JP7409029B2 - 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法 - Google Patents

半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法 Download PDF

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JP7409029B2
JP7409029B2 JP2019206920A JP2019206920A JP7409029B2 JP 7409029 B2 JP7409029 B2 JP 7409029B2 JP 2019206920 A JP2019206920 A JP 2019206920A JP 2019206920 A JP2019206920 A JP 2019206920A JP 7409029 B2 JP7409029 B2 JP 7409029B2
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adhesive layer
adhesive
region
dicing
meth
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JP2021082648A (ja
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強 田澤
尚弘 木村
修一 森
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Priority to JP2019206920A priority Critical patent/JP7409029B2/ja
Priority to KR1020227016995A priority patent/KR20220100885A/ko
Priority to CN202080078717.1A priority patent/CN114730706A/zh
Priority to PCT/JP2020/027885 priority patent/WO2021095302A1/ja
Priority to TW109124634A priority patent/TW202121513A/zh
Publication of JP2021082648A publication Critical patent/JP2021082648A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
JP2019206920A 2019-11-15 2019-11-15 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法 Active JP7409029B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019206920A JP7409029B2 (ja) 2019-11-15 2019-11-15 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法
KR1020227016995A KR20220100885A (ko) 2019-11-15 2020-07-17 반도체 장치의 제조 방법, 및 다이싱·다이본딩 일체형 필름 및 그 제조 방법
CN202080078717.1A CN114730706A (zh) 2019-11-15 2020-07-17 半导体装置的制造方法、以及切割晶粒接合一体型膜及其制造方法
PCT/JP2020/027885 WO2021095302A1 (ja) 2019-11-15 2020-07-17 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法
TW109124634A TW202121513A (zh) 2019-11-15 2020-07-21 半導體裝置的製造方法、以及切晶黏晶一體型膜及其製造方法

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JP2019206920A JP7409029B2 (ja) 2019-11-15 2019-11-15 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法

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JP2021082648A JP2021082648A (ja) 2021-05-27
JP7409029B2 true JP7409029B2 (ja) 2024-01-09

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KR (1) KR20220100885A (zh)
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WO (1) WO2021095302A1 (zh)

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Publication number Priority date Publication date Assignee Title
JPWO2022255322A1 (zh) * 2021-06-02 2022-12-08
WO2023047594A1 (ja) * 2021-09-27 2023-03-30 昭和電工マテリアルズ株式会社 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
WO2023157195A1 (ja) * 2022-02-17 2023-08-24 株式会社レゾナック ダイシングダイボンディングフィルム、及び、半導体装置を製造する方法
DE112022004060T5 (de) 2022-04-27 2024-08-01 Yamaha Hatsudoki Kabushiki Kaisha Aufweitungsvorrichtung, Verfahren zur Herstellung von Halbleiterchips und Halbleiterchip
CN117410242A (zh) * 2022-07-08 2024-01-16 长鑫存储技术有限公司 半导体封装组件及制备方法

Citations (10)

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Publication number Priority date Publication date Assignee Title
JP2004134689A (ja) 2002-10-15 2004-04-30 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005268434A (ja) 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
WO2008047610A1 (fr) 2006-10-06 2008-04-24 Sumitomo Bakelite Company Limited Film pour semi-conducteur, procédé de production de film pour semi-conducteur et dispositif à semiconducteurs
JP2012069586A (ja) 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
JP2012182268A (ja) 2011-03-01 2012-09-20 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2016072546A (ja) 2014-10-01 2016-05-09 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
WO2017191815A1 (ja) 2016-05-02 2017-11-09 日立化成株式会社 仮固定用樹脂フィルム
JP2018107386A (ja) 2016-12-28 2018-07-05 日立化成株式会社 ダイシング用粘着シート及びその製造方法、ダイシングダイボンディング一体型シート、並びに、半導体装置の製造方法
JP2019114599A (ja) 2017-12-21 2019-07-11 日立化成株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
WO2019221246A1 (ja) 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134689A (ja) 2002-10-15 2004-04-30 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005268434A (ja) 2004-03-17 2005-09-29 Nitto Denko Corp ダイシング・ダイボンドフィルム
WO2008047610A1 (fr) 2006-10-06 2008-04-24 Sumitomo Bakelite Company Limited Film pour semi-conducteur, procédé de production de film pour semi-conducteur et dispositif à semiconducteurs
JP2012069586A (ja) 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
JP2012182268A (ja) 2011-03-01 2012-09-20 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2016072546A (ja) 2014-10-01 2016-05-09 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
WO2017191815A1 (ja) 2016-05-02 2017-11-09 日立化成株式会社 仮固定用樹脂フィルム
JP2018107386A (ja) 2016-12-28 2018-07-05 日立化成株式会社 ダイシング用粘着シート及びその製造方法、ダイシングダイボンディング一体型シート、並びに、半導体装置の製造方法
JP2019114599A (ja) 2017-12-21 2019-07-11 日立化成株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
WO2019221246A1 (ja) 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法
WO2019220599A1 (ja) 2018-05-17 2019-11-21 日立化成株式会社 ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに、半導体装置の製造方法

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WO2021095302A1 (ja) 2021-05-20
KR20220100885A (ko) 2022-07-18
CN114730706A (zh) 2022-07-08
JP2021082648A (ja) 2021-05-27

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