JP7419378B2 - 基板処理システムのガス供給システムにおけるハードウェア構成要素のためのソフトウェアエミュレータ - Google Patents

基板処理システムのガス供給システムにおけるハードウェア構成要素のためのソフトウェアエミュレータ Download PDF

Info

Publication number
JP7419378B2
JP7419378B2 JP2021535498A JP2021535498A JP7419378B2 JP 7419378 B2 JP7419378 B2 JP 7419378B2 JP 2021535498 A JP2021535498 A JP 2021535498A JP 2021535498 A JP2021535498 A JP 2021535498A JP 7419378 B2 JP7419378 B2 JP 7419378B2
Authority
JP
Japan
Prior art keywords
function
software
emulator
gas supply
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021535498A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021535626A5 (https=
JP2021535626A (ja
Inventor
プスト・ボストジャン
トリン・トム
フアン・チュン－ホー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2021535626A publication Critical patent/JP2021535626A/ja
Publication of JP2021535626A5 publication Critical patent/JP2021535626A5/ja
Application granted granted Critical
Publication of JP7419378B2 publication Critical patent/JP7419378B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44—Arrangements for executing specific programs
    • G06F9/455—Emulation; Interpretation; Software simulation, e.g. virtualisation or emulation of application or operating system execution engines
    • G06F9/45504—Abstract machines for programme code execution, e.g. Java virtual machine [JVM], interpreters, emulators
    • G06F9/45508—Runtime interpretation or emulation, e g. emulator loops, bytecode interpretation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/34—Recording or statistical evaluation of computer activity, e.g. of down time, of input/output operation ; Recording or statistical evaluation of user activity, e.g. usability assessment
    • G06F11/3466—Performance evaluation by tracing or monitoring
    • G06F11/3476—Data logging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44—Arrangements for executing specific programs
    • G06F9/455—Emulation; Interpretation; Software simulation, e.g. virtualisation or emulation of application or operating system execution engines
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/26—Functional testing
    • G06F11/261—Functional testing by simulating additional hardware, e.g. fault simulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/04—Program control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Program control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0428—Safety, monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Debugging And Monitoring (AREA)
  • Flow Control (AREA)
  • Automation & Control Theory (AREA)
JP2021535498A 2018-09-04 2019-08-30 基板処理システムのガス供給システムにおけるハードウェア構成要素のためのソフトウェアエミュレータ Active JP7419378B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/120,846 US11429409B2 (en) 2018-09-04 2018-09-04 Software emulator for hardware components in a gas delivery system of substrate processing system
US16/120,846 2018-09-04
PCT/US2019/049055 WO2020051084A1 (en) 2018-09-04 2019-08-30 Software emulator for hardware components in a gas delivery system of substrate processing system

Publications (3)

Publication Number Publication Date
JP2021535626A JP2021535626A (ja) 2021-12-16
JP2021535626A5 JP2021535626A5 (https=) 2022-10-14
JP7419378B2 true JP7419378B2 (ja) 2024-01-22

Family

ID=69639902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021535498A Active JP7419378B2 (ja) 2018-09-04 2019-08-30 基板処理システムのガス供給システムにおけるハードウェア構成要素のためのソフトウェアエミュレータ

Country Status (6)

Country Link
US (1) US11429409B2 (https=)
JP (1) JP7419378B2 (https=)
KR (1) KR102929521B1 (https=)
CN (1) CN112654994A (https=)
TW (1) TWI816872B (https=)
WO (1) WO2020051084A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120752745A (zh) * 2023-09-21 2025-10-03 株式会社国际电气 基板处理装置、基板处理方法、半导体装置的制造方法、气体供给系统以及气体供给程序
CN117329448A (zh) * 2023-10-17 2024-01-02 江苏超微半导体科技有限公司 一种半导体制造用超纯气体输送系统集成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216003A (ja) 1999-10-04 2001-08-10 Fisher Rosemount Syst Inc プロセス制御システムにおける統合されたアドバンスド制御ブロック
JP2004014927A (ja) 2002-06-10 2004-01-15 Tokyo Electron Ltd 半導体製造装置のシミュレーション装置、及び該シミュレーション装置を備える半導体製造装置
US20090326903A1 (en) 2007-12-04 2009-12-31 Ludwig Lester F Software controlled lab-on-a-chip emulation
JP2014157458A (ja) 2013-02-15 2014-08-28 Tokyo Electron Ltd 基板処理装置、シミュレーション装置、プログラムおよびシミュレーション方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6772017B1 (en) * 2000-01-20 2004-08-03 Fisher-Rosemount Systems, Inc. Tool for configuring and managing a process control network including the use of spatial information
US7474929B2 (en) * 2000-01-20 2009-01-06 Fisher-Rosemount Systems, Inc. Enhanced tool for managing a process control network
US6622286B1 (en) * 2000-06-30 2003-09-16 Lam Research Corporation Integrated electronic hardware for wafer processing control and diagnostic
US6802045B1 (en) * 2001-04-19 2004-10-05 Advanced Micro Devices, Inc. Method and apparatus for incorporating control simulation environment
TW538328B (en) * 2001-04-27 2003-06-21 Mykrolis Corp System and method for filtering output in mass flow controllers and mass flow meters
US6973375B2 (en) * 2004-02-12 2005-12-06 Mykrolis Corporation System and method for flow monitoring and control
US7184847B2 (en) * 2004-12-17 2007-02-27 Texaco Inc. Method and system for controlling a process in a plant
US20060163220A1 (en) * 2005-01-27 2006-07-27 Brandt Aaron D Automatic gas control for a plasma arc torch
US20080031085A1 (en) * 2005-09-01 2008-02-07 Mclaughlin Jon K Control system for and method of combining materials
US7640078B2 (en) * 2006-07-05 2009-12-29 Advanced Energy Industries, Inc. Multi-mode control algorithm
KR101722304B1 (ko) * 2006-10-03 2017-03-31 가부시키가이샤 호리바 에스텍 매스 플로우 컨트롤러
JP2010161259A (ja) 2009-01-09 2010-07-22 Toshiba Corp プロセスシミュレーションプログラム、プロセスシミュレーション方法、プロセスシミュレータ
CN102096420B (zh) * 2009-12-15 2015-01-14 株式会社堀场Stec 质量流量控制器
JP4681082B1 (ja) * 2010-06-16 2011-05-11 株式会社システムブイ 装置パラメータ設定支援システム
JP5607501B2 (ja) * 2010-11-08 2014-10-15 株式会社堀場エステック マスフローコントローラ
US9958302B2 (en) * 2011-08-20 2018-05-01 Reno Technologies, Inc. Flow control system, method, and apparatus
US9027585B2 (en) * 2011-12-13 2015-05-12 Hitachi Metals, Ltd. Adaptive pressure insensitive mass flow controller and method for multi-gas applications
US9846585B2 (en) * 2013-05-14 2017-12-19 Rockwell Automation Technologies, Inc. System and method for emulation of an automation control system
CN106103796B (zh) * 2014-03-13 2019-10-22 Mks 仪器公司 用于快速脉冲气体输送的系统和方法
US20180120864A1 (en) * 2015-05-07 2018-05-03 Illinois Tool Works Inc. Nonlinear control of mass flow controller devices using sliding mode
GB2544098B (en) * 2015-11-06 2021-02-24 Solution Seeker As Assessment of flow networks
US10497542B2 (en) * 2016-01-04 2019-12-03 Daniel T. Mudd Flow control showerhead with integrated flow restrictors for improved gas delivery to a semiconductor process
US10453721B2 (en) * 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US10360336B2 (en) * 2016-10-27 2019-07-23 The Regents Of The University Of California Microfluidics planar placement and routing algorithm
KR101853361B1 (ko) * 2016-11-29 2018-04-30 세메스 주식회사 기판 처리 설비 시뮬레이션 시스템 및 방법
WO2018116335A1 (ja) * 2016-12-19 2018-06-28 東芝三菱電機産業システム株式会社 ガス発生装置
CN108444874A (zh) 2018-03-30 2018-08-24 中南大学 一种模拟室内火灾烟气测定可视化试验平台及测定方法
US11144042B2 (en) * 2018-07-09 2021-10-12 Rockwell Automation Technologies, Inc. Industrial automation information contextualization method and system
JP2020021176A (ja) * 2018-07-30 2020-02-06 株式会社堀場エステック 流量制御装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216003A (ja) 1999-10-04 2001-08-10 Fisher Rosemount Syst Inc プロセス制御システムにおける統合されたアドバンスド制御ブロック
JP2004014927A (ja) 2002-06-10 2004-01-15 Tokyo Electron Ltd 半導体製造装置のシミュレーション装置、及び該シミュレーション装置を備える半導体製造装置
US20090326903A1 (en) 2007-12-04 2009-12-31 Ludwig Lester F Software controlled lab-on-a-chip emulation
JP2014157458A (ja) 2013-02-15 2014-08-28 Tokyo Electron Ltd 基板処理装置、シミュレーション装置、プログラムおよびシミュレーション方法

Also Published As

Publication number Publication date
TW202026918A (zh) 2020-07-16
KR20210042413A (ko) 2021-04-19
KR102929521B1 (ko) 2026-02-20
WO2020051084A1 (en) 2020-03-12
US20200073685A1 (en) 2020-03-05
US11429409B2 (en) 2022-08-30
TWI816872B (zh) 2023-10-01
JP2021535626A (ja) 2021-12-16
CN112654994A (zh) 2021-04-13

Similar Documents

Publication Publication Date Title
JP7311253B2 (ja) 半導体製造装置のためのユーザ相互作用を自動化するシステムおよび方法
JP7058953B2 (ja) 基板処理システムにおける再循環を低減するためのカラー、円錐形シャワーヘッド、および／または、トッププレート
JP4969446B2 (ja) 仮想モジュールを用いた半導体処理方法
JP5033627B2 (ja) 仮想モジュールを用いた半導体処理方法
CN103533020A (zh) 在生产环境中用于客户特定测试系统分配的方法及系统
TWI381468B (zh) 線上微影及蝕刻系統
JP7419378B2 (ja) 基板処理システムのガス供給システムにおけるハードウェア構成要素のためのソフトウェアエミュレータ
KR101165791B1 (ko) 측정된 전기적 특성에 기초한 제조 공정 제어 방법 및 장치
JP2004047885A (ja) 半導体製造装置のモニタリングシステム及びモニタリング方法
JP2018162513A (ja) 基板処理システムの前駆体蒸気供給システムにおけるフロー監視のためのシステム及び方法
JP6976043B2 (ja) 原子層堆積中における化学物質の制御された分離および送出により低欠陥処理を可能にするシステムおよび方法
KR102392734B1 (ko) 프로세스 모듈의 서브시스템들의 액티브 피드백 제어
Holfeld et al. A fab-wide APC sampling application
JP2020520099A (ja) 基板処理システムのための温度調節された基板支持体
US7103439B1 (en) Method and apparatus for initializing tool controllers based on tool event data
US7783455B1 (en) Methods and systems for analyzing process equipment processing variations using sensor data
US6968252B1 (en) Method and apparatus for dispatching based on metrology tool performance
CN121175633A (zh) 用于衬底处理系统的处理调整系统
Moyne et al. Derivation of a Piggyback Run-to-Run Control Solution Design
KR20250044419A (ko) 챔버 재부팅 및 정전 인스턴스 동안 일정한 클램핑 압력을 유지하기 위한 시스템 및 방법
Mercier et al. Achieving optimal cycle time improvement in a 300-mm semiconductor fab using dynamic simulation and design of experiments

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210511

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220823

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220928

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20230815

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230822

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231212

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240110

R150 Certificate of patent or registration of utility model

Ref document number: 7419378

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150