JP7408356B2 - surface processing equipment - Google Patents

Description

The present disclosure relates to a surface processing device.

When a rotating grindstone is attached to a grinding machine and used, preliminary adjustment work such as truing and dressing is generally performed before processing a workpiece with the rotating grindstone. Truing is a process of aligning the center axis of a grinding wheel with the center axis of a spindle of a grinding machine to remove eccentricity of the grinding wheel (see Patent Document 1). Dressing is a process of adjusting the protrusion amount and shape of abrasive grains in the circumferential direction of the whetstone to improve the sharpness of the whetstone (see Patent Document 2).

JP2014-195862 JP2001-071266

Preliminary adjustment work sometimes required a considerable amount of time. In particular, when processing a minute amount using a rotary grindstone, the preliminary adjustment work may take a long time. Furthermore, the diameter of the rotating grindstone decreases as it is used to process a workpiece. Therefore, it sometimes takes time to adjust the position of the rotary grindstone relative to the surface of the workpiece. Therefore, these operations have affected the productivity of the processed products obtained by processing the workpieces.

Therefore, the present disclosure describes a surface processing device that can efficiently process a workpiece.

An example of a surface processing device includes a work holder including a first holding surface configured to hold a work, and a flat surface configured to grind or polish a surface of a work held in the work holder. It may also be equipped with a grindstone tool of the shape. An example of a surface processing device includes a tool holder including a second holding surface that faces the first holding surface and is configured to hold a grindstone tool, and at least one of the workpiece holder and the tool holder. It may further include a drive mechanism configured to move along the first holding surface or the second holding surface.

According to the surface processing apparatus according to the present disclosure, it is possible to efficiently process a workpiece.

FIG. 1 is a side view schematically showing an example of a surface processing apparatus. FIG. 2 is a top view of the surface processing apparatus of FIG. 1. FIG. 3 is an exploded perspective view schematically showing an example of a work holder and a tool holder. FIG. 4 is a sectional view showing an example of a grindstone tool. FIG. 5 is a perspective view schematically showing another example of the tool holding mechanism. FIG. 6 is a diagram for explaining an example of a method for adjusting the attitude of the main surface of the chuck in the tool holding mechanism of FIG. 5. FIG. FIG. 7 is a diagram for explaining an example of a method for adjusting the posture of the main surface of the chuck in the tool holding mechanism of FIG. 5. FIG.

An example of an embodiment according to the present disclosure will be described in more detail below with reference to the drawings. In the following description, the same elements or elements having the same function will be denoted by the same reference numerals, and redundant description will be omitted.

[Surface processing equipment configuration]
The surface processing apparatus 1 will be described with reference to FIGS. 1 to 4. As shown in FIGS. 1 and 2, the surface processing apparatus 1 is configured to process a workpiece W to be processed. The workpiece W may be, for example, a mold component used for punching a sheet-like base material (such as a thin metal plate), a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, and other various types. It may also be a substrate. The shape of the workpiece W may be, for example, a rectangular parallelepiped, a cylinder, a polygonal prism, a flat plate, or the like.

The surface processing apparatus 1 includes a workpiece holding mechanism 10, a tool holding mechanism 20, a transport mechanism 30, a spraying mechanism 40, a grindstone tool 50, and a controller Ctr.

The work holding mechanism 10 includes a base 11, a work holder 12, a drive mechanism 13, and a pump 14. The base 11 is configured to support the workpiece holder 12 from below. The workpiece holder 12 is attached to the base 11 so as to be movable on the base 11 along a horizontal plane.

As shown in FIG. 3, the workpiece holder 12 includes a housing body 12a and a chuck 12b. The housing body 12a is configured to be able to house the chuck 12b therein. The housing body 12a has, for example, a cylindrical shape with a bottom, and may include an opening opened upward. The opening of the chuck 12b may have a shape corresponding to the outer shape of the chuck 12b, and may have a rectangular shape when viewed from above, for example.

As shown in FIG. 3, at least one protrusion 12c may be arranged on the bottom surface of the housing main body 12a. The protrusion 12c may be configured to come into contact with the back surface S2 of the chuck 12b and support the chuck 12b when the chuck 12b is housed in the housing body 12a. The number, arrangement, shape, etc. of the protrusions 12c are not particularly limited as long as they do not interfere with the flow of gas on the bottom surface of the housing body 12a.

The chuck 12b is configured to hold the workpiece W on the main surface S1 (first holding surface), as shown in FIGS. 1 and 2. The chuck 12b is provided with a plurality of pores extending vertically from the main surface S1 to the back surface S2. The chuck 12b may be a porous body. The chuck 12b may be made of a highly rigid material, for example, ceramics such as alumina.

As shown in FIG. 1, the drive mechanism 13 is configured to move the workpiece holder 12 on the base 11 based on instructions from the controller Ctr. The drive mechanism 13 may be, for example, a linear actuator.

The pump 14 is fluidly connected to the bottom surface of the housing body 12a through piping or the like. The pump 14 may be fluidly connected to multiple locations on the bottom surface of the housing body 12a. The pump 14 is configured to suck gas from inside the housing body 12a based on instructions from the controller Ctr. Therefore, when the pump 14 operates, air around the main surface S1 is sucked through the pores of the chuck 12b, and the vicinity of the main surface S1 becomes negative pressure. Therefore, when the pump 14 operates with the workpiece W placed on the main surface S1, the workpiece W is attracted to the main surface S1.

The tool holding mechanism 20 includes a base 21, a tool holder 22, a drive mechanism 23, and a pump 24, as shown in FIGS. 1 and 2. Base 21 is configured to support tool holder 22 . The tool holder 22 is attached to the base 21 so as to be movable on the base 21 in the vertical direction.

As shown in FIG. 3, the tool holder 22 includes a housing body 22a and a chuck 22b. The housing body 22a is configured to be able to house the chuck 22b therein. The housing main body 22a has, for example, a cylindrical shape with a bottom, and may include an opening opened downward. The opening of the chuck 22b may have a shape corresponding to the outer shape of the chuck 22b, and may have a rectangular shape when viewed from below, for example.

As shown in FIG. 3, at least one protrusion 22c may be arranged on the bottom surface of the housing main body 22a. The protrusion 22c may be configured to come into contact with the back surface S4 of the chuck 22b and support the chuck 22b when the chuck 22b is housed in the housing body 22a. The number, arrangement, shape, etc. of the protrusions 22c are not particularly limited as long as they do not interfere with the flow of gas on the bottom surface of the housing body 22a.

The chuck 22b is configured to hold the grindstone tool 50 on the main surface S3 (second holding surface), as shown in FIGS. 1 and 2. With the chuck 22b housed in the housing body 22a, the main surface S3 of the chuck 22b faces the main surface S1 of the chuck 12b. The chuck 22b is provided with a plurality of pores extending vertically from the main surface S3 to the back surface S4. The chuck 22b may be a porous body. The chuck 22b may be made of a highly rigid material, for example, ceramics such as alumina.

As shown in FIG. 1, the drive mechanism 23 is configured to move the tool holder 22 up and down based on instructions from the controller Ctr. Therefore, the tool holder 22 approaches or separates from the work holder 12. The drive mechanism 23 may be, for example, a linear actuator.

The pump 24 is fluidly connected to the bottom surface of the housing body 22a by piping or the like. The pump 24 may be fluidly connected to multiple locations on the bottom surface of the housing body 22a. The pump 24 is configured to suck gas from inside the housing body 22a based on instructions from the controller Ctr. Therefore, when the pump 24 operates, air around the main surface S3 is sucked through the pores of the chuck 22b, and the vicinity of the main surface S3 becomes negative pressure. Therefore, when the pump 24 operates with the grindstone tool 50 in contact with the main surface S3, the grindstone tool 50 is attracted to the main surface S3.

The conveyance mechanism 30 is configured to convey the whetstone tool 50 in a predetermined direction when the whetstone tool 50 is a band-shaped film. The conveyance mechanism 30 includes a drive roller 31 and a driven roller 32. The drive roller 31 is configured to rotate based on instructions from the controller Ctr and wind up the grindstone tool 50. The driven roller 32 is configured to rotatably hold a whetstone tool 50 wound spirally around itself. Therefore, when the grindstone tool 50 is wound around the drive roller 31, the grindstone tool 50 is paid out from the driven roller 32 accordingly.

Spray mechanism 40 includes a liquid source 41, a pump 42, and a nozzle 43. The liquid source 41 is configured as a supply source of the liquid L. The liquid L may have a property of being easily vaporized when discharged from the nozzle 43. The liquid L may be, for example, water, alcohol, or a solvent. The solvent may be, for example, Zeorola (registered trademark) manufactured by Zeon Corporation.

The pump 42 is configured to suck the liquid L from the liquid source 41 and send the liquid L to the nozzle 43 via piping based on instructions from the controller Ctr. The nozzle 43 is arranged above the chuck 12b so that the discharge port faces the main surface S1 of the chuck 12b. The nozzle 43 is configured to spray the liquid L sent out from the pump 42 in the form of a mist.

The grindstone tool 50 is configured to come into contact with the surface of the work W to grind or polish the surface. The grindstone tool 50 includes a base material 51, a binder 52, and a plurality of abrasive grains 53, as shown in FIG. The base material 51 is a member that extends in a planar shape as a whole. The base material 51 may be a flexible film or a flat plate. When the base material 51 has a flat plate shape, the base material 51 may be made of, for example, ceramics such as alumina, stainless steel (SUS), or the like.

The binder 52 is configured to fix the plurality of abrasive grains 53 to the base material 51. The binder 52 may be appropriately selected depending on the material of the base material 51. When the base material 51 is in the form of a film, the binder 52 may be made of a polymeric material having high heat resistance, such as polyimide. When the base material 51 is flat, the binder 52 may be made of vitrified bond, for example.

The plurality of abrasive grains 53 are arranged on the surface of the base material 51 without overlapping each other. The material, average particle size, density, etc. of the abrasive grains 53 may be appropriately selected depending on the material of the workpiece W. The particle diameters of all the abrasive grains 53 arranged on the surface of the base material 51 may substantially match a predetermined reference value. In this case, since the heights of the plurality of abrasive grains 53 on the base material 51 are approximately the same, it becomes possible to process the workpiece W more precisely. "Substantially matching" here may refer to the case where the particle diameters of all the abrasive grains 53 are within ±20% of the reference value, or the case where the particle sizes of all the abrasive grains 53 are within ±20% of the reference value. It may also refer to a case where the diameter is within ±10% of the reference value.

[Operation of surface processing equipment]
Next, the operation of the surface processing apparatus 1 will be explained. First, the workpiece W is placed on the main surface S1 of the chuck 12b. In this state, the controller Ctr operates the pump 14. As a result, the pump 14 sucks air on the main surface S1 side through the internal space of the housing body 12a and the pores of the chuck 12b, so that the workpiece W on the main surface S1 is held by suction on the chuck 12b.

Next, when using the film-like grindstone tool 50, as shown in FIG. , the grindstone tool 50 is placed between the drive roller 31 and the driven roller 32. In this state, the controller Ctr operates the pump 24. As a result, the pump 24 sucks the air on the main surface S3 side through the internal space of the housing body 22a and the pores of the chuck 22b, so that the grindstone tool 50 that is in contact with the main surface S3 is held by suction on the chuck 22b.

Next, the controller Ctr operates the drive mechanism 23. As a result, the tool holder 22 is lowered to approach the workpiece holder 12. When the tip of the abrasive grain 53 of the grindstone tool 50 is located at a height position corresponding to the amount of processing of the workpiece W, the controller Ctr stops the drive mechanism 23.

Next, the controller Ctr operates the drive mechanism 13. As a result, the workpiece holder 12 moves on the base 11. The speed of the workpiece holder 12 relative to the base 11 may be, for example, about several meters/minute to ten meters/minute. At this time, the area of the surface of the workpiece W that is in contact with the abrasive grains 53 is ground or polished by the grindstone tool 50. Thereafter, when the entire surface of the workpiece W is processed, the controller Ctr stops the drive mechanism 13.

When the sharpness of the used area of the grindstone tool 50 that has come into contact with the workpiece W has deteriorated, the controller Ctr may operate the drive roller 31. In this case, the grindstone tool 50 is wound around the drive roller 31 by a predetermined length. Therefore, an unused area of the grindstone tool 50 is arranged on the main surface S3 of the chuck 22b. Therefore, it becomes possible to easily replace the used area of the grindstone tool 50 with an unused area.

While processing the workpiece W, the controller Ctr may operate the pump 42. In this case, the mist-like liquid L is sprayed onto the surface of the workpiece W being processed. The sprayed mist immediately evaporates around the workpiece W and removes heat from the workpiece W by the heat of vaporization. Therefore, it is possible to suppress heat generation of the workpiece W without substantially wetting the workpiece W and its surroundings.

[Effect]
According to the above example, since the non-rotating planar grindstone tool 50 is used to process the workpiece W, preliminary adjustment work such as truing and dressing is not required. Furthermore, since the height of the grindstone tool 50 is approximately constant with respect to the main surface S3 of the tool holder 22, positioning of the grindstone tool 50 with respect to the surface of the workpiece W is facilitated. Therefore, the preparation time for the grindstone tool 50 before machining the workpiece W is significantly shortened. Therefore, it becomes possible to process the workpiece W efficiently.

According to the above example, since the non-rotating planar grindstone tool 50 is used to process the workpiece W, the workpiece W can be processed even if the relative speed of the workpiece W to the grindstone tool 50 is relatively small. Therefore, heat is less likely to be generated between the grindstone tool 50 and the workpiece W, so a cooling liquid supply device for cooling the workpiece W is not required. Therefore, it is possible to downsize and simplify the surface processing apparatus 1.

In the above example, when the grindstone tool 50 includes the flexible film-like base material 51, the base material 51 follows the surface of the workpiece W and is easily deformed. Therefore, by processing the work W using the grindstone tool 50, it is possible to uniformly process the entire surface of the work W. On the other hand, when the grindstone tool 50 includes a flat base material 51, the base material 51 is difficult to deform. Therefore, by processing the work W using the grindstone tool 50, it is possible to obtain a surface of the work W with high flatness.

In the above example, when the grindstone tool 50 includes a flexible film-like base material 51, and the chuck 22b is made of a porous body provided with a large number of holes with a size on the order of microns. In this case, when the grindstone tool 50 is attracted to the chuck 22b, the surface of the grindstone tool 50 that faces the workpiece W is hardly deformed. Therefore, it becomes possible to process the workpiece W with higher precision.

[Modified example]
The disclosure herein should be considered to be illustrative in all respects and not restrictive. Various omissions, substitutions, changes, etc. may be made to the above examples without departing from the scope and gist of the claims.

(1) At least one of the work holder 12 and the tool holder 22 is moved by the drive mechanism 13 or the drive mechanism 23 to the main surface S1 or the main surface S3 (for example, a horizontal surface) so that the work W moves relative to the grindstone tool 50. ) may be moved along.

(2) When the sharpness of the whetstone tool 50 including the flat base material 51 deteriorates, the whetstone tool 50 can be removed by removing the used whetstone tool 50 from the chuck 22b and attaching a new whetstone tool 50 to the chuck 22b. may be exchanged.

(3) When the grindstone tool 50 includes a flexible film-like base material 51, the corners of the chuck 22b that intersect with the direction in which the grindstone tool 50 is conveyed by the conveyance mechanism 30 may be chamfered. In this case, the grindstone tool 50 is less likely to be caught on the corner of the chuck 22b, so that it is possible to smoothly transport the grindstone tool 50 while preventing damage to the grindstone tool 50. The chamfering process may be C-chamfering (a process in which corners are cut so that the corners have a tapered shape), or R-chamfering (a process in which corners are rounded (in order to have a curved surface shape)). ) may be a machining method that cuts the corners).

(4) The main surface S3 of the chuck 22b may be expanded so as to be substantially parallel to the main surface S1 of the chuck 12b, that is, to be substantially parallel to the traveling direction of the workpiece holder 12. . Here, with reference to FIGS. 5 to 7, the tool holding mechanism 20 is used to adjust the tool holder 22 so that the main surface S3 of the chuck 22b is substantially parallel to the main surface S1 of the chuck 12b. Here are some other examples. Another example of the tool holding mechanism 20 differs from the above example in the structure of the base 21.

The base 21 includes a first base part 21a, a second base part 21b, and a third base part 21c, as shown in FIGS. 5 to 7. The first base portion 21a is attached to a fixed wall (not shown) and is configured to support the second base portion 21b. In addition, in FIGS. 5 to 7, the axis extending in the vertical direction is referred to as the "Z-axis", and the axis extending in the direction where the first base part 21a and the second base part 21b are lined up and perpendicular to the "Z-axis" is referred to as the "Z-axis". The X-axis is defined as the "Y-axis", and the axis extending in a direction orthogonal to both the X-axis and the Z-axis is defined as the "Y-axis".

The second base portion 21b is arranged to overlap the main surface of the first base portion 21a, and is fastened to the first base portion 21a by bolts B1 to B3. The bolt B1 may be placed on the top of the second base portion 21b. The bolt B2 may be placed near one side edge of the second base portion 21b. The bolt B3 may be placed near the other side edge of the second base portion 21b. Adjustment bolts B4 and B5 for adjusting the attitude of the second base part 21b with respect to the first base part 21a are attached to the second base part 21b. The adjustment bolt B4 may be arranged at the upper part of the second base portion 21b. The adjustment bolt B5 may be arranged at the lower part of the second base portion 21b.

The third base portion 21c is arranged to overlap the main surface of the second base portion 21b, and is fastened to the second base portion 21b with bolts B6 and B7. The bolt B6 may be placed near one side edge of the third base portion 21c. The bolt B7 may be placed near the other side edge of the third base portion 21c. These bolts B6 and B7 are also configured as adjustment bolts for adjusting the attitude of the third base portion 21c with respect to the second base portion 21b. A tool holder 22 is fixed to the lower end of the third base portion 21c.

Next, referring to FIG. 6, when the main surface S3 is tilted clockwise with respect to the Y-axis, the attitude of the tool holder 22 (orientation of the main surface S3 of the chuck 22b) is adjusted around the Y-axis. This section explains how to do this. First, the bolts B2 and B3 are loosened and then temporarily tightened so that the second base part 21b is temporarily fixed to the first base part 21a by the bolts B2 and B3. Next, loosen bolt B1. Next, as shown in FIG. 6(a), the adjustment bolt B4 is tightened so that it protrudes from the second base portion 21b toward the first base portion 21a. As a result, as shown in FIG. 6(b), the second base portion 21b rotates counterclockwise with respect to the Y-axis with respect to the first base portion 21a. When the main surface S3 becomes substantially parallel to the main surface S1 of the chuck 12b, tightening of the adjustment bolt B4 is stopped. Thereafter, the bolt B1 is tightened, and then the bolts B2 and B3 are tightened to fix the second base part 21b to the first base part 21a.

On the other hand, although not shown, when the main surface S3 is tilted counterclockwise with respect to the Y-axis, the attitude of the tool holder 22 (orientation of the main surface S3 of the chuck 22b) is adjusted around the Y-axis. This section explains how to do this. First, the bolt B1 is loosened and then temporarily tightened so that the second base part 21b is temporarily fixed to the first base part 21a by the bolt B1. Next, loosen bolts B2 and B3. Next, the adjustment bolt B5 is tightened so that the adjustment bolt B5 protrudes from the second base portion 21b toward the first base portion 21a. Thereby, the second base part 21b rotates in the clockwise direction with respect to the Y-axis with respect to the first base part 21a. When the main surface S3 becomes substantially parallel to the main surface S1 of the chuck 12b, tightening of the adjustment bolt B5 is stopped. Thereafter, the bolts B2 and B3 are tightened, and then the bolt B1 is tightened to fix the second base part 21b to the first base part 21a.

Next, referring to FIG. 7, when the main surface S3 is inclined in the counterclockwise direction with respect to the X-axis, the attitude of the tool holder 22 (the orientation of the main surface S3 of the chuck 22b) around the X-axis is determined. Explain how to make adjustments. First, the bolt B6 is slightly loosened and then temporarily tightened so that the third base portion 21c is temporarily fixed to the second base portion 21b by the bolt B6. Next, loosen bolt B7. Next, as shown in FIG. 7(a), the third base portion 21c on the bolt B7 side is hit with a hammer or the like. Thereby, as shown in FIG. 7(b), the third base portion 21c rotates in the clockwise direction with respect to the X-axis with respect to the second base portion 21b. When the main surface S3 becomes substantially parallel to the main surface S1 of the chuck 12b, the bolt B7 is temporarily tightened. Thereafter, the bolt B6 is tightened and then the bolt B7 is tightened to fix the third base portion 21c to the second base portion 21b.

On the other hand, although not shown, when the principal surface S3 is tilted clockwise with respect to the X-axis, the attitude of the tool holder 22 (orientation of the principal surface S3 of the chuck 22b) is adjusted around the X-axis. Explain the method. First, the bolt B7 is slightly loosened and then temporarily tightened so that the third base portion 21c is temporarily fixed to the second base portion 21b by the bolt B7. Next, loosen bolt B6. Next, the third base portion 21c on the bolt B6 side is hit with a hammer or the like. Thereby, the third base portion 21c rotates in a counterclockwise direction with respect to the X-axis with respect to the second base portion 21b. When the main surface S3 becomes substantially parallel to the main surface S1 of the chuck 12b, the bolt B6 is temporarily tightened. Thereafter, the bolt B7 is tightened and then the bolt B6 is tightened to fix the third base portion 21c to the second base portion 21b.

Note that the attitude of the tool holder 22 around the Y-axis may be adjusted using three or more bolts. The attitude of the tool holder 22 around the X-axis may be adjusted using three or more bolts.

(5) The positional relationship between the workpiece W and the grindstone tool 50 is not particularly limited. For example, the workpiece W may be processed by the grindstone tool 50 while the workpiece W is positioned above the grindstone tool 50. For example, the workpiece W may be processed by the grindstone tool 50 in a state where the workpiece W and the grindstone tool 50 are lined up along the horizontal direction.

[Other examples]
Example 1. An example of the surface processing device (1) includes a workpiece holder (12) including a first holding surface (S1) configured to hold a workpiece (W), and a workpiece held by the workpiece holder (12). It may also include a planar grindstone tool (50) configured to grind or polish the surface of the workpiece (W). An example of a surface processing device (1) includes a tool holder (22) that includes a second holding surface (S3) facing a first holding surface (S1) and configured to hold a grindstone tool (50). ), and a drive mechanism configured to move at least one of the work holder (12) and the tool holder (22) along the first holding surface (S1) or the second holding surface (S2). (13) may further be provided. In this case, since a non-rotating flat grindstone tool is used, preliminary adjustment operations such as truing and dressing are not required. Furthermore, since the height of the grindstone tool is approximately constant with respect to the second holding surface of the tool holder, positioning of the grindstone tool with respect to the surface of the workpiece is facilitated. Therefore, the preparation time for the grindstone tool before machining the workpiece is significantly shortened. Therefore, it becomes possible to efficiently process the workpiece. In addition, in this case, since a non-rotating planar grindstone tool is used, the workpiece can be processed even if the relative speed of the workpiece to the grindstone tool is relatively small. Therefore, since heat is less likely to be generated between the grindstone tool and the workpiece, a cooling liquid supply device for cooling the workpiece is not required. Therefore, it is possible to downsize and simplify the surface processing apparatus.

Example 2. In the device (1) of Example 1, the grindstone tool (50) includes a flat base material (51), a plurality of abrasive grains (53) arranged on the surface of the base material (51) without overlapping, It may also include a binder (52) that fixes the plurality of abrasive grains (53) to the base material (51). In this case, since the base material is difficult to deform, by processing the workpiece using the grindstone tool, it is possible to obtain a surface of the workpiece with high flatness.

Example 3. In the device (1) of Example 1, the grindstone tool (50) includes a flexible film-like base material (51) and a plurality of abrasive grains arranged without overlapping on the surface of the base material (51). (53) and a binder (52) that fixes the plurality of abrasive grains (53) to the base material. In this case, the base material follows the surface of the workpiece and is easily deformed, so by processing the workpiece using the grindstone tool, it is possible to uniformly process the entire surface of the workpiece. .

Example 4. The device (1) of Example 3 may further include a transport mechanism (30) configured to transport the grindstone tool (50) along a predetermined direction. In this case, the unused area of the grindstone tool is held in the tool holder by transporting the film-like grindstone tool for a predetermined length in a predetermined direction. Therefore, it becomes possible to easily replace the used area of the grindstone tool with an unused area.

Example 5. The device (1) in any one of Examples 1 to 4 includes a spraying mechanism (40) configured to spray a liquid in a mist onto a workpiece (W) held by a workpiece holder (12). It may further include. In this case, the sprayed mist immediately evaporates around the workpiece and removes heat from the workpiece through heat of vaporization. Therefore, the workpiece can be cooled without wetting the workpiece and its surroundings.

DESCRIPTION OF SYMBOLS 1... Surface processing device, 10... Work holding mechanism, 12... Work holder, 12b... Chuck, 13... Drive mechanism, 20... Tool holding mechanism, 22... Tool holder, 22b... Chuck, 23... Drive mechanism, 30... Conveyance mechanism, 40... Spraying mechanism, 50... Grindstone tool, 51... Base material, 52... Binder, 53... Abrasive grain, S1... Main surface (first holding surface), S3... Main surface (second holding surface) ), W...Work.

Claims (4)

a work holder including a first holding surface configured to hold a work;
a planar grindstone tool configured to grind or polish the surface of the workpiece held by the workpiece holder;
a tool holder including a second holding surface facing the first holding surface and configured to hold the grindstone tool;
A drive configured to reciprocate the workpiece holder along the second holding surface of the stationary tool holder while the grindstone tool is stationary relative to the tool holder. Equipped with a mechanism ,
The grindstone tool is
A flat base material,
a plurality of abrasive grains arranged on the surface of the base material without contacting in the horizontal direction and without overlapping in the vertical direction;
and a binder that fixes the plurality of abrasive grains to the base material . a work holder including a first holding surface configured to hold a work;
a planar grindstone tool configured to grind or polish the surface of the workpiece held by the workpiece holder;
a tool holder including a second holding surface facing the first holding surface and configured to hold the grindstone tool;
A drive configured to reciprocate the workpiece holder along the second holding surface of the stationary tool holder while the grindstone tool is stationary relative to the tool holder. Equipped with a mechanism,
The grindstone tool is
a flexible film-like base material;
a plurality of abrasive grains arranged on the surface of the base material without contacting in the horizontal direction and without overlapping in the vertical direction ;
and a binder that fixes the plurality of abrasive grains to the base material. The apparatus according to claim 2 , further comprising a transport mechanism configured to transport the grindstone tool along a predetermined direction. The apparatus according to any one of claims 1 to 3 , further comprising a spraying mechanism configured to spray a liquid in a mist onto the workpiece held by the workpiece holder.

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