JP2021098193A - 印刷された保護膜を有する可撓性導電性印刷回路 - Google Patents
印刷された保護膜を有する可撓性導電性印刷回路 Download PDFInfo
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Abstract
Description
インクジェットプリンタの例
エアロゾルジェットプリンタの例
Claims (20)
- 印刷された保護膜を有する可撓性導電性印刷回路を製造するための方法であって、
可撓性基材上に導電性印刷回路線を形成することと、
前記導電性印刷回路線が形成される前記可撓性基材上の位置を検出することと、
前記可撓性基材上で検出される前記位置において、前記導電性印刷回路線上に保護膜を印刷することであって、前記保護膜が、熱可塑性ポリウレタン(TPU)と溶媒との混合物を含み、前記混合物が1センチポアズ〜2,000センチポアズの粘度を有することにより、前記混合物が印刷可能である、ことと、を含む、方法。 - 前記検出することが、前記可撓性基材上に前記導電性印刷回路線を形成する間にメモリ内に記憶された前記位置に基づく、請求項1に記載の方法。
- 前記保護膜が、前記導電性印刷回路線のおよその幅に印刷される、請求項1に記載の方法。
- 前記印刷が、インクジェットプリンタ又はエアロゾルジェットプリンタによって実行される、請求項1に記載の方法。
- 前記混合物の粘度が、前記インクジェットプリンタを介して分配される約1センチポアズ〜40センチポアズを含む、請求項4に記載の方法。
- 前記TPUがTPU分散体であり、TPU対溶媒の比が約1:1〜1:20の範囲である、請求項5に記載の方法。
- 前記混合物の粘度が、エアロゾルジェットプリンタを介して分配される約1センチポアズ〜2,000センチポアズを含む、請求項4に記載の方法。
- 前記TPUがTPU分散体であり、TPU対溶媒の比が約10:1〜1:20の範囲である、請求項7に記載の方法。
- 前記溶媒が高沸点溶媒を含む、請求項1に記載の方法。
- 前記保護膜を硬化することを更に含む、請求項1に記載の方法。
- 複数の命令を記憶する非一時的コンピュータ可読媒体であって、前記命令は、プロセッサによって実行されると、前記プロセッサに、印刷された保護膜を有する可撓性導電性印刷回路を製造するための動作を実行させ、前記動作が、
可撓性基材上に導電性印刷回路線を形成することと、
前記導電性印刷回路線が形成される前記可撓性基材上の位置を検出することと、
前記可撓性基材上で検出される前記位置において、前記導電性印刷回路線上に保護膜を印刷することであって、前記保護膜が、熱可塑性ポリウレタン(TPU)と溶媒との混合物を含み、前記混合物が1センチポアズ〜2,000センチポアズの粘度を有することにより、前記混合物が印刷可能である、ことと、を含む、非一時的コンピュータ可読媒体。 - 前記検出することが、前記可撓性基材上に前記導電性印刷回路線を形成する間にメモリに記憶された前記位置に基づく、請求項11に記載の非一時的コンピュータ可読媒体。
- 前記保護膜が、前記導電性印刷回路線のおよその幅に印刷される、請求項11に記載の非一時的コンピュータ可読媒体。
- 前記印刷が、インクジェットプリンタ又はエアロゾルジェットプリンタによって実行される、請求項11に記載の非一時的コンピュータ可読媒体。
- 前記混合物の粘度が、前記インクジェットプリンタを介して分配される約1センチポアズ〜40センチポアズを含む、請求項14に記載の非一時的コンピュータ可読媒体。
- 前記TPUがTPU分散体であり、TPU対溶媒の比が1:1〜1:20の範囲である、請求項15に記載の非一時的コンピュータ可読媒体。
- 前記混合物の粘度が、前記エアロゾルジェットプリンタを介して分配される約1センチポアズ〜2,000センチポアズを含む、請求項14に記載の非一時的コンピュータ可読媒体。
- 前記TPUがTPU分散体であり、TPU対溶媒の比が約10:1〜1:20の範囲である、請求項17に記載の非一時的コンピュータ可読媒体。
- 前記保護膜を硬化することを更に含む、請求項11に記載の非一時的コンピュータ可読媒体。
- 印刷された保護膜を有する可撓性導電性印刷回路を製造するための方法であって、
可撓性基材上に導電性印刷回路線を形成することであって、前記可撓性基材が、カートンボード、ガラス、ポリエチレンテレフタレート、ポリカーボネート、ポリエチレンナフタレート、ポリスチレン、ポリエチレン、ポリメチルメタクリレート、ポリ(塩化ビニル)、又はセルロースのうちの少なくとも1つを含む、工程と、
前記導電性印刷回路線の位置をインクジェットプリンタ又はエアロゾルジェットプリンタのメモリに搭載することと、
保護膜を用いて前記インクジェットプリンタ又は前記エアロゾルプリンタを充填する工程であって、前記保護膜が、熱可塑性ポリウレタン(TPU)と溶媒との混合物を含み、前記混合物が1センチポアズ〜2,000センチポアズの粘度を有することにより、前記混合物が印刷可能である、工程と、
プロセッサを介して、前記インクジェットプリンタ又は前記エアロゾルジェットプリンタを制御して、前記保護膜を前記導電性印刷回路線の前記位置に分配することと、
前記保護膜を硬化することと、
を含む、方法。
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TWI824277B (zh) * | 2021-08-06 | 2023-12-01 | 友達光電股份有限公司 | 顯示裝置及其製造方法 |
US20230178264A1 (en) * | 2021-12-02 | 2023-06-08 | Aptiv Technologies Limited | Integrated flexible circuit attachment features with sound dampening and method of forming said features |
US20230187101A1 (en) * | 2021-12-02 | 2023-06-15 | Aptiv Technologies Limited | Apparatus and method for selective application of abrasion resistant or noise abatement coating to a flexible electrical circuit |
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KR0137007B1 (ko) * | 1992-09-25 | 1998-04-24 | 고우노 사토시 | 전도도료 및 그것을 이용한 프린트 회로기판 및 전자파 차폐부착 플렉시블 프린트 회로 형성체 |
DE69603256T2 (de) * | 1995-02-03 | 1999-11-11 | Videojet Systems Int | Tintenzusammensetzung |
US20030157276A1 (en) * | 2002-02-06 | 2003-08-21 | Eastman Kodak Company | Ink recording element |
US7150522B2 (en) * | 2002-12-04 | 2006-12-19 | Hewlett-Packard Development Company, L.P. | Sealable topcoat for porous media |
US7572481B2 (en) * | 2003-12-22 | 2009-08-11 | Canon Kabushiki Kaisha | Pattern forming method and pattern forming apparatus |
JP2005183805A (ja) | 2003-12-22 | 2005-07-07 | Canon Inc | 電気回路基体及びその製造方法 |
JPWO2005116152A1 (ja) * | 2004-05-27 | 2008-04-03 | 株式会社ピーアイ技術研究所 | 印刷用ブロック共重合ポリイミドインク組成物 |
GB0414847D0 (en) * | 2004-07-02 | 2004-08-04 | Avecia Ltd | Process |
JP2008537643A (ja) * | 2005-04-06 | 2008-09-18 | アクゾ ノーベル ナムローゼ フェンノートシャップ | たとえばtcoの無機コーティングを有する箔片の製造方法 |
KR100827312B1 (ko) * | 2006-10-02 | 2008-05-06 | 삼성전기주식회사 | 인쇄회로기판의 커버레이 형성방법 |
DE102010040867A1 (de) * | 2010-09-16 | 2012-03-22 | Robert Bosch Gmbh | Elektronikbauteil mit verbesserter Leitungsstruktur |
KR101521362B1 (ko) | 2010-09-22 | 2015-05-18 | 세키스이가가쿠 고교가부시키가이샤 | 잉크젯용 경화성 조성물 및 전자 부품의 제조 방법 |
JP6066558B2 (ja) | 2010-09-22 | 2017-01-25 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
US20140035995A1 (en) * | 2010-12-07 | 2014-02-06 | Sun Chemical Corporation | Aerosol jet printable metal conductive inks, glass coated metal conductive inks and uv-curable dielectric inks and methods of preparing and printing the same |
DE102011100556A1 (de) * | 2011-01-25 | 2012-07-26 | Jörg R. Bauer | Verfahren zur Herstellung von dauerhaft leitfähigen, digital erzeugten, Funktionsschichten auf der Oberfläche eines elastischen Substrates |
US9357640B2 (en) * | 2014-09-22 | 2016-05-31 | Oce'-Technologies B.V. | Method of manufacturing a multi-layer printed circuit board |
JP6263138B2 (ja) | 2015-02-12 | 2018-01-17 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
WO2017169624A1 (ja) | 2016-03-31 | 2017-10-05 | 太陽インキ製造株式会社 | 硬化装置およびソルダーレジストの製造方法 |
CN110234688B (zh) * | 2017-03-27 | 2022-04-12 | 株式会社Lg化学 | 热塑性聚氨酯膜及其制备方法 |
US11624000B2 (en) * | 2017-05-23 | 2023-04-11 | Alpha Assembly Solutions Inc. | Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
US20190117124A1 (en) * | 2017-10-19 | 2019-04-25 | MedicusTek, Inc. | Sensor pad for monitoring user posture |
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US11096288B2 (en) | 2021-08-17 |
CN113015345A (zh) | 2021-06-22 |
CN113015345B (zh) | 2023-11-03 |
EP3840550A1 (en) | 2021-06-23 |
CA3102084A1 (en) | 2021-06-20 |
CA3102084C (en) | 2023-11-14 |
KR102676581B1 (ko) | 2024-06-20 |
JP7423496B2 (ja) | 2024-01-29 |
US20210195759A1 (en) | 2021-06-24 |
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