JP7439536B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP7439536B2 JP7439536B2 JP2020011462A JP2020011462A JP7439536B2 JP 7439536 B2 JP7439536 B2 JP 7439536B2 JP 2020011462 A JP2020011462 A JP 2020011462A JP 2020011462 A JP2020011462 A JP 2020011462A JP 7439536 B2 JP7439536 B2 JP 7439536B2
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- 239000004065 semiconductor Substances 0.000 title claims description 116
- 125000006850 spacer group Chemical group 0.000 claims description 34
- 150000004767 nitrides Chemical class 0.000 claims description 27
- 239000010410 layer Substances 0.000 description 261
- 230000004888 barrier function Effects 0.000 description 55
- 238000000034 method Methods 0.000 description 44
- 239000007789 gas Substances 0.000 description 37
- 238000004519 manufacturing process Methods 0.000 description 31
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 20
- 229910002704 AlGaN Inorganic materials 0.000 description 12
- 238000001312 dry etching Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 8
- 229910052735 hafnium Inorganic materials 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 229910052715 tantalum Inorganic materials 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- 229910052726 zirconium Inorganic materials 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 6
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 6
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 230000006911 nucleation Effects 0.000 description 5
- 238000010899 nucleation Methods 0.000 description 5
- 230000005533 two-dimensional electron gas Effects 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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- H01L29/76—Unipolar devices, e.g. field effect transistors
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- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
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Description
第1実施形態について説明する。第1実施形態は、高電子移動度トランジスタ(HEMT)を含む半導体装置に関する。図1は、第1実施形態に係る半導体装置を示す断面図である。
aAlGaN=aGaN-(aGaN-aAlN)×y・・・(1)
第2実施形態について説明する。第2実施形態は、HEMTを含む半導体装置に関する。図10は、第2実施形態に係る半導体装置を示す断面図である。
第3実施形態について説明する。第3実施形態は、HEMTを含む半導体装置に関する。図15は、第3実施形態に係る半導体装置を示す断面図である。
第4実施形態について説明する。第4実施形態は、HEMTを含む半導体装置に関する。図22は、第4実施形態に係る半導体装置を示す断面図である。
次に、第5実施形態について説明する。第5実施形態は、HEMTのディスクリートパッケージに関する。図29は、第5実施形態に係るディスクリートパッケージを示す図である。
次に、第6実施形態について説明する。第6実施形態は、HEMTを備えたPFC(Power Factor Correction)回路に関する。図30は、第6実施形態に係るPFC回路を示す結線図である。
次に、第7実施形態について説明する。第7実施形態は、サーバ電源に好適な、HEMTを備えた電源装置に関する。図31は、第7実施形態に係る電源装置を示す結線図である。
次に、第8実施形態について説明する。第8実施形態は、HEMTを備えた増幅器に関する。図32は、第8実施形態に係る増幅器を示す結線図である。
電子走行層と、
前記電子走行層の上方に設けられた電子供給層と、
前記電子供給層の上方に設けられたキャップ層と、
を有し、
前記電子走行層の主面に平行な方向で、前記電子走行層の第1格子定数は前記電子供給層の第2格子定数よりも大きいことを特徴とする半導体装置。
(付記2)
前記第2格子定数は、前記電子供給層の組成から導き出される第3格子定数より大きいことを特徴とする付記1に記載の半導体装置。
(付記3)
前記電子走行層と前記電子供給層との間に設けられ、前記電子走行層に格子整合したスペーサ層を有することを特徴とする付記1又は2に記載の半導体装置。
(付記4)
前記電子供給層の上方に設けられたゲート電極、ソース電極及びドレイン電極と、
前記ソース電極と前記ドレイン電極との間で前記キャップ層上に選択的に形成された窒化物層と、
を有することを特徴とする付記1乃至3のいずれか1項に記載の半導体装置。
(付記5)
前記ゲート電極は前記キャップ層に直接接していることを特徴とする付記4に記載の半導体装置。
(付記6)
前記ゲート電極と前記キャップ層との間に設けられたゲート絶縁膜を有することを特徴とする付記4に記載の半導体装置。
(付記7)
前記ゲート絶縁膜は、Si、Al、Hf、Zr、Ti、Ta又はWの酸化物又は酸窒化物の層を含むことを特徴とする付記6に記載の半導体装置。
(付記8)
前記窒化物層は、前記ソース電極と前記ゲート電極との間に設けられていることを特徴とする付記4乃至7のいずれか1項に記載の半導体装置。
(付記9)
前記ソース電極と前記ゲート電極との間に設けられたSi、Al、Hf、Zr、Ti、Ta又はWの酸化物又は酸窒化物の層を有することを特徴とする付記4乃至8のいずれか1項に記載の半導体装置。
(付記10)
前記電子供給層の前記電子走行層側の主面に結晶欠陥が含まれることを特徴とする付記1乃至9のいずれか1項に記載の半導体装置。
(付記11)
付記1乃至10のいずれか1項に記載の半導体装置を有することを特徴とする増幅器。
(付記12)
付記1乃至10のいずれか1項に記載の半導体装置を有することを特徴とする電源装置。
103:チャネル層
104:スペーサ層
105、305:バリア層
106:キャップ層
108:ソース電極
109:ドレイン電極
110、310、331、332、431:絶縁膜
111:ゲート電極
212:ゲート絶縁膜
Claims (6)
- 電子走行層と、
前記電子走行層の上方に設けられた電子供給層と、
前記電子供給層の上方に設けられたキャップ層と、
前記電子走行層と前記電子供給層との間に設けられたスペーサ層と、
を有し、
前記電子走行層の主面に平行な方向で、前記電子走行層の第1格子定数は前記電子供給層の第2格子定数よりも大きく、
前記第2格子定数は、前記電子供給層の組成から導き出される第3格子定数より大きく、
前記電子走行層の主面に平行な方向で、前記スペーサ層の格子定数は前記第1格子定数と同等であり、
前記スペーサ層は、前記電子走行層の主面に平行な方向に第1引張歪を含み、
前記電子供給層は、前記電子走行層の主面に平行な方向に前記第1引張歪よりも小さい第2引張歪を含むことを特徴とする半導体装置。 - 前記キャップ層は、前記電子走行層の主面に平行な方向に圧縮歪を含むことを特徴とする請求項1に記載の半導体装置。
- 前記電子供給層の上方に設けられたゲート電極、ソース電極及びドレイン電極と、
前記ソース電極と前記ドレイン電極との間で前記キャップ層上に選択的に形成された窒化物層と、
を有することを特徴とする請求項1又は2に記載の半導体装置。 - 前記ゲート電極は前記キャップ層に直接接していることを特徴とする請求項3に記載の半導体装置。
- 前記ゲート電極と前記キャップ層との間に設けられたゲート絶縁膜を有することを特徴とする請求項3に記載の半導体装置。
- 前記窒化物層は、前記ソース電極と前記ゲート電極との間に設けられていることを特徴とする請求項3乃至5のいずれか1項に記載の半導体装置。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016087A (ja) | 2000-06-29 | 2002-01-18 | Nec Corp | 半導体装置 |
JP2007067240A (ja) | 2005-08-31 | 2007-03-15 | Toshiba Corp | 窒化物系半導体装置 |
JP2008140812A (ja) | 2006-11-30 | 2008-06-19 | Oki Electric Ind Co Ltd | GaN系高電子移動度電界効果トランジスタ |
JP2009231396A (ja) | 2008-03-19 | 2009-10-08 | Sumitomo Chemical Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2012164886A (ja) | 2011-02-08 | 2012-08-30 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体電子デバイス、エピタキシャル基板、及びiii族窒化物半導体電子デバイスを作製する方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6849882B2 (en) * | 2001-05-11 | 2005-02-01 | Cree Inc. | Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer |
US7470941B2 (en) * | 2001-12-06 | 2008-12-30 | Hrl Laboratories, Llc | High power-low noise microwave GaN heterojunction field effect transistor |
US7709859B2 (en) * | 2004-11-23 | 2010-05-04 | Cree, Inc. | Cap layers including aluminum nitride for nitride-based transistors |
US7253454B2 (en) * | 2005-03-03 | 2007-08-07 | Cree, Inc. | High electron mobility transistor |
US7838904B2 (en) * | 2007-01-31 | 2010-11-23 | Panasonic Corporation | Nitride based semiconductor device with concave gate region |
FR2929445B1 (fr) * | 2008-03-25 | 2010-05-21 | Picogiga Internat | Procede de fabrication d'une couche de nitrure de gallium ou de nitrure de gallium et d'aluminium |
DE102009041548A1 (de) * | 2009-09-15 | 2011-03-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbleiterstruktur |
JP2011082216A (ja) * | 2009-10-02 | 2011-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
KR20110122525A (ko) * | 2010-05-04 | 2011-11-10 | 삼성전자주식회사 | Ldd 영역을 갖는 고 전자 이동도 트랜지스터(hemt) 및 그 제조방법 |
US8648389B2 (en) * | 2011-06-08 | 2014-02-11 | Sumitomo Electric Industries, Ltd. | Semiconductor device with spacer layer between carrier traveling layer and carrier supplying layer |
US8710511B2 (en) * | 2011-07-29 | 2014-04-29 | Northrop Grumman Systems Corporation | AIN buffer N-polar GaN HEMT profile |
US20130105817A1 (en) * | 2011-10-26 | 2013-05-02 | Triquint Semiconductor, Inc. | High electron mobility transistor structure and method |
WO2013109884A1 (en) * | 2012-01-18 | 2013-07-25 | Iqe Kc, Llc | Iiii -n- based double heterostructure field effect transistor and method of forming the same |
EP2720257A4 (en) * | 2012-08-10 | 2015-09-23 | Ngk Insulators Ltd | SEMICONDUCTOR ELEMENT, HEMT ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT |
KR101946454B1 (ko) * | 2012-09-18 | 2019-02-12 | 삼성전자주식회사 | 고 전자 이동도 트랜지스터 및 그 제조 방법 |
US9525054B2 (en) * | 2013-01-04 | 2016-12-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | High electron mobility transistor and method of forming the same |
US9425276B2 (en) * | 2013-01-21 | 2016-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | High electron mobility transistors |
US20140335666A1 (en) * | 2013-05-13 | 2014-11-13 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Growth of High-Performance III-Nitride Transistor Passivation Layer for GaN Electronics |
JP6318474B2 (ja) * | 2013-06-07 | 2018-05-09 | 住友電気工業株式会社 | 半導体装置の製造方法 |
US9640650B2 (en) * | 2014-01-16 | 2017-05-02 | Qorvo Us, Inc. | Doped gallium nitride high-electron mobility transistor |
JP2015192026A (ja) * | 2014-03-28 | 2015-11-02 | 住友電気工業株式会社 | 半導体装置の製造方法 |
JP6540461B2 (ja) * | 2015-10-30 | 2019-07-10 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
US11101379B2 (en) * | 2016-11-16 | 2021-08-24 | Theregenis Of The University Of California | Structure for increasing mobility in a high electron mobility transistor |
JP6870304B2 (ja) * | 2016-12-05 | 2021-05-12 | 住友電気工業株式会社 | 半導体装置の製造方法 |
JP6729416B2 (ja) * | 2017-01-19 | 2020-07-22 | 住友電気工業株式会社 | 窒化物半導体デバイス及び窒化物半導体デバイスの製造方法 |
US10290713B2 (en) * | 2017-07-31 | 2019-05-14 | Qorvo Us, Inc. | Field-effect transistor |
JP6841344B2 (ja) * | 2017-12-01 | 2021-03-10 | 三菱電機株式会社 | 半導体装置の製造方法、半導体装置 |
CN109659366A (zh) * | 2018-12-21 | 2019-04-19 | 英诺赛科(珠海)科技有限公司 | 高电子迁移率晶体管及其制造方法 |
TWI683370B (zh) * | 2019-03-12 | 2020-01-21 | 環球晶圓股份有限公司 | 半導體元件及其製造方法 |
WO2020188389A1 (en) * | 2019-03-21 | 2020-09-24 | Epitronic Holdings Pte. Ltd | Microelectronic sensor comprising a pc-hemt with a metamaterial electrode |
-
2020
- 2020-01-28 JP JP2020011462A patent/JP7439536B2/ja active Active
- 2020-12-21 US US17/128,785 patent/US20210234029A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016087A (ja) | 2000-06-29 | 2002-01-18 | Nec Corp | 半導体装置 |
JP2007067240A (ja) | 2005-08-31 | 2007-03-15 | Toshiba Corp | 窒化物系半導体装置 |
JP2008140812A (ja) | 2006-11-30 | 2008-06-19 | Oki Electric Ind Co Ltd | GaN系高電子移動度電界効果トランジスタ |
JP2009231396A (ja) | 2008-03-19 | 2009-10-08 | Sumitomo Chemical Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2012164886A (ja) | 2011-02-08 | 2012-08-30 | Sumitomo Electric Ind Ltd | Iii族窒化物半導体電子デバイス、エピタキシャル基板、及びiii族窒化物半導体電子デバイスを作製する方法 |
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