JP7441792B2 - 積層型冷却器のプレートの識別構造 - Google Patents

積層型冷却器のプレートの識別構造 Download PDF

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Publication number
JP7441792B2
JP7441792B2 JP2020553321A JP2020553321A JP7441792B2 JP 7441792 B2 JP7441792 B2 JP 7441792B2 JP 2020553321 A JP2020553321 A JP 2020553321A JP 2020553321 A JP2020553321 A JP 2020553321A JP 7441792 B2 JP7441792 B2 JP 7441792B2
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Japan
Prior art keywords
plate
identification
recess
same
stacked
Prior art date
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Active
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JP2020553321A
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English (en)
Japanese (ja)
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JPWO2020080502A1 (ja
Inventor
卓也 文後
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
T Rad Co Ltd
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T Rad Co Ltd
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Publication date
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Publication of JPWO2020080502A1 publication Critical patent/JPWO2020080502A1/ja
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Publication of JP7441792B2 publication Critical patent/JP7441792B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP2020553321A 2018-10-19 2019-10-10 積層型冷却器のプレートの識別構造 Active JP7441792B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018197990 2018-10-19
JP2018197990 2018-10-19
PCT/JP2019/041001 WO2020080502A1 (ja) 2018-10-19 2019-10-10 積層型冷却器のプレートの識別構造

Publications (2)

Publication Number Publication Date
JPWO2020080502A1 JPWO2020080502A1 (ja) 2021-10-07
JP7441792B2 true JP7441792B2 (ja) 2024-03-01

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ID=70283057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020553321A Active JP7441792B2 (ja) 2018-10-19 2019-10-10 積層型冷却器のプレートの識別構造

Country Status (3)

Country Link
JP (1) JP7441792B2 (de)
DE (1) DE112019005206T5 (de)
WO (1) WO2020080502A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021202817A1 (de) * 2021-03-23 2022-09-29 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlkörper für eine elektrische und/oder elektronische Baugruppe
WO2023079608A1 (ja) * 2021-11-04 2023-05-11 三菱電機株式会社 ヒートシンクおよびヒートシンクの製造方法
CN114470849B (zh) * 2022-02-09 2023-05-26 安徽碳鑫科技有限公司 一种甲醇蒸气高效回收装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004333064A (ja) 2003-05-09 2004-11-25 Soichi Mizui 板状熱交換器
JP2008171840A (ja) 2007-01-05 2008-07-24 T Rad Co Ltd 液冷ヒートシンクおよびその設計方法
JP2010190515A (ja) 2009-02-19 2010-09-02 T Rad Co Ltd ヒートシンク
WO2017131240A1 (ja) 2016-01-27 2017-08-03 株式会社ティラド プレート積層型熱交換器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004333064A (ja) 2003-05-09 2004-11-25 Soichi Mizui 板状熱交換器
JP2008171840A (ja) 2007-01-05 2008-07-24 T Rad Co Ltd 液冷ヒートシンクおよびその設計方法
JP2010190515A (ja) 2009-02-19 2010-09-02 T Rad Co Ltd ヒートシンク
WO2017131240A1 (ja) 2016-01-27 2017-08-03 株式会社ティラド プレート積層型熱交換器

Also Published As

Publication number Publication date
WO2020080502A1 (ja) 2020-04-23
JPWO2020080502A1 (ja) 2021-10-07
DE112019005206T5 (de) 2021-07-08

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