JP7454988B2 - Vapor deposition mask manufacturing device and manufacturing method - Google Patents

Description

The present invention relates to an apparatus and method for manufacturing a vapor deposition mask. In particular, the present invention relates to an apparatus and method for manufacturing a vapor deposition mask that includes a mask frame and a thin film-like mask body.

Examples of flat panel display devices include liquid crystal display devices and organic EL (electroluminescence) display devices. These display devices are structures in which thin films containing various materials such as insulators, semiconductors, and conductors are laminated on a substrate. By appropriately patterning and connecting these thin films, a function as a display device is realized.

Methods for forming thin films are broadly classified into gas phase methods, liquid phase methods, and solid phase methods. Gas phase methods are classified into physical vapor phase methods and chemical vapor phase methods. A vapor deposition method is known as a typical example of a physical vapor phase method. The simplest vapor deposition method is the vacuum vapor deposition method. The vacuum evaporation method sublimates or evaporates the material by heating the material under high vacuum to generate vapor of the material (hereinafter, these are generally referred to as vaporization). In a region for depositing this material (hereinafter referred to as a vapor deposition region), the vaporized material is solidified and deposited to obtain a thin film of the material. Vacuum deposition is performed using a mask (deposition mask) so that a thin film is selectively formed in the deposition area and no material is deposited in other areas (hereinafter referred to as non-deposition areas). (See Patent Documents 1 and 2).

JP2009-87840A JP2013-209710A

In a vapor deposition mask, a mask frame for fixing the mask body is joined to a mask body on which a vapor deposition pattern is formed. The mask body is formed on the metal layer by plating, but it is necessary to peel the metal layer from the mask body after joining the mask body and the mask frame. Peeling of the metal layer is often performed manually by workers, and the quality of vapor deposition masks varies depending on the skill level of the workers. Specifically, uneven peeling of the metal layer causes distortion in the thin film mask body, causing a problem in which the position of the vapor deposition pattern on the vapor deposition mask shifts. Furthermore, although the working time differs depending on the operator, manual peeling of the metal layer has the problem that the working time is relatively long.

In view of the above problems, one of the objects of the present invention is to provide an apparatus for manufacturing a vapor deposition mask with stable quality. Another challenge is to improve the work efficiency of workers.

A vapor deposition mask manufacturing apparatus according to an embodiment of the present invention includes a stage for installing a structure provided with a vapor deposition mask and a metal layer in contact with the vapor deposition mask, and a stage for installing a structure provided with a vapor deposition mask and a metal layer in contact with the vapor deposition mask; Including a rotating roller to take off.

A method for manufacturing a vapor deposition mask according to an embodiment of the present invention includes a structure in which a vapor deposition mask and a metal layer are provided in contact with the vapor deposition mask. The method includes peeling off the metal layer from the deposition mask by moving the metal layer in a first direction substantially parallel to one side of the body.

FIG. 1 is a plan view of a vapor deposition mask according to an embodiment of the present invention. FIG. 1 is a cross-sectional view of a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. 1 is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention. FIG. 1 is a schematic top view of a deposition mask manufacturing apparatus according to an embodiment of the present invention. FIG. 1 is a schematic cross-sectional top view of a vapor deposition mask manufacturing apparatus according to an embodiment of the present invention. FIG. 1 is a schematic cross-sectional view showing how the vapor deposition mask manufacturing apparatus according to one embodiment of the present invention is used. FIG. 1 is a schematic cross-sectional view showing how the vapor deposition mask manufacturing apparatus according to one embodiment of the present invention is used.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings and the like. However, the present invention can be implemented in various forms without departing from the scope thereof, and should not be construed as being limited to the contents described in the embodiments exemplified below.

In order to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual aspect. However, the examples shown in the drawings are merely examples and do not limit the interpretation of the present invention. In this specification and each figure, the same reference numerals are given to the same components as those described above with respect to the already-existed figures, and detailed explanations may be omitted as appropriate.

In the present invention, when a plurality of films are formed by etching or irradiating one film with light, these films may have different functions and roles. However, these multiple films originate from films formed as the same layer in the same process, and have the same layer structure and the same material. Therefore, these multiple films are defined as existing in the same layer.

In this specification and the claims, when expressing an aspect in which a structure is arranged on top of another structure, the term "on" simply refers to the structure of a structure unless otherwise specified. There are two cases: when another structure is placed directly above a structure so as to be in contact with the body, and when another structure is placed above a structure via another structure. It is defined as including both.

<First embodiment>
The configuration of a deposition mask 10 according to an embodiment of the present invention will be described with reference to FIGS. 1A and 1B.

FIG. 1A is a plan view of a deposition mask 10 according to an embodiment of the present invention. Moreover, FIG. 1B is a cross-sectional view of the vapor deposition mask 10 according to one embodiment of the present invention. Specifically, FIG. 1B is a cross-sectional view of the vapor deposition mask 10 taken along the line A-A' shown in FIG.

Vapor deposition mask 10 includes a mask body 110, a mask frame 120, and a connecting member 130. The mask body 110 is connected to the mask frame 120 via a connecting member 130.

The mask frame 120 has an opening, and the mask body 110 is provided so as to overlap the opening of the mask frame 120. In FIG. 1A, the mask frame 120 has 12 openings, and the mask body 110 is provided so as to overlap each opening. Note that the number of openings provided in the mask frame 120 is not limited to this. The number of openings provided in the mask frame 120 can be determined as appropriate depending on the size of the substrate to be deposited and the deposition pattern.

The mask body 110 is provided with a plurality of openings 113 passing through the mask body 110. In the following description, for convenience, a region where the opening 113 is provided in the mask body 110 will be referred to as an open region 111, and a region where the opening 113 is not provided in the mask body will be referred to as a non-opening region 112. Although the boundary between the open area 111 and the non-open area 112 is not necessarily clear, they can be distinguished at least in that the non-open area 112 is not provided with an opening 113.

At the time of vapor deposition, the vapor deposition mask 10 and the vapor deposition target substrate are aligned so that the vapor deposition region and the opening region 111 on the vapor deposition target substrate overlap, and the non-evaporation region and the non-opening region 112 on the vapor deposition target substrate overlap. The vapor of the evaporation material passes through the opening 113 of the opening region 111, and the evaporation material is deposited on the evaporation region of the substrate to be evaporated.

When the substrate to be deposited is a substrate of a display device, the openings 113 of the opening region 111 can be arranged in correspondence with the arrangement of pixels of the display device. The arrangement of the openings 113 is, for example, in a matrix.

Mask frame 120 can support mask body 110. As described above, the mask frame 120 includes the opening, but in other words, the mask frame 120 can also be said to include a frame located on the outside and a crosspiece located on the inside. The crosspiece provides rigidity to the frame and can prevent the frame from warping. The crosspiece may be configured by combining a plurality of members. For example, one member of the crosspiece extends from one side of the frame toward the other opposing side. Moreover, it is preferable that the members of the crosspiece are provided in the vertical direction (the short side direction of the vapor deposition mask 10) and the horizontal direction (the long side direction of the vapor deposition mask 10). That is, it is preferable that the crosspiece has a parallel cross structure in which a member extending in the vertical direction and a member extending in the horizontal direction intersect. However, the structure of the crosspiece is not limited to this. The members of the crosspiece may be provided only in the vertical direction or in the horizontal direction. Further, the width of the frame portion and the width of the crosspiece (or the member of the crosspiece) can be appropriately determined according to the size of the vapor deposition mask 10. Note that in order to make the area of the vapor deposition pattern as wide as possible, it is preferable that the width of the crosspiece is smaller than the width of the frame.

As shown in FIG. 1B, the connection member 130 is provided in the gap between the opening of the mask body 110 and the mask frame 120, and contacts the side surface of the mask body 110 and the side surface of the opening of the mask frame 120. That is, in plan view, the mask main body 110 and the mask frame 120 do not overlap. In addition, in plan view, the mask main body 110 and the mask frame 120 can also overlap.

Since the connecting member 130 only needs to connect the mask main body 110 and the mask frame 120, the connecting member 130 does not need to be provided on the entire side surface of the opening of the mask frame 120. The connecting member 130 may be provided on at least a portion of the side surface of the opening of the mask frame 120. On the other hand, the thickness of the mask body 110 is much smaller than the thickness of the mask frame. For example, the thickness of the mask body 110 is 1 μm or more and 20 μm or less, and the thickness of the mask frame 120 is 10 μm or more and 2000 μm or less. Therefore, in order to increase the adhesive strength between the mask body 110 and the mask frame 120, the connecting member 130 is preferably provided on the entire side surface of the mask body 110.

Further, the connecting member 130 may be formed in a stepped shape between the mask main body 110 and the mask frame 120.

A groove 140 is provided between the connecting members 130 in a region where the mask main body 110 is not provided, that is, in a region overlapping with the crosspiece of the mask frame 120. In other words, it can be said that the side surfaces of the groove 140 are formed by the connecting member 130 and the bottom surface of the groove 140 is formed by the mask frame 120.

In the region overlapping with the frame of the mask frame 120, one side is formed by the connecting member 130 and the other side is open, so in strict structural terms it can be said that it is not a groove. However, the formation of the protrusion 141 is similar to that of the groove portion 140 described above. Therefore, for the sake of convenience, in the following, the protrusion 141 formed in the region overlapping with the frame of the mask frame 120 may be described as being formed in the groove portion 140.

The method for forming the mask body 110 will be described later, but since the vapor deposition mask 10 can uniformly peel off the metal layer from the mask body formed by plating, misalignment of the vapor deposition pattern of the mask body 110 is suppressed. ing.

As described above, according to the vapor deposition mask 10 according to the present embodiment, the mask main body 110 and the mask frame 120 are connected via the connecting member 130. Further, since the metal layer is uniformly peeled off from the mask body 110, misalignment of the vapor deposition pattern of the vapor deposition mask 10 is suppressed. Therefore, the quality of products deposited using the deposition mask 10 is stabilized.

<Second embodiment>
A method for manufacturing a vapor deposition mask 10 according to an embodiment of the present invention will be described with reference to FIGS. 2A to 2H.

2A to 2G are cross-sectional views illustrating a method of manufacturing a vapor deposition mask 10 according to an embodiment of the present invention.

First, as shown in FIG. 2A, a metal layer 220 is formed on a support substrate 210, and a photoresist layer 230 having a predetermined pattern is formed on the metal layer 220.

The support substrate 210 is a substrate that supports each layer during the manufacturing process of the vapor deposition mask 10. Therefore, it is preferable that the support substrate 210 is a rigid substrate. Moreover, it is preferable that the vapor deposition mask 10 has a small coefficient of thermal expansion. In the manufacturing process of the vapor deposition mask 10, the support substrate 210 is heated. When the support substrate 210 expands or contracts due to the heat treatment, the vapor deposition pattern of the vapor deposition mask 10 will be misaligned. Therefore, in order to stabilize the manufacturing process of the vapor deposition mask 10, the support substrate 210 is preferably a rigid substrate with a small coefficient of thermal expansion. Examples of the material of the support substrate 210 include stainless steel (such as SUS304 or SUS430), 42 alloy, Invar, Super Invar, or stainless Invar.

The metal layer 220 can function as a base metal for electroforming (or electrolytic plating), which will be described later. The material of the metal layer 220 is, for example, nickel (Ni) or a nickel alloy. Metal layer 220 can be formed by sputtering or the like.

The vapor deposition mask 10 can also be manufactured using electroless plating instead of electroforming. In this case, an insulating layer can be used instead of the metal layer 220.

The photoresist layer 230 can function as a matrix for electroforming, which will be described later. As an example, the photoresist layer 230 is formed by placing one or more photosensitive dry film resists on the metal layer 220 so as to have a predetermined thickness, and by thermocompression bonding. The photosensitive dry film resist may be either positive type or negative type. Note that, in the following description, it is assumed that the photosensitive dry film is a negative type.

The photoresist layer 230 has a predetermined pattern in which the deposition pattern of the deposition mask 10 is formed. The predetermined pattern of the photoresist layer 230 can be formed by photolithography. That is, a predetermined pattern can be formed by bringing a mask into close contact with a dry film resist, exposing the dry film to ultraviolet rays, and dissolving and removing the unexposed portions.

Although not shown, a release agent may be applied between the support substrate 210 and the metal layer 220 or between the metal layer 220 and the photoresist layer 230 to form a release layer. By forming the release layer, the supporting substrate 210 and the metal layer 220, or the metal layer 220 and the first plating layer 240 described later, can be easily peeled off.

Next, as shown in FIG. 2B, a first plating layer 240 is formed using the photoresist layer 230 as a mask. The first plating layer 240 corresponds to the mask body 110 of the deposition mask 10. The first plating layer 240 can be formed by electroforming. Specifically, the metal layer 220 and the photoresist layer 230 are placed in an electroforming bath prepared under predetermined conditions, and the metal layer 220 is heated from the surface of the metal layer 220 not covered by the photoresist layer 230 to the height of the photoresist layer 230. Form metal plating. The material of the first plating layer 240 is, for example, nickel (Ni) or a nickel (Ni)-cobalt (Co) alloy.

Next, as shown in FIG. 2C, the photoresist layer 230 is stripped (removed). The photoresist layer 230 can be removed using, for example, an amine-based remover. By peeling off the photoresist layer 230, a first plating layer 240 having a deposition pattern is formed.

Note that before peeling off the photoresist layer 230, the first plating layer 240 formed by electroforming may be polished. By polishing the first plating layer 240, the surface of the first plating layer 240 can be flattened.

Next, as shown in FIG. 2D, a mask frame 260 provided with an adhesive layer 250 is placed on the first plating layer 240. That is, the first plating layer 240 and the mask frame 260 are bonded to each other via the adhesive layer 250. Note that in this step, it is not necessary to completely adhere the first plating layer 240 and the mask frame 260. Therefore, the adhesive layer 250 does not need to be completely cured.

Mask frame 260 has an opening. The mask frame 260 is aligned and bonded so as not to overlap the opening of the deposition pattern of the first plating layer 240 . In other words, the openings of the mask frame 260 overlap the openings of the deposition pattern of the first plating layer 240.

The adhesive layer 250 is preferably made of a material that is easy to remove, since it will be removed in a later process. Examples of the material that can be used for the adhesive layer 250 include vinyl acetate resin, ethylene vinyl acetate resin, epoxy resin, cyanoacrylate resin, and acrylic resin. Dry film resist can also be used for the material of the adhesive layer 250. When dry film resist is used as the material for the adhesive layer 250, the dry film resist may be weakly exposed to light so that weak adhesion remains on its surface. By exposing the dry film resist to light, it becomes easier to remove the dry film resist in a later process.

In addition, in the subsequent process, in order to protect the vapor deposition pattern of the first plating layer 240 (for example, to protect the opening of the vapor deposition pattern from being blocked by particles generated in the process), the first plating layer 240 is A dry film resist may be provided in the area of the vapor deposition pattern.

Next, as shown in FIG. 2E, a film 280 is placed above the mask frame 260 so as to cover the support substrate 210, the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260. Subsequently, the air between the support substrate 210 and the film 280 is evacuated (evacuated) to lower the pressure below the film 280. Due to the pressure difference between the upper side and the lower side of the film 280, the film 280 is attracted to the support substrate 210 side. When the pressure on the lower side of the film 280 is further reduced, the film 280 presses against the mask frame 260. Under pressure from the film 280, the mask frame 260 is more strongly adhered to the first plating layer 240 via the adhesive layer 250. This process is a so-called vacuum compression bonding process.

The degree of vacuum on the lower side of the film 280 is -50 kPa or less, preferably -70 kPa or less, and more preferably -90 kPa in gauge pressure with atmospheric pressure being 0 kPa.

After the vacuum pressure bonding, the film 280 is removed.

Next, as shown in FIG. 2F, a second plating layer 290 connecting the first plating layer 240 and the mask frame 260 is formed. The second plating layer 290 can be formed by electroforming that applies electricity to the metal layer 220 or the first plating layer 240. The second plating layer 290 corresponds to the connection member 130 of the vapor deposition mask 10. The second plating layer 290 is in contact with the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260. Specifically, the second plating layer 290 is formed so as to be in contact with a part of the groove of the first plating layer 240 and the side surface of the mask frame 260 (the side surface of the frame and the crosspiece of the vapor deposition mask 10).

The second plating layer 290 can be formed using the same method as the first plating layer 240.

The second plating layer 290 is not provided in the region corresponding to the opening region 111 of the first plating layer 240. For example, a dry film resist may be formed on the area corresponding to the opening area 111 of the first plating layer 240 to prevent the area corresponding to the opening area 111 of the first plating layer 240 from being plated. The dry film resist can be peeled off after forming the second plating layer 290.

Next, as shown in FIG. 2G, the support substrate 210 is peeled off from the metal layer 220.

Next, as shown in FIG. 2H, the metal layer 220 and the adhesive layer 250 are peeled off to form the mask body 110, the mask frame 120, and the connection member 130. By peeling off the adhesive layer 250, a part of the first plating layer 240 that was adhered to the adhesive layer 250 (the area in the first plating layer 240 that overlaps with the mask frame 260) is also peeled off, and the groove portion 140 is formed. Ru. Further, the side and bottom surfaces of the groove portion 140 are respectively constituted by the second plating layer 290 and the mask frame 260. That is, as shown in FIG. 2H, the mask body 110 is not provided below the mask frame 120, and the groove portion 140 is formed.

The method for peeling off the metal layer 220 from the first plating layer 240 will be explained in conjunction with the configuration of the manufacturing apparatus described below. The positional shift of the vapor deposition pattern 110 is suppressed.

As described above, according to the method for manufacturing the vapor deposition mask 10 according to the present embodiment, the metal layer 220 is uniformly peeled off from the first plating layer 240, so that misalignment of the vapor deposition pattern of the vapor deposition mask 10 is suppressed. Therefore, the quality of the vapor deposition mask 10 is stabilized. Furthermore, the quality of products deposited using the deposition mask 10 is also stable.

<Third embodiment>
With reference to FIGS. 3A to 3C, a configuration of an apparatus 20 for manufacturing a vapor deposition mask 10 according to an embodiment of the present invention will be described.

3A and 3B are a schematic top view and a schematic cross-sectional view, respectively, of a manufacturing apparatus 20 for a vapor deposition mask 10 according to an embodiment of the present invention. Specifically, FIGS. 3A and 3B are schematic diagrams of an apparatus for peeling the metal layer 220 from the first plating layer 240 described in the second embodiment. Note that FIG. 3B is a schematic cross-sectional view of the manufacturing apparatus 20 taken along the line B-B' shown in FIG. 3A. Moreover, FIG. 3C is a cross-sectional schematic diagram showing how the manufacturing apparatus 20 for the vapor deposition mask 10 according to one embodiment of the present invention is used.

As shown in FIGS. 3A and 3B, the manufacturing apparatus 20 includes a stage 310, a rotating roller 320, a press roller 330, a first fixed roller 340, a second fixed roller 350, and a sensor 360. The rotating roller 320, the pressing roller 330, the first fixed roller 340, the second fixed roller 350, and the sensor 360 are installed on the stage 310. The first fixed roller 340 is installed near the rotating roller 320, and the second fixed roller 350 is installed near the pressing roller 330. In addition, in FIG. 3B and FIG. 3C described later, the positional relationships of the rotating roller 320, the press roller 330, the first fixed roller 340, the second fixed roller 350, and the sensor 360 are described so that the respective positional relationships can be understood. Each support member is omitted.

Further, as shown in FIG. 3C, in the manufacturing apparatus 20, the metal layer 220 is peeled off from the first plating layer 240 of the structure 30, and the peeled metal layer 220 is held down by a pressing roller 330 near the peeled area, and rotated. The peeled metal layer 220 is wound up by the roller 320. Further, the rotating roller 320 and the pressing roller 330 peel off the metal layer 220 while moving in a first direction substantially parallel to one side of the stage 310.

The stage 310 can install a structure 30 in which a first plating layer 240, a mask frame 260, and a second plating layer 290 connecting the first plating layer 240 and the mask frame 260 are formed on the metal layer 220. can. As shown in FIG. 3C, the structure 30 is placed on the stage 310 with the metal layer 220 facing upward. Therefore, the upper surface of the stage 310 is preferably flat.

The stage 310 can fix the structure 30. The stage 310 can fix the position of the structure 30 by pressing a fixing pin against the side surface of the structure 30. In this case, the fixing pin may be provided on the stage 310 or may be provided on a location other than the stage 310. The stage 310 may fix the structure 30 by vacuum suction. In this case, the stage 310 is provided with a suction hole through which the mask frame 260 can be suctioned. The suction holes are preferably capable of vacuum suctioning the vicinity of the four corners of the frame portion of the mask frame 260. The frame portion of the mask frame 260 can be widened and has high rigidity, so that the mask frame 260 can be stably fixed.

The material of the stage 310 can be, for example, carbon steel or stainless steel.

Although not shown, the stage 310 may be provided with a lifting mechanism to be movable in a direction perpendicular to the surface of the stage 310. The distance between the structure 30 and the rotating roller 320 or the pressing roller 330 can be adjusted by the elevating mechanism.

The rotating roller 320 can peel the metal layer 220 from the first plating layer 240 of the structure 30 and wind up the peeled metal layer 220. Rotating roller 320 includes a rotating part and a shaft part. The rotating part rotates about the center of the shaft part as a central axis, and can wind up the metal layer 220. Although not shown, a moving mechanism is attached to at least one end of the shaft. The moving mechanism can move the shaft portion in a first direction substantially parallel to one side of the stage 310 (or one side of the structure 30). In other words, the rotating roller 320 can move relative to the stage 310 in the first direction. Therefore, the rotating roller 320 can move in the first direction while winding up the metal layer 220.

In the rotating roller 320, only the rotating portion may rotate (that is, the shaft portion does not rotate), or the shaft portion and the rotating portion may be integrated, and the rotating portion may be rotated by rotating the shaft portion. Good too. The rotation speed of the rotating roller 320 can be controlled according to the movement of the rotating roller 320 in the first direction. For example, the moving speed of rotating roller 320 can be slowed down at the ends of structure 30. By slowing down the moving speed of the rotating roller 320, it is possible to prevent the metal layer 220 from jumping up at the end of the structure 30.

The rotating direction of the rotating roller 320 is not particularly limited, but it is preferable to rotate the metal layer 220 so that the surface to be peeled (the surface on which the first plating layer 240 was provided) is turned inside and wound up. The position at which the metal layer 220 is wound is below the rotating roller 320, and even when the rotating roller 320 moves, the curved portion 370 formed in the peeled region of the metal layer 220 can be stabilized.

The material of the rotating roller 320 may be, for example, carbon steel or stainless steel. In addition, it is preferable that the rotating part of the rotating roller 320 is polished or plated to have a small surface roughness. By reducing the surface roughness of the rotating part, the metal layer 220 being wound up will not get caught on the rotating part, and winding by the rotating roller 320 will be stable.

Note that before the metal layer 220 is wound up by the rotating roller 320, the end portion of the metal layer 220 can be attached to the rotating roller 320. The end portion of the metal layer 220 may be attached to the rotating roller 320 manually by an operator or automatically. For example, the rotating roller 320 and the metal layer 220 may be connected with tape. In this case, when the rotating roller 320 rotates, the tape is first wound up, and then the peeled metal layer 220 is wound up. A cut may be made in advance between the first plating layer 240 and the metal layer at the end so that the metal layer 220 can be easily peeled off.

In the manufacturing apparatus 20, a first fixed roller 340 can be installed near the rotating roller 320. The first fixed roller 340 can prevent the metal layer 220 from being rolled up by the rotating roller 320. That is, by installing the first fixed roller 340, the winding of the metal layer 220 can be further stabilized. The first fixed roller 340 is installed with a predetermined gap between the first fixed roller 340 and the rotating roller 320. The predetermined gap can be determined by taking into consideration the thickness of the metal layer 220 to be rolled up. Further, the center axis of the first fixed roller 340 is preferably located above the center axis of the rotating roller 320. With such a configuration, the effect of preventing lifting of the metal layer 220 when wound up becomes high.

The first fixed roller 340 may be able to rotate freely or may be fixed so as not to rotate. Note that the first fixed roller 340 is preferably attached to a moving mechanism so that it can be moved in accordance with the movement of the rotating roller 320.

The material of the first fixed roller 340 may be, for example, carbon steel or stainless steel. Further, it is preferable that the rotating portion of the first fixed roller 340 is subjected to a polishing treatment or a plating treatment, so that the surface roughness is small.

The pressing roller 330 can peel the metal layer 220 from the first plating layer 240 of the structure 30 and press the peeled metal layer 220. Pressing roller 330 includes a rotating part and a shaft part. The rotating part can freely rotate around the center of the shaft part. Although not shown, at least one end of the shaft of the presser roller 330 is also attached to the moving mechanism. That is, the shaft portion of the press roller 330 can be moved in the first direction in accordance with the rotating roller 320 by movement of the moving mechanism. Therefore, the pressing roller 330 can move in the first direction while pressing the metal layer 220.

In the holding roller 330, only the rotating portion may rotate (that is, the shaft portion is fixed to the moving mechanism), or the shaft portion and the rotating portion may be integrated, and the rotating portion may rotate in accordance with the rotation of the shaft portion. It may be rotated. The pressing roller 330 can rotate freely in accordance with the movement of the metal layer 220 peeled off by the winding of the rotating roller 320 and the movement of the moving mechanism.

Further, the pressing roller 330 can press the metal layer 220 so that the peeled metal layer 220 forms an arcuate curved portion 370 in the peeled area of the metal layer 220. Therefore, the pressing roller 330 is installed near the peeling area of the metal layer 220. Note that the pressing roller 330 preferably presses the metal layer 220 so that the curved portion 370 of the peeled metal layer 220 forms an arc with a central angle θ of 180° or more. Since the curved portion 370 of the metal layer 220 is approximately circular or approximately elliptical, even when the peeled metal layer 220 is moved by winding up by the rotating roller 320 or movement by a moving mechanism, the metal layer The curved portion 370 of 220 is stabilized.

Note that the central angle θ of the curved portion 370 is the angle from the part where the metal layer 220 is peeled off from the first plating layer 240 to the point where the peeled metal layer 220 contacts the presser roller 330. The central angle θ is, for example, 180° or more and 300° or less, preferably 210° or more and 290° or less, particularly preferably 240° or more and 280° or less.

It is preferable that the press roller 330 is located below the rotating roller 320. In other words, the center axis of the pressing roller 330 is preferably located below the center axis of the rotating roller 320. That is, it is preferable that the press roller 330 is closer to the stage than the rotating roller 320. Since the pressing roller 330 is located below the rotating roller 320, the curved portion 370 of the metal layer 220 is further stabilized.

The material of the pressing roller 330 can be, for example, carbon steel or stainless steel. Further, it is preferable that the rotating portion of the presser roller 330 is subjected to a polishing treatment or a plating treatment, so that the surface roughness is small. By reducing the surface roughness of the rotating part, the peeled metal layer 220 will not be caught by the rotating part, and the pressing by the pressing roller 330 will be stabilized.

Although not shown, the presser roller 330 may be provided with an elevating mechanism so as to be movable in a direction perpendicular to the surface of the stage 310. The distance between the stage 310 and the pressing roller 330 can be adjusted by the lifting mechanism.

In the manufacturing apparatus 20, a second fixed roller 350 can be installed near the pressing roller 330. The second fixed roller 350 can prevent peeling of the metal layer 220 from jumping up in the peeling region. That is, by installing the second fixed roller 350, the curved portion 370 of the metal layer 220 can be further stabilized. The second fixed roller 350 is installed on the opposite side of the pressing roller 330 with the curved portion 370 of the metal layer 220 interposed therebetween. Furthermore, it is preferable that the central axis of the second fixed roller 350 is located below the central axis of the presser roller 330. With such a configuration, the effect of preventing the peeling of the metal layer 220 from jumping up becomes high.

The second fixed roller 350 may be able to rotate freely or may be fixed so as not to rotate. Note that the second fixed roller 350 is preferably attached to a moving mechanism so that it can be moved in accordance with the movement of the press roller 330.

The material of the second fixed roller 350 can be, for example, carbon steel or stainless steel. Further, it is preferable that the rotating portion of the second fixed roller 350 is subjected to a polishing treatment or a plating treatment, and has a small surface roughness.

The radius of curvature R of the curved portion 370 of the metal layer is determined by the positional relationship between the press roller 330 and the second fixed roller 350. This radius R is determined depending on the material, film thickness, film stress, etc. of the metal layer 220. When this radius of curvature R is increased, the rise of the metal layer 220 from the point P where the metal layer 220 peels off from the plating layer 240 becomes gentler, and peeling stress can be reduced. When the thickness of the metal layer 220 is small, if the radius R is increased, the metal layer 220 will not be able to maintain an arc-shaped cross section at the curved portion 370, causing slack, so it is better to decrease the radius R.

The sensor 360 can measure the distance between the stage 310 and the curved surface of the curved portion 370 of the peeled metal layer 220. Preferably, the sensor 360 can measure the distance of the curved surface of the curved section 370 furthest from the stage 310. By measuring the distance between the curved surfaces of the furthest curved portions 370, the radius of curvature R of the curved portions 370 of the peeled metal layer 220 can be calculated.

Furthermore, the radius of curvature R of the curved portion 370 of the peeled metal layer 220 also depends on the distance H between the stage 310 and the pressing roller 330. Therefore, by installing the sensor 360, the distance H between the stage 310 and the press roller 330 can be adjusted according to the radius of curvature R calculated from the measurement by the sensor 360. Conversely, the radius of curvature R of the curved portion 370 of the metal layer 220 can also be adjusted based on the distance H between the stage 310 and the holding roller 330. Furthermore, if the rotational speed of the rotating roller 320 and the moving speed of the rotating roller 320 in the first direction do not match, the curved portion 370 of the metal layer 220 will not be stable. In that case, the rotational speed of the rotating roller 320 or the moving speed of the moving mechanism can be adjusted according to the radius of curvature R calculated from the measurement by the sensor 360. Note that this adjustment may be made automatically using a control mechanism.

The distance H between the stage 310 and the pressing roller 330 is, for example, 0.5 mm or more and 50 mm or less, preferably 0.8 mm or more and 20 mm or less, and particularly preferably 1 mm or more and 15 mm or less. The radius of curvature R of the curved portion 370 is, for example, 1 mm or more, preferably 3 mm or more and 50 mm or less, particularly preferably 5 mm or more and 20 mm or less.

Furthermore, the thickness of the metal layer 220 can be taken into consideration when adjusting the curved portion 370 of the metal layer 220. For example, when the thickness of the metal layer 220 is 60 μm, the distance H between the stage 310 and the pressing roller 330 can be adjusted to 15 mm, and the radius of curvature R of the curved portion 370 of the metal layer 220 can be adjusted to 10 mm.

For example, a laser sensor or the like can be used as the sensor 360. The sensor 360 may utilize the amount of light emitted by the laser and the light reflected from the metal layer 220, or may utilize the time difference between the emission of the laser and the reflection from the metal layer 220. . The sensor 360 is not limited to these, and any sensor that can measure distance can be used.

As described above, according to the manufacturing apparatus 20 of the vapor deposition mask 10 according to the present embodiment, the metal layer 220 can be uniformly peeled off from the first plating layer 240 of the structure 30, so that the quality of the vapor deposition mask 10 is stabilized. . Therefore, the quality of products deposited using the deposition mask 10 is also stable. Furthermore, by using the automated manufacturing apparatus 20, the burden on the worker is reduced, and thus work efficiency is improved.

<Modified example>
With reference to FIG. 4, the configuration of a manufacturing apparatus 20A, which is a modification of the manufacturing apparatus 20 for the vapor deposition mask 10, will be described. In addition, below, in 20 A of manufacturing apparatuses, the description about the same structure as the manufacturing apparatus 20 may be abbreviate|omitted.

FIG. 4 is a schematic cross-sectional view showing how the apparatus 20A for manufacturing a vapor deposition mask 10 according to an embodiment of the present invention is used.

As shown in FIG. 4, the manufacturing apparatus 20A includes a stage 310, a rotating roller 320A, a first fixed roller 340, a second fixed roller 350, and a sensor 360. Rotating roller 320A and sensor 360 are installed on stage 310.

The rotating roller 320A can peel the metal layer 220 from the first plating layer 240 of the structure 30 and wind up the peeled metal layer 220. Further, the rotating roller 320A can peel the metal layer 220 from the first plating layer 240 of the structure 30 and press the peeled metal layer 220. Further, the rotating roller 320A can press the metal layer 220 so that the peeled metal layer 220 forms an arcuate curved portion in the peeled area of the metal layer 220. Therefore, the rotating roller 320A is installed near the peeling area of the metal layer 220.

Rotating roller 320A includes a rotating part and a shaft part. The rotating part rotates around the center of the shaft part, and can wind up the metal layer 220 while holding it down. Although not shown, a moving mechanism is attached to at least one end of the shaft. The moving mechanism can move the shaft portion in a first direction substantially parallel to one side of the stage 310. In other words, the rotating roller 320A can move relative to the stage 310 in the first direction. Therefore, the rotating roller 320A can move in the first direction while holding down the metal layer 220 and winding it up.

As described above, according to the manufacturing apparatus 20A of the vapor deposition mask 10 according to this modification, the rotary roller 320A can wind up the peeled metal layer 220 while pressing it. Therefore, there is no need to separately install a pressing roller. Therefore, since the manufacturing apparatus 20A can simplify the moving mechanism, the manufacturing cost of the manufacturing apparatus 20A can be suppressed.

The embodiments described above as embodiments of the present invention can be implemented in appropriate combinations as long as they do not contradict each other. Further, those in which a person skilled in the art appropriately adds, deletes, or changes the design of components based on each embodiment, or adds, omitted, or changes in conditions based on each embodiment also have the gist of the present invention. within the scope of the present invention.

Even if there are other effects that are different from those brought about by the aspects of each embodiment described above, those that are obvious from the description of this specification or that can be easily predicted by a person skilled in the art will naturally be included. It is understood that this is brought about by the present invention.

10: Vapor deposition mask, 20, 20A: Manufacturing device, 30: Structure, 110: Mask body, 111: Open area, 112: Non-open area, 113: Opening, 120: Mask frame, 130: Connection member, 210: Support Substrate, 220: Metal layer, 230: Photoresist layer, 240: First plating layer, 250: Adhesive layer, 260: Mask frame, 260: Mask frame, 280: Film, 290: Second plating layer, 310: Stage, 320, 320A: rotating roller, 330: press roller, 340: first fixed roller, 350: second fixed roller, 360: sensor, 370: curved part

Claims (16)

a stage for installing a structure provided with a vapor deposition mask and a metal layer in contact with the vapor deposition mask;
a rotating roller that peels off and winds up the metal layer from the vapor deposition mask ;
The rotating roller is a vapor deposition mask manufacturing device that rotates so as to wind up the metal layer with the surface to be peeled facing inside . The vapor deposition mask manufacturing apparatus according to claim 1, wherein the rotating roller moves relatively to the stage in a first direction substantially parallel to one side of the stage to wind up the metal layer. The apparatus for manufacturing a vapor deposition mask according to claim 1 or 2, further comprising a pressing roller that presses the metal layer peeled off from the vapor deposition mask. The vapor deposition mask manufacturing apparatus according to claim 3 , wherein the axial distance between the rotating roller and the pressing roller is variable. 4. The vapor deposition mask manufacturing apparatus according to claim 3 , wherein the pressing roller presses the peeled metal layer so as to curve to form a circular arc having a central angle of 180 degrees or more. 6. The vapor deposition mask manufacturing apparatus according to claim 5 , further comprising a sensor that measures a distance between the stage and the curved surface of the peeled metal layer. The vapor deposition mask manufacturing apparatus according to any one of claims 3 to 6 , wherein the pressing roller moves relative to the stage in accordance with the rotating roller. The vapor deposition mask manufacturing apparatus according to any one of claims 3 to 7 , wherein the central axis of the pressing roller is located below the central axis of the rotating roller. The apparatus for manufacturing a vapor deposition mask according to any one of claims 3 to 8 , further comprising a first fixed roller for preventing lifting of the metal layer when wound up. The vapor deposition mask manufacturing apparatus according to claim 9 , wherein the central axis of the first fixed roller is located above the central axis of the rotating roller. The apparatus for manufacturing a vapor deposition mask according to any one of claims 3 to 10 , further comprising a second fixed roller for preventing peeling of the metal layer from jumping up. The vapor deposition mask manufacturing apparatus according to claim 11 , wherein the central axis of the second fixed roller is located below the central axis of the presser roller. In a structure provided with a vapor deposition mask and a metal layer in contact with the vapor deposition mask, while winding up the metal layer with a rotating roller, the rotating roller is moved in a first direction substantially parallel to one side of the structure. moving and peeling the metal layer from the deposition mask ,
In the vapor deposition mask manufacturing method , the rotating roller rotates so as to wind up the metal layer with the surface to be peeled facing inside . 14. The method for manufacturing a vapor deposition mask according to claim 13 , wherein a press roller that presses the peeled metal layer in a curved manner forming an arc with a center angle of 180 degrees or more is moved in the first direction. The method for producing a deposition mask according to claim 13 , further comprising a pressing roller that presses the metal layer. The method for manufacturing a vapor deposition mask according to claim 14 or 15 , wherein the mutual axial distance of the rotating roller and the pressing roller is changed depending on the metal layer.

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