JP7431387B1 - セラミック複合基板、及びセラミック複合基板の製造方法 - Google Patents

セラミック複合基板、及びセラミック複合基板の製造方法 Download PDF

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Publication number
JP7431387B1
JP7431387B1 JP2023556514A JP2023556514A JP7431387B1 JP 7431387 B1 JP7431387 B1 JP 7431387B1 JP 2023556514 A JP2023556514 A JP 2023556514A JP 2023556514 A JP2023556514 A JP 2023556514A JP 7431387 B1 JP7431387 B1 JP 7431387B1
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Japan
Prior art keywords
bonding layer
metal
circuit section
circuit
bonded
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Active
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JP2023556514A
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English (en)
Japanese (ja)
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JPWO2023176376A5 (https=
JPWO2023176376A1 (https=
Inventor
優太 津川
清治 矢野
淳一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023176376A1 publication Critical patent/JPWO2023176376A1/ja
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Publication of JPWO2023176376A5 publication Critical patent/JPWO2023176376A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023556514A 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法 Active JP7431387B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022041686 2022-03-16
JP2022041686 2022-03-16
PCT/JP2023/006811 WO2023176376A1 (ja) 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023176376A1 JPWO2023176376A1 (https=) 2023-09-21
JP7431387B1 true JP7431387B1 (ja) 2024-02-14
JPWO2023176376A5 JPWO2023176376A5 (https=) 2024-02-22

Family

ID=88023472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556514A Active JP7431387B1 (ja) 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法

Country Status (4)

Country Link
EP (1) EP4482261A4 (https=)
JP (1) JP7431387B1 (https=)
CN (1) CN118891961A (https=)
WO (1) WO2023176376A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110205A (ja) * 2001-09-28 2003-04-11 Dowa Mining Co Ltd 金属−セラミックス回路基板
JP2004314161A (ja) * 2003-04-21 2004-11-11 Hitachi Metals Ltd セラミックス基板用ろう材及びこれを用いたセラミックス回路基板
JP2006286754A (ja) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd 金属−セラミックス接合基板
JP2010050415A (ja) * 2008-08-25 2010-03-04 Mitsubishi Materials Corp パワーモジュール用基板及びその製造方法
JP2016074565A (ja) * 2014-10-07 2016-05-12 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板およびその製造方法
WO2017006661A1 (ja) * 2015-07-09 2017-01-12 株式会社東芝 セラミックス金属回路基板およびそれを用いた半導体装置
JP2018145047A (ja) * 2017-03-03 2018-09-20 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110205A (ja) * 2001-09-28 2003-04-11 Dowa Mining Co Ltd 金属−セラミックス回路基板
JP2004314161A (ja) * 2003-04-21 2004-11-11 Hitachi Metals Ltd セラミックス基板用ろう材及びこれを用いたセラミックス回路基板
JP2006286754A (ja) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd 金属−セラミックス接合基板
JP2010050415A (ja) * 2008-08-25 2010-03-04 Mitsubishi Materials Corp パワーモジュール用基板及びその製造方法
JP2016074565A (ja) * 2014-10-07 2016-05-12 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板およびその製造方法
WO2017006661A1 (ja) * 2015-07-09 2017-01-12 株式会社東芝 セラミックス金属回路基板およびそれを用いた半導体装置
JP2018145047A (ja) * 2017-03-03 2018-09-20 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法

Also Published As

Publication number Publication date
WO2023176376A1 (ja) 2023-09-21
EP4482261A4 (en) 2025-06-04
JPWO2023176376A1 (https=) 2023-09-21
CN118891961A (zh) 2024-11-01
EP4482261A1 (en) 2024-12-25

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