CN113015345B - 用于制造具有印刷外覆层的柔性导电印刷电路的方法 - Google Patents
用于制造具有印刷外覆层的柔性导电印刷电路的方法 Download PDFInfo
- Publication number
- CN113015345B CN113015345B CN202011289223.6A CN202011289223A CN113015345B CN 113015345 B CN113015345 B CN 113015345B CN 202011289223 A CN202011289223 A CN 202011289223A CN 113015345 B CN113015345 B CN 113015345B
- Authority
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- China
- Prior art keywords
- printed circuit
- mixture
- tpu
- centipoise
- conductive printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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- 239000002904 solvent Substances 0.000 claims abstract description 31
- 238000007639 printing Methods 0.000 claims abstract description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 27
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 21
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- 239000011521 glass Substances 0.000 claims description 9
- -1 polyethylene terephthalate Polymers 0.000 claims description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011111 cardboard Substances 0.000 claims description 4
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
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- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 claims description 2
- WVJDEAVPVAFGLE-UHFFFAOYSA-N 3-(3-methoxypropoxy)propyl acetate Chemical compound COCCCOCCCOC(C)=O WVJDEAVPVAFGLE-UHFFFAOYSA-N 0.000 claims description 2
- CCTFMNIEFHGTDU-UHFFFAOYSA-N 3-methoxypropyl acetate Chemical compound COCCCOC(C)=O CCTFMNIEFHGTDU-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 2
- 239000011929 di(propylene glycol) methyl ether Substances 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 239000000976 ink Substances 0.000 description 30
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- 239000004020 conductor Substances 0.000 description 5
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000012634 optical imaging Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
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- 241000699670 Mus sp. Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
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- 229920002635 polyurethane Polymers 0.000 description 1
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- 239000011148 porous material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ink Jet (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/722,983 US11096288B2 (en) | 2019-12-20 | 2019-12-20 | Flexible conductive printed circuits with printed overcoats |
| US16/722983 | 2019-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113015345A CN113015345A (zh) | 2021-06-22 |
| CN113015345B true CN113015345B (zh) | 2023-11-03 |
Family
ID=73698733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011289223.6A Active CN113015345B (zh) | 2019-12-20 | 2020-11-17 | 用于制造具有印刷外覆层的柔性导电印刷电路的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11096288B2 (enExample) |
| EP (1) | EP3840550A1 (enExample) |
| JP (1) | JP7423496B2 (enExample) |
| KR (1) | KR102676581B1 (enExample) |
| CN (1) | CN113015345B (enExample) |
| CA (1) | CA3102084C (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI824277B (zh) * | 2021-08-06 | 2023-12-01 | 友達光電股份有限公司 | 顯示裝置及其製造方法 |
| US12198835B2 (en) * | 2021-12-02 | 2025-01-14 | Aptiv Technologies AG | Apparatus and method for selective application of abrasion resistant or noise abatement coating to a flexible electrical circuit |
| US12340924B2 (en) | 2021-12-02 | 2025-06-24 | Aptiv Technologies AG | Integrated flexible circuit attachment features with sound dampening and method of forming said features |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5652286A (en) * | 1995-02-03 | 1997-07-29 | Videojet Systems International, Inc. | Wet surface marking jet ink |
| CN1965039A (zh) * | 2004-05-27 | 2007-05-16 | 株式会社Pi技术研究所 | 印刷用嵌段共聚聚酰亚胺油墨组合物 |
| DE102010040867A1 (de) * | 2010-09-16 | 2012-03-22 | Robert Bosch Gmbh | Elektronikbauteil mit verbesserter Leitungsstruktur |
| DE102011100556A1 (de) * | 2011-01-25 | 2012-07-26 | Jörg R. Bauer | Verfahren zur Herstellung von dauerhaft leitfähigen, digital erzeugten, Funktionsschichten auf der Oberfläche eines elastischen Substrates |
| WO2018217682A1 (en) * | 2017-05-23 | 2018-11-29 | Alpha Assembly Solutions Inc. | Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0137007B1 (ko) * | 1992-09-25 | 1998-04-24 | 고우노 사토시 | 전도도료 및 그것을 이용한 프린트 회로기판 및 전자파 차폐부착 플렉시블 프린트 회로 형성체 |
| US20030157276A1 (en) * | 2002-02-06 | 2003-08-21 | Eastman Kodak Company | Ink recording element |
| US7150522B2 (en) * | 2002-12-04 | 2006-12-19 | Hewlett-Packard Development Company, L.P. | Sealable topcoat for porous media |
| JP4290510B2 (ja) * | 2003-08-22 | 2009-07-08 | 太陽インキ製造株式会社 | インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板 |
| JP2005183805A (ja) | 2003-12-22 | 2005-07-07 | Canon Inc | 電気回路基体及びその製造方法 |
| US7572481B2 (en) * | 2003-12-22 | 2009-08-11 | Canon Kabushiki Kaisha | Pattern forming method and pattern forming apparatus |
| GB0414847D0 (en) * | 2004-07-02 | 2004-08-04 | Avecia Ltd | Process |
| KR100983838B1 (ko) * | 2005-04-06 | 2010-09-27 | 아크조 노벨 엔.브이. | 투명 전도성 산화물의 무기 코팅을 갖는 호일 조각의 제조 방법 |
| KR100827312B1 (ko) * | 2006-10-02 | 2008-05-06 | 삼성전기주식회사 | 인쇄회로기판의 커버레이 형성방법 |
| JP5735238B2 (ja) * | 2010-09-02 | 2015-06-17 | 積水化学工業株式会社 | インクジェット用硬化性組成物及びプリント配線板の製造方法 |
| JP6066558B2 (ja) | 2010-09-22 | 2017-01-25 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
| JP5969208B2 (ja) | 2010-09-22 | 2016-08-17 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
| US20140035995A1 (en) * | 2010-12-07 | 2014-02-06 | Sun Chemical Corporation | Aerosol jet printable metal conductive inks, glass coated metal conductive inks and uv-curable dielectric inks and methods of preparing and printing the same |
| JP6082516B2 (ja) * | 2011-09-27 | 2017-02-15 | 積水化学工業株式会社 | 電子部品の製造方法 |
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| JP6263138B2 (ja) | 2015-02-12 | 2018-01-17 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
| JP2017069344A (ja) * | 2015-09-29 | 2017-04-06 | 日本シイエムケイ株式会社 | プリント配線板およびその製造方法 |
| WO2017169624A1 (ja) | 2016-03-31 | 2017-10-05 | 太陽インキ製造株式会社 | 硬化装置およびソルダーレジストの製造方法 |
| CN110234688B (zh) * | 2017-03-27 | 2022-04-12 | 株式会社Lg化学 | 热塑性聚氨酯膜及其制备方法 |
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-
2019
- 2019-12-20 US US16/722,983 patent/US11096288B2/en active Active
-
2020
- 2020-11-17 CN CN202011289223.6A patent/CN113015345B/zh active Active
- 2020-11-26 KR KR1020200161230A patent/KR102676581B1/ko active Active
- 2020-11-30 JP JP2020198170A patent/JP7423496B2/ja active Active
- 2020-12-03 EP EP20211709.9A patent/EP3840550A1/en not_active Withdrawn
- 2020-12-09 CA CA3102084A patent/CA3102084C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5652286A (en) * | 1995-02-03 | 1997-07-29 | Videojet Systems International, Inc. | Wet surface marking jet ink |
| CN1965039A (zh) * | 2004-05-27 | 2007-05-16 | 株式会社Pi技术研究所 | 印刷用嵌段共聚聚酰亚胺油墨组合物 |
| DE102010040867A1 (de) * | 2010-09-16 | 2012-03-22 | Robert Bosch Gmbh | Elektronikbauteil mit verbesserter Leitungsstruktur |
| DE102011100556A1 (de) * | 2011-01-25 | 2012-07-26 | Jörg R. Bauer | Verfahren zur Herstellung von dauerhaft leitfähigen, digital erzeugten, Funktionsschichten auf der Oberfläche eines elastischen Substrates |
| WO2018217682A1 (en) * | 2017-05-23 | 2018-11-29 | Alpha Assembly Solutions Inc. | Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210080205A (ko) | 2021-06-30 |
| EP3840550A1 (en) | 2021-06-23 |
| CA3102084A1 (en) | 2021-06-20 |
| CA3102084C (en) | 2023-11-14 |
| KR102676581B1 (ko) | 2024-06-20 |
| JP2021098193A (ja) | 2021-07-01 |
| US20210195759A1 (en) | 2021-06-24 |
| JP7423496B2 (ja) | 2024-01-29 |
| CN113015345A (zh) | 2021-06-22 |
| US11096288B2 (en) | 2021-08-17 |
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