JP7455343B1 - 熱伝導性組成物及び熱伝導性部材 - Google Patents

熱伝導性組成物及び熱伝導性部材 Download PDF

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Publication number
JP7455343B1
JP7455343B1 JP2023562694A JP2023562694A JP7455343B1 JP 7455343 B1 JP7455343 B1 JP 7455343B1 JP 2023562694 A JP2023562694 A JP 2023562694A JP 2023562694 A JP2023562694 A JP 2023562694A JP 7455343 B1 JP7455343 B1 JP 7455343B1
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thermally conductive
component
conductive composition
group
content
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JPWO2023243711A1 (https=
JPWO2023243711A5 (https=
Inventor
裕美 須田
達矢 岩本
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Sekisui Chemical Co Ltd
Sekisui Polymatech Co Ltd
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Sekisui Chemical Co Ltd
Sekisui Polymatech Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023562694A 2022-06-17 2023-06-16 熱伝導性組成物及び熱伝導性部材 Active JP7455343B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024033259A JP2024061766A (ja) 2022-06-17 2024-03-05 熱伝導性組成物及び熱伝導性部材

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022098435 2022-06-17
JP2022098435 2022-06-17
JP2022138189 2022-08-31
JP2022138189 2022-08-31
PCT/JP2023/022400 WO2023243711A1 (ja) 2022-06-17 2023-06-16 熱伝導性組成物及び熱伝導性部材

Related Child Applications (1)

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Publications (3)

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JPWO2023243711A1 JPWO2023243711A1 (https=) 2023-12-21
JP7455343B1 true JP7455343B1 (ja) 2024-03-26
JPWO2023243711A5 JPWO2023243711A5 (https=) 2024-05-28

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JP2023562694A Active JP7455343B1 (ja) 2022-06-17 2023-06-16 熱伝導性組成物及び熱伝導性部材
JP2023562693A Active JP7414246B1 (ja) 2022-06-17 2023-06-16 熱伝導性組成物及び熱伝導性部材
JP2023215131A Pending JP2024039036A (ja) 2022-06-17 2023-12-20 熱伝導性組成物及び熱伝導性部材
JP2024033259A Pending JP2024061766A (ja) 2022-06-17 2024-03-05 熱伝導性組成物及び熱伝導性部材

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JP2023215131A Pending JP2024039036A (ja) 2022-06-17 2023-12-20 熱伝導性組成物及び熱伝導性部材
JP2024033259A Pending JP2024061766A (ja) 2022-06-17 2024-03-05 熱伝導性組成物及び熱伝導性部材

Country Status (6)

Country Link
US (2) US20250376591A1 (https=)
EP (2) EP4541866A1 (https=)
JP (4) JP7455343B1 (https=)
KR (2) KR20250024921A (https=)
CN (2) CN119256062A (https=)
WO (2) WO2023243712A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008160126A (ja) * 2007-12-21 2008-07-10 Shin Etsu Chem Co Ltd 電子部品の冷却構造
JP2009256428A (ja) * 2008-04-15 2009-11-05 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置
JP2016513151A (ja) * 2013-02-11 2016-05-12 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 官能基密集型ポリオルガノシロキサン及びシリコーン反応性希釈剤を含む硬化性シリコーン組成物
WO2019021826A1 (ja) * 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
WO2020080256A1 (ja) * 2018-10-15 2020-04-23 デンカ株式会社 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
WO2022075434A1 (ja) * 2020-10-09 2022-04-14 ダウ・東レ株式会社 熱伝導性シリコーン組成物および熱伝導性部材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079792U (ja) 1983-11-09 1985-06-03 株式会社日立製作所 回路基板取付装置
JP6932872B1 (ja) 2020-01-06 2021-09-08 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008160126A (ja) * 2007-12-21 2008-07-10 Shin Etsu Chem Co Ltd 電子部品の冷却構造
JP2009256428A (ja) * 2008-04-15 2009-11-05 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置
JP2016513151A (ja) * 2013-02-11 2016-05-12 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 官能基密集型ポリオルガノシロキサン及びシリコーン反応性希釈剤を含む硬化性シリコーン組成物
WO2019021826A1 (ja) * 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
WO2020080256A1 (ja) * 2018-10-15 2020-04-23 デンカ株式会社 二液硬化型組成物セット、熱伝導性硬化物及び電子機器
WO2022075434A1 (ja) * 2020-10-09 2022-04-14 ダウ・東レ株式会社 熱伝導性シリコーン組成物および熱伝導性部材

Also Published As

Publication number Publication date
KR20250024921A (ko) 2025-02-20
EP4541866A1 (en) 2025-04-23
EP4541867A1 (en) 2025-04-23
WO2023243712A1 (ja) 2023-12-21
CN119256062A (zh) 2025-01-03
CN119343425A (zh) 2025-01-21
JP2024039036A (ja) 2024-03-21
JP7414246B1 (ja) 2024-01-16
JPWO2023243711A1 (https=) 2023-12-21
JP2024061766A (ja) 2024-05-08
US20250376591A1 (en) 2025-12-11
US20250304790A1 (en) 2025-10-02
KR20250024751A (ko) 2025-02-19
JPWO2023243712A1 (https=) 2023-12-21
WO2023243711A1 (ja) 2023-12-21

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