JPWO2023176376A1 - - Google Patents

Info

Publication number
JPWO2023176376A1
JPWO2023176376A1 JP2023556514A JP2023556514A JPWO2023176376A1 JP WO2023176376 A1 JPWO2023176376 A1 JP WO2023176376A1 JP 2023556514 A JP2023556514 A JP 2023556514A JP 2023556514 A JP2023556514 A JP 2023556514A JP WO2023176376 A1 JPWO2023176376 A1 JP WO2023176376A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023556514A
Other languages
Japanese (ja)
Other versions
JPWO2023176376A5 (https=
JP7431387B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023176376A1 publication Critical patent/JPWO2023176376A1/ja
Application granted granted Critical
Publication of JP7431387B1 publication Critical patent/JP7431387B1/ja
Publication of JPWO2023176376A5 publication Critical patent/JPWO2023176376A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023556514A 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法 Active JP7431387B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022041686 2022-03-16
JP2022041686 2022-03-16
PCT/JP2023/006811 WO2023176376A1 (ja) 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023176376A1 true JPWO2023176376A1 (https=) 2023-09-21
JP7431387B1 JP7431387B1 (ja) 2024-02-14
JPWO2023176376A5 JPWO2023176376A5 (https=) 2024-02-22

Family

ID=88023472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023556514A Active JP7431387B1 (ja) 2022-03-16 2023-02-24 セラミック複合基板、及びセラミック複合基板の製造方法

Country Status (4)

Country Link
EP (1) EP4482261A4 (https=)
JP (1) JP7431387B1 (https=)
CN (1) CN118891961A (https=)
WO (1) WO2023176376A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648189B2 (ja) * 2001-09-28 2005-05-18 同和鉱業株式会社 金属−セラミックス回路基板
JP3714557B2 (ja) * 2003-04-21 2005-11-09 日立金属株式会社 セラミックス基板用ろう材及びこれを用いたセラミックス回路基板、パワー半導体モジュール
JP4765110B2 (ja) * 2005-03-31 2011-09-07 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板およびその製造方法
JP5045613B2 (ja) * 2008-08-25 2012-10-10 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法
JP6400422B2 (ja) * 2014-10-07 2018-10-03 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板およびその製造方法
EP3321957B1 (en) * 2015-07-09 2022-07-27 Kabushiki Kaisha Toshiba Ceramic metal circuit board and semiconductor device using same
JP6799479B2 (ja) * 2017-03-03 2020-12-16 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法

Also Published As

Publication number Publication date
WO2023176376A1 (ja) 2023-09-21
EP4482261A4 (en) 2025-06-04
CN118891961A (zh) 2024-11-01
JP7431387B1 (ja) 2024-02-14
EP4482261A1 (en) 2024-12-25

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