JP7423496B2 - 印刷された保護膜を有する可撓性導電性印刷回路 - Google Patents

印刷された保護膜を有する可撓性導電性印刷回路 Download PDF

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Publication number
JP7423496B2
JP7423496B2 JP2020198170A JP2020198170A JP7423496B2 JP 7423496 B2 JP7423496 B2 JP 7423496B2 JP 2020198170 A JP2020198170 A JP 2020198170A JP 2020198170 A JP2020198170 A JP 2020198170A JP 7423496 B2 JP7423496 B2 JP 7423496B2
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Japan
Prior art keywords
printed circuit
tpu
mixture
overcoat
centipoise
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JP2020198170A
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Japanese (ja)
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JP2021098193A (ja
JP2021098193A5 (enExample
Inventor
サラ・ジェイ．・ベラ
ユージエ・チュー
チャド・エス．・スミスソン
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Xerox Corp
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Xerox Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020198170A 2019-12-20 2020-11-30 印刷された保護膜を有する可撓性導電性印刷回路 Active JP7423496B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/722,983 2019-12-20
US16/722,983 US11096288B2 (en) 2019-12-20 2019-12-20 Flexible conductive printed circuits with printed overcoats

Publications (3)

Publication Number Publication Date
JP2021098193A JP2021098193A (ja) 2021-07-01
JP2021098193A5 JP2021098193A5 (enExample) 2023-12-01
JP7423496B2 true JP7423496B2 (ja) 2024-01-29

Family

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JP2020198170A Active JP7423496B2 (ja) 2019-12-20 2020-11-30 印刷された保護膜を有する可撓性導電性印刷回路

Country Status (6)

Country Link
US (1) US11096288B2 (enExample)
EP (1) EP3840550A1 (enExample)
JP (1) JP7423496B2 (enExample)
KR (1) KR102676581B1 (enExample)
CN (1) CN113015345B (enExample)
CA (1) CA3102084C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824277B (zh) * 2021-08-06 2023-12-01 友達光電股份有限公司 顯示裝置及其製造方法
US12340924B2 (en) 2021-12-02 2025-06-24 Aptiv Technologies AG Integrated flexible circuit attachment features with sound dampening and method of forming said features
US12198835B2 (en) * 2021-12-02 2025-01-14 Aptiv Technologies AG Apparatus and method for selective application of abrasion resistant or noise abatement coating to a flexible electrical circuit

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JP2005183805A (ja) 2003-12-22 2005-07-07 Canon Inc 電気回路基体及びその製造方法
US20060019077A1 (en) 2004-07-02 2006-01-26 Avecia Inkjet Limited Process
WO2012039380A1 (ja) 2010-09-22 2012-03-29 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
WO2012039379A1 (ja) 2010-09-22 2012-03-29 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
US20140035995A1 (en) 2010-12-07 2014-02-06 Sun Chemical Corporation Aerosol jet printable metal conductive inks, glass coated metal conductive inks and uv-curable dielectric inks and methods of preparing and printing the same
JP2016147970A (ja) 2015-02-12 2016-08-18 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
WO2017169624A1 (ja) 2016-03-31 2017-10-05 太陽インキ製造株式会社 硬化装置およびソルダーレジストの製造方法

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US20030157276A1 (en) 2002-02-06 2003-08-21 Eastman Kodak Company Ink recording element
US7150522B2 (en) * 2002-12-04 2006-12-19 Hewlett-Packard Development Company, L.P. Sealable topcoat for porous media
JP4290510B2 (ja) * 2003-08-22 2009-07-08 太陽インキ製造株式会社 インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
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Publication number Priority date Publication date Assignee Title
JP2005183805A (ja) 2003-12-22 2005-07-07 Canon Inc 電気回路基体及びその製造方法
US20060019077A1 (en) 2004-07-02 2006-01-26 Avecia Inkjet Limited Process
WO2012039380A1 (ja) 2010-09-22 2012-03-29 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
WO2012039379A1 (ja) 2010-09-22 2012-03-29 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
US20140035995A1 (en) 2010-12-07 2014-02-06 Sun Chemical Corporation Aerosol jet printable metal conductive inks, glass coated metal conductive inks and uv-curable dielectric inks and methods of preparing and printing the same
JP2016147970A (ja) 2015-02-12 2016-08-18 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
WO2017169624A1 (ja) 2016-03-31 2017-10-05 太陽インキ製造株式会社 硬化装置およびソルダーレジストの製造方法

Also Published As

Publication number Publication date
KR20210080205A (ko) 2021-06-30
JP2021098193A (ja) 2021-07-01
CA3102084A1 (en) 2021-06-20
EP3840550A1 (en) 2021-06-23
CA3102084C (en) 2023-11-14
KR102676581B1 (ko) 2024-06-20
CN113015345B (zh) 2023-11-03
US20210195759A1 (en) 2021-06-24
CN113015345A (zh) 2021-06-22
US11096288B2 (en) 2021-08-17

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