JP7454988B2 - 蒸着マスクの製造装置および製造方法 - Google Patents
蒸着マスクの製造装置および製造方法 Download PDFInfo
- Publication number
- JP7454988B2 JP7454988B2 JP2020065787A JP2020065787A JP7454988B2 JP 7454988 B2 JP7454988 B2 JP 7454988B2 JP 2020065787 A JP2020065787 A JP 2020065787A JP 2020065787 A JP2020065787 A JP 2020065787A JP 7454988 B2 JP7454988 B2 JP 7454988B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- metal layer
- deposition mask
- roller
- rotating roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007740 vapor deposition Methods 0.000 title claims description 101
- 238000004519 manufacturing process Methods 0.000 title claims description 63
- 239000002184 metal Substances 0.000 claims description 128
- 229910052751 metal Inorganic materials 0.000 claims description 128
- 238000000034 method Methods 0.000 claims description 36
- 238000003825 pressing Methods 0.000 claims description 34
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 19
- 238000004804 winding Methods 0.000 claims description 7
- 230000009191 jumping Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 188
- 238000007747 plating Methods 0.000 description 61
- 239000010408 film Substances 0.000 description 32
- 239000000758 substrate Substances 0.000 description 25
- 239000000463 material Substances 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000005323 electroforming Methods 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 229910000975 Carbon steel Inorganic materials 0.000 description 5
- 239000010962 carbon steel Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000012808 vapor phase Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020065787A JP7454988B2 (ja) | 2020-04-01 | 2020-04-01 | 蒸着マスクの製造装置および製造方法 |
| CN202110344384.9A CN113493894B (zh) | 2020-04-01 | 2021-03-30 | 蒸镀掩膜的制造装置以及制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020065787A JP7454988B2 (ja) | 2020-04-01 | 2020-04-01 | 蒸着マスクの製造装置および製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021161510A JP2021161510A (ja) | 2021-10-11 |
| JP7454988B2 true JP7454988B2 (ja) | 2024-03-25 |
Family
ID=77997475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020065787A Active JP7454988B2 (ja) | 2020-04-01 | 2020-04-01 | 蒸着マスクの製造装置および製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7454988B2 (zh) |
| CN (1) | CN113493894B (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005105328A (ja) | 2003-09-30 | 2005-04-21 | Canon Inc | マスク構造体の製造方法およびマスク構造体ならびに蒸着装置 |
| JP2005175253A (ja) | 2003-12-12 | 2005-06-30 | Nitto Denko Corp | 保護テープ剥離方法およびこれを用いた装置 |
| JP2009052073A (ja) | 2007-08-24 | 2009-03-12 | Dainippon Printing Co Ltd | 蒸着マスク付シート、蒸着マスク装置の製造方法、および、蒸着マスク付シートの製造方法 |
| JP2019117926A (ja) | 2017-12-27 | 2019-07-18 | キヤノントッキ株式会社 | 静電チャック、成膜装置、基板吸着方法、基板剥離方法、成膜方法、及び電子デバイスの製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4720315A (en) * | 1984-02-03 | 1988-01-19 | Transfer Print Foils, Inc. | Method for preparing a selectively decorated resin film |
| JPS61147869A (ja) * | 1984-12-22 | 1986-07-05 | Dainippon Printing Co Ltd | 部分金属蒸着層形成方法 |
| JPH0230748A (ja) * | 1988-07-20 | 1990-02-01 | Matsushita Electric Ind Co Ltd | 微細パターン形成方法 |
| US5156720A (en) * | 1989-02-02 | 1992-10-20 | Alcan International Limited | Process for producing released vapor deposited films and product produced thereby |
| DE19933230C2 (de) * | 1999-04-15 | 2002-06-13 | Fraunhofer Ges Forschung | Release-Schicht, Verfahren zu ihrer Herstellung sowie Verwendung |
| JP5914036B2 (ja) * | 2011-04-20 | 2016-05-11 | 日東電工株式会社 | 導電性積層フィルムの製造方法 |
| JP6722512B2 (ja) * | 2016-05-23 | 2020-07-15 | マクセルホールディングス株式会社 | 蒸着マスクおよびその製造方法 |
| CN113463017A (zh) * | 2016-09-30 | 2021-10-01 | 大日本印刷株式会社 | 框架一体式的蒸镀掩模及其制备体和制造方法、蒸镀图案形成方法 |
| KR102333411B1 (ko) * | 2017-01-10 | 2021-12-02 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크, 증착 마스크 장치의 제조 방법 및 증착 마스크의 제조 방법 |
| JP2019094528A (ja) * | 2017-11-21 | 2019-06-20 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの製造方法、及び表示装置の製造方法 |
| CN108486616B (zh) * | 2018-03-13 | 2020-05-05 | 阿德文泰克全球有限公司 | 金属荫罩及其制备方法 |
-
2020
- 2020-04-01 JP JP2020065787A patent/JP7454988B2/ja active Active
-
2021
- 2021-03-30 CN CN202110344384.9A patent/CN113493894B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005105328A (ja) | 2003-09-30 | 2005-04-21 | Canon Inc | マスク構造体の製造方法およびマスク構造体ならびに蒸着装置 |
| JP2005175253A (ja) | 2003-12-12 | 2005-06-30 | Nitto Denko Corp | 保護テープ剥離方法およびこれを用いた装置 |
| JP2009052073A (ja) | 2007-08-24 | 2009-03-12 | Dainippon Printing Co Ltd | 蒸着マスク付シート、蒸着マスク装置の製造方法、および、蒸着マスク付シートの製造方法 |
| JP2019117926A (ja) | 2017-12-27 | 2019-07-18 | キヤノントッキ株式会社 | 静電チャック、成膜装置、基板吸着方法、基板剥離方法、成膜方法、及び電子デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113493894B (zh) | 2023-12-01 |
| CN113493894A (zh) | 2021-10-12 |
| JP2021161510A (ja) | 2021-10-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060126050A1 (en) | Substrate holding device, substrate holding method and substrate heating device | |
| WO2017032247A1 (zh) | 一种蒸镀用磁性掩模板的制作方法 | |
| KR102109071B1 (ko) | 성막 마스크 | |
| TWI678422B (zh) | 附框架蒸鍍遮罩之製造方法、拉張裝置、有機半導體元件之製造裝置及有機半導體元件之製造方法 | |
| JP6368075B2 (ja) | モールド | |
| JPWO2019009050A1 (ja) | 蒸着マスク、蒸着マスク装置、蒸着マスクの製造方法及び蒸着マスク装置の製造方法 | |
| TWI825149B (zh) | 框架一體型遮罩的製造方法及框架 | |
| TWI591424B (zh) | 蒸鍍用複合磁性掩模板的製作方法 | |
| JP7454988B2 (ja) | 蒸着マスクの製造装置および製造方法 | |
| TWI731481B (zh) | 框架一體型掩模的製造裝置 | |
| TWI432118B (zh) | A mask and a method for manufacturing the substrate using the mask, and a ball mounting device | |
| JP2011214051A (ja) | 蒸着用メタルマスク及び蒸着装置 | |
| JP2021161522A (ja) | 蒸着マスク、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌ表示装置の製造方法及び蒸着方法 | |
| TWI810381B (zh) | 遮罩支撐模板及其製造方法與框架一體型遮罩的製造方法 | |
| KR102011723B1 (ko) | 프레임 일체형 마스크의 제조 장치 | |
| JP2006152339A (ja) | 蒸着用マスク構造体の製造方法 | |
| JP7445449B2 (ja) | 蒸着マスクの製造方法および製造装置 | |
| KR102667660B1 (ko) | 증착 마스크 및 증착 마스크의 제조 방법 | |
| KR102716368B1 (ko) | 프레임 일체형 마스크의 제조 방법 및 프레임 일체형 마스크 | |
| TWI810497B (zh) | 掩模支撐模板的製造方法及框架一體型掩模的製造方法 | |
| US20230220534A1 (en) | Mask-integrated frame and method of manufacturing the same | |
| JP2022047909A (ja) | 蒸着マスク装置、蒸着マスク装置用の支持体、蒸着マスク装置の製造方法、有機半導体素子の製造方法、有機ｅｌ表示装置の製造方法及び蒸着方法 | |
| JPH04158511A (ja) | 熱処理装置 | |
| JP2004337744A (ja) | ステージ装置、それを用いたペースト塗布装置、及びペースト塗布方法 | |
| KR20200098297A (ko) | 프레임 일체형 마스크의 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230329 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20231110 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231114 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240112 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240220 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240312 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7454988 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |