CN119256062A - 导热性组合物及导热性构件 - Google Patents
导热性组合物及导热性构件 Download PDFInfo
- Publication number
- CN119256062A CN119256062A CN202380040751.3A CN202380040751A CN119256062A CN 119256062 A CN119256062 A CN 119256062A CN 202380040751 A CN202380040751 A CN 202380040751A CN 119256062 A CN119256062 A CN 119256062A
- Authority
- CN
- China
- Prior art keywords
- component
- agent
- thermally conductive
- conductive composition
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2314/00—Polymer mixtures characterised by way of preparation
- C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022098435 | 2022-06-17 | ||
| JP2022-098435 | 2022-06-17 | ||
| JP2022-138189 | 2022-08-31 | ||
| JP2022138189 | 2022-08-31 | ||
| PCT/JP2023/022402 WO2023243712A1 (ja) | 2022-06-17 | 2023-06-16 | 熱伝導性組成物及び熱伝導性部材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119256062A true CN119256062A (zh) | 2025-01-03 |
Family
ID=89191462
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380040751.3A Pending CN119256062A (zh) | 2022-06-17 | 2023-06-16 | 导热性组合物及导热性构件 |
| CN202380046100.5A Pending CN119343425A (zh) | 2022-06-17 | 2023-06-16 | 导热性组合物和导热性部件 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380046100.5A Pending CN119343425A (zh) | 2022-06-17 | 2023-06-16 | 导热性组合物和导热性部件 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20250376591A1 (https=) |
| EP (2) | EP4541866A1 (https=) |
| JP (4) | JP7455343B1 (https=) |
| KR (2) | KR20250024921A (https=) |
| CN (2) | CN119256062A (https=) |
| WO (2) | WO2023243712A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6079792U (ja) | 1983-11-09 | 1985-06-03 | 株式会社日立製作所 | 回路基板取付装置 |
| JP2008160126A (ja) * | 2007-12-21 | 2008-07-10 | Shin Etsu Chem Co Ltd | 電子部品の冷却構造 |
| JP5093488B2 (ja) * | 2008-04-15 | 2012-12-12 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置 |
| CN104968751B (zh) * | 2013-02-11 | 2017-04-19 | 道康宁公司 | 包含簇合官能化聚有机硅氧烷和有机硅反应性稀释剂的可固化有机硅组合物 |
| WO2019021826A1 (ja) * | 2017-07-24 | 2019-01-31 | 東レ・ダウコーニング株式会社 | 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体 |
| JP6727471B1 (ja) * | 2018-10-15 | 2020-07-22 | デンカ株式会社 | 二液硬化型組成物セット、熱伝導性硬化物及び電子機器 |
| JP6932872B1 (ja) | 2020-01-06 | 2021-09-08 | 富士高分子工業株式会社 | 熱伝導性シリコーンゲル組成物 |
| TWI894350B (zh) * | 2020-10-09 | 2025-08-21 | 日商陶氏東麗股份有限公司 | 導熱性矽組成物及導熱性構件 |
-
2023
- 2023-06-16 US US18/874,341 patent/US20250376591A1/en active Pending
- 2023-06-16 US US18/866,263 patent/US20250304790A1/en active Pending
- 2023-06-16 EP EP23824001.4A patent/EP4541866A1/en active Pending
- 2023-06-16 CN CN202380040751.3A patent/CN119256062A/zh active Pending
- 2023-06-16 CN CN202380046100.5A patent/CN119343425A/zh active Pending
- 2023-06-16 WO PCT/JP2023/022402 patent/WO2023243712A1/ja not_active Ceased
- 2023-06-16 WO PCT/JP2023/022400 patent/WO2023243711A1/ja not_active Ceased
- 2023-06-16 JP JP2023562694A patent/JP7455343B1/ja active Active
- 2023-06-16 KR KR1020247040925A patent/KR20250024921A/ko active Pending
- 2023-06-16 KR KR1020247037522A patent/KR20250024751A/ko active Pending
- 2023-06-16 EP EP23824002.2A patent/EP4541867A1/en active Pending
- 2023-06-16 JP JP2023562693A patent/JP7414246B1/ja active Active
- 2023-12-20 JP JP2023215131A patent/JP2024039036A/ja active Pending
-
2024
- 2024-03-05 JP JP2024033259A patent/JP2024061766A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250024921A (ko) | 2025-02-20 |
| EP4541866A1 (en) | 2025-04-23 |
| EP4541867A1 (en) | 2025-04-23 |
| WO2023243712A1 (ja) | 2023-12-21 |
| CN119343425A (zh) | 2025-01-21 |
| JP2024039036A (ja) | 2024-03-21 |
| JP7414246B1 (ja) | 2024-01-16 |
| JPWO2023243711A1 (https=) | 2023-12-21 |
| JP7455343B1 (ja) | 2024-03-26 |
| JP2024061766A (ja) | 2024-05-08 |
| US20250376591A1 (en) | 2025-12-11 |
| US20250304790A1 (en) | 2025-10-02 |
| KR20250024751A (ko) | 2025-02-19 |
| JPWO2023243712A1 (https=) | 2023-12-21 |
| WO2023243711A1 (ja) | 2023-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |