 | キヤノン株式会社 | リソグラフィ装置、物品の製造方法、および計測装置 |
-
2019
- 2019-10-21 JP JP2019192133A patent/JP7469864B2/ja active Active
-
2020
- 2020-10-07 TW TW109134697A patent/TWI811569B/zh active
- 2020-10-19 KR KR1020200134888A patent/KR20210047259A/ko active Search and Examination
- 2020-10-21 CN CN202011134936.5A patent/CN112764319A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241478A (ja) | 2003-02-04 | 2004-08-26 | Nikon Corp | 露光方法及びその装置、並びにデバイス製造方法 |
JP2009141190A (ja) | 2007-12-07 | 2009-06-25 | Nikon Corp | 露光装置、露光方法及びデバイス製造方法 |
JP2010161116A (ja) | 2009-01-06 | 2010-07-22 | Canon Inc | 位置決め装置、それを用いた露光装置及びデバイスの製造方法 |
JP2012209401A (ja) | 2011-03-29 | 2012-10-25 | Canon Inc | 計測装置、リソグラフィ装置及びデバイスの製造方法。 |
JP2017111243A (ja) | 2015-12-15 | 2017-06-22 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、及び物品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI811569B (zh) | 2023-08-11 |
TW202117465A (zh) | 2021-05-01 |
JP2021067775A (ja) | 2021-04-30 |
KR20210047259A (ko) | 2021-04-29 |
CN112764319A (zh) | 2021-05-07 |
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