JP7444342B2 - フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品 - Google Patents

フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品 Download PDF

Info

Publication number
JP7444342B2
JP7444342B2 JP2023553061A JP2023553061A JP7444342B2 JP 7444342 B2 JP7444342 B2 JP 7444342B2 JP 2023553061 A JP2023553061 A JP 2023553061A JP 2023553061 A JP2023553061 A JP 2023553061A JP 7444342 B2 JP7444342 B2 JP 7444342B2
Authority
JP
Japan
Prior art keywords
phenol
resin
compound
epoxy resin
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023553061A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023153160A1 (https=
Inventor
真司 恩田
邦裕 森永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of JPWO2023153160A1 publication Critical patent/JPWO2023153160A1/ja
Application granted granted Critical
Publication of JP7444342B2 publication Critical patent/JP7444342B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/08—Compounds containing oxirane rings with hydrocarbon radicals, substituted by halogen atoms, nitro radicals or nitroso radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
JP2023553061A 2022-02-14 2023-01-19 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品 Active JP7444342B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022020772 2022-02-14
JP2022020772 2022-02-14
PCT/JP2023/001430 WO2023153160A1 (ja) 2022-02-14 2023-01-19 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品

Publications (2)

Publication Number Publication Date
JPWO2023153160A1 JPWO2023153160A1 (https=) 2023-08-17
JP7444342B2 true JP7444342B2 (ja) 2024-03-06

Family

ID=87564307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023553061A Active JP7444342B2 (ja) 2022-02-14 2023-01-19 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品

Country Status (4)

Country Link
US (1) US20250154314A1 (https=)
EP (1) EP4480984A4 (https=)
JP (1) JP7444342B2 (https=)
WO (1) WO2023153160A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7103499B1 (ja) * 2021-10-27 2022-07-20 Dic株式会社 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
CN118005891A (zh) * 2024-03-06 2024-05-10 江苏三吉利化工股份有限公司 一种邻苯二酚酚醛环氧树脂的制备方法
CN120158038A (zh) * 2025-04-21 2025-06-17 海口市福瑞能科技有限公司 一种阻燃酚醛树脂成型材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226559A (ja) 2001-02-06 2002-08-14 Akio Negishi ｐＨ変色性ポリマーとその製造法
WO2007007827A1 (ja) 2005-07-13 2007-01-18 Ube Industries, Ltd. ビフェニレン架橋フェノールノボラック樹脂ならびにその用途
JP2008189708A (ja) 2007-02-01 2008-08-21 Ube Ind Ltd 低溶融粘度フェノールノボラック樹脂、その製造方法およびそれを用いたエポキシ樹脂硬化物
JP2016190891A (ja) 2015-03-30 2016-11-10 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
WO2022234776A1 (ja) 2021-05-06 2022-11-10 Dic株式会社 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140167A (ja) * 1997-11-13 1999-05-25 Mitsui Chem Inc ポリエステル化合物、その製造方法および用途
JP2003201388A (ja) 2002-01-08 2003-07-18 Toray Ind Inc エポキシ樹脂組成物、樹脂硬化物、プリプレグおよび繊維強化複合材料
JP2004277717A (ja) * 2003-02-24 2004-10-07 Mitsui Chemicals Inc エポキシ樹脂の製造方法
EP1785441B1 (en) * 2004-09-01 2011-06-08 DIC Corporation Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
JP7103499B1 (ja) * 2021-10-27 2022-07-20 Dic株式会社 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226559A (ja) 2001-02-06 2002-08-14 Akio Negishi ｐＨ変色性ポリマーとその製造法
WO2007007827A1 (ja) 2005-07-13 2007-01-18 Ube Industries, Ltd. ビフェニレン架橋フェノールノボラック樹脂ならびにその用途
JP2008189708A (ja) 2007-02-01 2008-08-21 Ube Ind Ltd 低溶融粘度フェノールノボラック樹脂、その製造方法およびそれを用いたエポキシ樹脂硬化物
JP2016190891A (ja) 2015-03-30 2016-11-10 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
WO2022234776A1 (ja) 2021-05-06 2022-11-10 Dic株式会社 フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品

Also Published As

Publication number Publication date
WO2023153160A1 (ja) 2023-08-17
US20250154314A1 (en) 2025-05-15
JPWO2023153160A1 (https=) 2023-08-17
EP4480984A1 (en) 2024-12-25
EP4480984A4 (en) 2026-04-01

Similar Documents

Publication Publication Date Title
JP4953039B2 (ja) リン原子含有オリゴマー、その製造方法、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP7444342B2 (ja) フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
US9056990B2 (en) Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board
JP7188657B1 (ja) エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
KR102624960B1 (ko) 에폭시 수지, 에폭시 수지의 제조 방법, 경화성 수지 조성물 및 그 경화물
JP7298801B1 (ja) フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
JP6874359B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP7103499B1 (ja) フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
JP7059633B2 (ja) エポキシ樹脂、製造方法、エポキシ樹脂組成物及びその硬化物
JP6809206B2 (ja) エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP6992932B2 (ja) 多官能フェノール樹脂、多官能エポキシ樹脂、それらを含む硬化性樹脂組成物及びその硬化物
JP7632036B2 (ja) エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
JP6394941B2 (ja) エポキシ化合物、フェノール性水酸基含有化合物、硬化性組成物、その硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、及び繊維強化樹脂成形品
JP2022066986A (ja) フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、硬化物、繊維強化複合材料、及び、繊維強化樹脂成形品
JP2026022599A (ja) 活性エステル樹脂、樹脂組成物、硬化物及びその用途並びにフェノール水酸基含有樹脂
JP7024227B2 (ja) エポキシ樹脂の製造方法、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR20260017953A (ko) 활성 에스테르 수지, 수지 조성물, 경화물 및 그 용도 그리고 페놀 수산기 함유 수지
JP2025090144A (ja) 活性エステル樹脂、樹脂組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、フレキシブル配線基板、ビルドアップフィルム、多層プリント配線板、ビルドアップ基板、繊維強化複合材料、成形品、及び、フェノール性水酸基含有樹脂
JP2020100768A (ja) キサンテン型樹脂、硬化性樹脂組成物及びその硬化物
JP2014037474A (ja) 硬化性樹脂組成物、硬化物、及びプリント配線基板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230831

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230831

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231031

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240123

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240205

R151 Written notification of patent or utility model registration

Ref document number: 7444342

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151