JP2856783B2 - Polishing tool - Google Patents

Polishing tool

Info

Publication number
JP2856783B2
JP2856783B2 JP27487689A JP27487689A JP2856783B2 JP 2856783 B2 JP2856783 B2 JP 2856783B2 JP 27487689 A JP27487689 A JP 27487689A JP 27487689 A JP27487689 A JP 27487689A JP 2856783 B2 JP2856783 B2 JP 2856783B2
Authority
JP
Japan
Prior art keywords
polishing
particles
abrasive
abrasive particles
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27487689A
Other languages
Japanese (ja)
Other versions
JPH03178776A (en
Inventor
徳道 川島
俊郎 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Infomedia Co Ltd
Original Assignee
Tokyo Magnetic Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Magnetic Printing Co Ltd filed Critical Tokyo Magnetic Printing Co Ltd
Priority to JP27487689A priority Critical patent/JP2856783B2/en
Publication of JPH03178776A publication Critical patent/JPH03178776A/en
Application granted granted Critical
Publication of JP2856783B2 publication Critical patent/JP2856783B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 (発明の利用分野) 本発明は、精密研磨、特にハードディスクのテクスチ
ャリング加工の分野に利用できる研磨具に関する。
Description: FIELD OF THE INVENTION The present invention relates to a polishing tool that can be used in the field of precision polishing, especially texturing of a hard disk.

(従来技術) 研磨具には従来ポリエチレンテレフタレート(PET)
フィルム上に、電融アルミナ粉砕粉等の研磨材粉末をバ
インダー樹脂中に分散させた塗料を塗布し、研磨層を連
続又は不連続に形成させたものが有り、研磨材としては
ダイヤモンド、アルミナ、シリコンカーバイド、酸化
鉄、酸化クロム等の粉末が用いられている。特に磁気ハ
ードディスクのテクスチャリング面は均一な幅と深さを
有する研磨面が要求される。
(Prior art) Conventional polishing tool is polyethylene terephthalate (PET)
On the film, there is one in which a coating material in which an abrasive powder such as a fused alumina powder is dispersed in a binder resin is applied to form a continuous or discontinuous abrasive layer.As the abrasive, diamond, alumina, Powders such as silicon carbide, iron oxide, and chromium oxide are used. In particular, a textured surface of a magnetic hard disk requires a polished surface having a uniform width and depth.

しかしながら、従来製造されているハードデイスクの
テクスチャリング用研磨テープはその研磨層が多層構造
を有しており、粒子同志が密に接触した均一な表面構造
又は第1〜2図に示したような塗料乾燥時の収縮に起因
するベナールセル(Bnard cell)構造を有してい
る。しかし微視的に見ると表面は決して一様ではなく
て、多数の箇所で研磨材粒子の凝集塊が研磨層の表面か
ら突出し、又セルの中心には凹入孔が存在し、セルの境
界部は溝状になっているため塗膜の凝集力が弱くなり研
磨中に凝集塊として脱落するため深い傷とか擦傷(スク
ラッチ)を生じる。更にベナールセル構造の塗膜は強度
が弱いため、テープ状に巻いたときにテープ張力により
塗膜がつぶれ、巻初めと巻終りでは塗膜構造がかなり異
なり研磨特性が異なるため、テープの巻初めと巻終りと
の間で研磨面にバラツキを生じるという不具合がある。
又テープエッジからも凝集塊が脱落し易く、それらもス
クラッチの原因となっている。
However, the conventionally manufactured polishing tape for texturing a hard disk has a polishing layer having a multilayer structure, and a uniform surface structure in which particles are in close contact with each other or a paint as shown in FIGS. It has a Benard cell structure caused by shrinkage during drying. However, when viewed microscopically, the surface is never uniform, and agglomerates of abrasive particles protrude from the surface of the polishing layer in many places, and there are concave holes in the center of the cell, Since the portions are groove-shaped, the cohesive force of the coating film is weakened, and the coated films fall off as agglomerates during polishing, resulting in deep scratches and scratches. Furthermore, since the coating film of the Benard cell structure has low strength, the coating film is crushed by the tape tension when wound in a tape shape, and the coating film structure is considerably different at the beginning and end of the winding, and the polishing characteristics are different, so that the tape is different from the beginning of the tape. There is a problem that the polished surface varies from the end of the winding.
Agglomerates are also likely to fall off from the tape edge, which also causes scratches.

ハードディスクのテクスチャリングの様に研磨テープ
の表面構造が直接研磨面として転写される様な研磨方式
の場合、研磨フィルムの研磨面の均一性が最も重要とな
ってくる。しかしながら従来の多層構造でしかもベナー
ルセル構造の研磨フィルムでは表面の均一性を得る事は
困難である。
In the case of a polishing method in which the surface structure of a polishing tape is directly transferred as a polishing surface, such as texturing of a hard disk, uniformity of the polishing surface of a polishing film is most important. However, it is difficult to obtain surface uniformity with a conventional multi-layer polishing film having a Benard cell structure.

特に、最近のようにハードディスクの表面を出来るだ
け精密に仕上げて記録密度を上げることが要求されるよ
うになって来ると、テクスチャリング面の表面荒さを20
〜100ÅRaの範囲に制御しなけらばならない(下限値は
磁気ヘッドの走行開始時にヘッドのハードディスクへの
吸着きを回避するのに必要な表面粗さ)。このような平
滑表面では擦傷はなお一層抑制する必要がある。そのた
めには研磨フィルムの表面に凝集塊が存在してはならな
い。
In particular, as it has recently become necessary to increase the recording density by finishing the surface of the hard disk as precisely as possible, the surface roughness of the texturing surface has been reduced to 20%.
It must be controlled within the range of ~ 100ÅRa (the lower limit is the surface roughness required to prevent the magnetic head from sticking to the hard disk when the magnetic head starts running). Scratches need to be further suppressed on such smooth surfaces. For this purpose, no agglomerates should be present on the surface of the polishing film.

本発明者はこの問題を解決するために先に特願昭63−
58392号(昭和63年3月14日出願)により単層構造の研
磨材層を有する研磨フィルムを提案した。簡単に説明す
ると、同研磨フィルムは、研磨材粒子をポリエステルフ
ィルムの様なベース(基体)上に実質的に単層で且つば
らばらの粒子として均一に分散し接着させたものであ
り、それにより使用する研磨材の平均粒子径、粒度分布
に応じた粗さのみを実質的に有する研磨面の製造を可能
とした。すなわち、同研磨具で研磨された表面は異常な
傷が存在しない一様な研磨すじを有する。同研磨具は、
研磨材粒子の表面密度が低く、このため研磨層と被研磨
面との接触面積が小さくなる為、同一圧力下でも多層構
造で密な研磨材粒子濃度のものに比べ均一で研磨溝(テ
クスチャリング溝)も深くなり、且つ被研磨物との摩擦
が軽減される為切れ味が良くなり仕上げ面状態も向上す
る。また研磨材粒子間には間隙が存在するため、粒子と
粒子間の間隙がチップポケットとして作用する為目づま
りが防止出来、耐久性が向上する。
To solve this problem, the present inventor has previously filed Japanese Patent Application No.
No. 58392 (filed on Mar. 14, 1988) proposed a polishing film having a single-layer structure abrasive layer. Briefly, the abrasive film is obtained by uniformly dispersing and adhering abrasive particles as substantially single-layered and discrete particles on a base (substrate) such as a polyester film, and thereby using the abrasive particles. It is possible to manufacture a polished surface having substantially only the roughness according to the average particle size and the particle size distribution of the abrasive to be polished. That is, the surface polished by the polishing tool has uniform polishing streaks without any abnormal scratches. The polishing tool is
Since the surface density of the abrasive particles is low and the contact area between the polishing layer and the surface to be polished is small, even under the same pressure, the polishing grooves (texturing Grooves) become deeper, and the friction with the object to be polished is reduced, so that the sharpness is improved and the finished surface condition is improved. Further, since there is a gap between the abrasive particles, the gap between the particles acts as a chip pocket, so that clogging can be prevented and the durability is improved.

しかしながら、特願昭63−58392号に記載の研磨具
は、研磨能率が充分でないことが分かった。
However, it was found that the polishing tool described in Japanese Patent Application No. 63-58392 had insufficient polishing efficiency.

(発明の目的) 本発明の目的は、被研磨面、特にハードディスクのテ
クスチャリング面の表面粗さが20〜100ÅRaの範囲内に
入り、しかも深い傷や不連続な線又はスクラッチ等の損
傷を与えないでハードディスクの加工(研磨幅、研磨深
さ)の制御が容易となる研磨フィルム等の研磨具の提供
にある。
(Object of the Invention) An object of the present invention is to provide a surface to be polished, particularly a surface roughness of a texturing surface of a hard disk, within a range of 20 to 100 ° Ra, and to give a deep scratch, a discontinuous line or a damage such as a scratch. An object of the present invention is to provide a polishing tool such as a polishing film which facilitates control of processing (polishing width, polishing depth) of a hard disk without using the same.

(発明の概要) 本発明は、研磨材粒子をバインダー樹脂に分散した塗
膜をベース上に100個につき1個以下の重畳粒子しか有
さず、単位面積あたり50%以上の研磨材粒子濃度(面積
占有率)でほぼ単層構造で接着してなる研磨層を形成さ
せたことを特徴とする磁気ディスクテクスチャリング用
研磨具を提供する。
(Summary of the Invention) The present invention has a coating film in which abrasive particles are dispersed in a binder resin, and has only one or less superimposed particles per 100 particles on a base, and an abrasive particle concentration of 50% or more per unit area ( A polishing tool for texturing a magnetic disk, characterized in that a polishing layer formed by bonding with a substantially single-layer structure is formed in an area occupancy ratio.

本発明の研磨具によると、使用する研磨材の平均粒子
径、粒度分布に応じた表面粗さのみを実質的に有する、
異常な傷が存在しない、一様な研磨すじを有する研磨面
の形成を可能とするのみならず、各粒子にかかる極圧が
高くなるため研磨効率が高く、しかもベナール構造は持
たないために圧力によるつぶれが生じないから、常に一
定した研磨特性を達成出来る。例えば、本発明の研磨具
は長いテープ状に形成してもテープ張力や巻圧力の影響
が少なく研磨特性がどの部分でも変わらず、そのためテ
ープ交換に要する手間が減じるなどの利益が得られる。
According to the polishing tool of the present invention, the average particle diameter of the abrasive used, having substantially only the surface roughness according to the particle size distribution,
Not only enables the formation of a polished surface with no abnormal scratches and a uniform polishing streak, but also increases the extreme pressure applied to each particle to increase polishing efficiency, and furthermore, because it has no Benard structure, pressure Therefore, constant polishing characteristics can be achieved at all times. For example, even if the polishing tool of the present invention is formed in a long tape shape, the effects of the tape tension and the winding pressure are small and the polishing characteristics are not changed at any portion, and therefore, the advantage that the labor required for tape replacement is reduced is obtained.

本発明の研磨具は、上記特許出願の研磨具に比しては
るかに大きい研磨材粒子表面密度を有するから、研磨効
率が高くなるが、単層構造を維持するからなお研磨材粒
子間には間隙が存在するため、粒子と粒子間の間隙がチ
ップポケットとして作用して目づまりが防止出来、耐久
性が向上する。
Since the polishing tool of the present invention has a much higher abrasive particle surface density than the polishing tool of the above-mentioned patent application, the polishing efficiency is high, but since the single-layer structure is maintained, the polishing particles still have Since there is a gap, the gap between the particles acts as a chip pocket to prevent clogging and improve durability.

特に研磨材粒子の平均粒子径(D50)が1〜6μmの
範囲にあると時間安定性の良い研磨効果が得られる。こ
の時間安定性は常に一定のテクスチャリング効果を得る
ために重要である。
In particular an average particle diameter (D 50) of the abrasive particles are obtained good polishing effect of a certain the time stability in the range of 1 to 6 m. This time stability is important for always obtaining a certain texturing effect.

(発明の具体的な説明) 上記特願昭63−58392号(特開平1−234169号)にお
いては研磨材粒子が単層構造になることが重要なことを
指摘したが本発明でもこの要件は最も重要である。しか
し、同出願においては研磨材粒子は出来るだけばらばら
になる方が良いと考えている。これは研磨材粒子が近接
すると重畳粒子の数もそれに対応して増大して研磨傷を
増大するであろうと考えたからである。しかし、本発明
者はその後の研究により、研磨材粒子とバインダーの混
合物を基体に塗布する方法が適正なら、研磨材粒子が互
いに接触してもなおかつ単層構造を保持し得る方法が存
在することを見出し、本発明を導くことが出来た。
(Detailed Description of the Invention) In the above-mentioned Japanese Patent Application No. 63-58392 (Japanese Patent Application Laid-Open No. 1-234169), it was pointed out that it is important that the abrasive particles have a single-layer structure. Most important. However, in that application, it is believed that the abrasive particles should be as discrete as possible. This is because when the abrasive particles were close together, the number of superimposed particles would be correspondingly increased to increase polishing flaws. However, the present inventor has found from subsequent studies that if the method of applying the mixture of the abrasive particles and the binder to the substrate is appropriate, there is a method capable of maintaining the single-layer structure even when the abrasive particles contact each other. Was found, and the present invention was able to be led.

第3図及び第4図はそれぞれ本発明の均一塗布型の研
磨具の一部を示す平面図と断面図であり、第5図及び第
6図は本発明の不均一塗布型の研磨具の平面図及び断面
図である。これらの研磨具はプラスチックフィルム、不
織布、金属箔、金属板、ガラス板等、特に好ましくは約
25〜50μmのポリエチレンテレフタレートフィルム(PE
T)のベース1の上に、バインダー樹脂3中に研磨材粒
子2を分散させた塗料を、研磨層が実質的に単一層とな
るように且つ研磨材粒子が面内方向に出来るだけ接触し
て研磨材粒子が高密度に存在するように塗布して形成し
た構造を有するものである。ここに単一層とは粒子の重
畳が実質的に無いことを意味し、好ましくは粒子の2個
以上の重畳箇所が100個の粒子あたり1個以下、より好
ましくは1000個につき1個以下に押える。これにより、
研磨材粒子の平均粒子径で定まる被研磨物の研磨面の表
面粗さに対して、単粒子による通常の研磨筋とは異質な
傷(より深い及び/又は広い傷)ないし擦傷は発生する
確率が大幅に減少し、高精度の研磨が達成し得る。本発
明で避けなければならないのは研磨材粒子が上下に重畳
して異常な突起を形成することである。
FIGS. 3 and 4 are a plan view and a cross-sectional view, respectively, showing a part of the uniform application type polishing tool of the present invention. FIGS. 5 and 6 show the non-uniform application type polishing tool of the present invention. It is a top view and a sectional view. These polishing tools are preferably made of plastic film, nonwoven fabric, metal foil, metal plate, glass plate, etc.
25-50 μm polyethylene terephthalate film (PE
T) A coating material obtained by dispersing abrasive particles 2 in a binder resin 3 on a base 1 in such a manner that the abrasive layer is substantially a single layer and the abrasive particles are brought into contact in the in-plane direction as much as possible. It has a structure formed by applying so that abrasive particles are present at a high density. Here, a single layer means that there is substantially no superposition of particles, and preferably two or more superposed portions of particles are suppressed to 1 or less per 100 particles, more preferably 1 or less per 1000 particles. . This allows
Probability of generation of scratches (deeper and / or wider scratches) or scratches different from normal polishing streaks due to single particles with respect to the surface roughness of the polished surface of the object to be polished determined by the average particle size of the abrasive particles Is greatly reduced, and high-precision polishing can be achieved. What must be avoided in the present invention is that the abrasive particles overlap one another up and down to form abnormal protrusions.

このような単層構造の研磨材層は特殊な方法を用いな
くても適当な高分子バインダー、溶剤、分散剤、それら
の配合比、塗布手段、塗布量等を調節することによって
比較的容易に実現できることが分かった。第3〜4図に
示した均一研磨材分布、或は第5〜6図に示した不均一
研磨材分布は上記の諸因子を調節することにより実現さ
れる。いずれの場合でも研磨材粒子は多くは互いに接触
するほど高密度となることが肝心で、均一分布であるか
不均一分布であるかは重畳ではない。
Such a single-layer abrasive layer can be relatively easily formed by adjusting appropriate polymer binders, solvents, dispersants, their mixing ratios, coating means, coating amounts, etc. without using a special method. It turns out that it can be realized. The uniform abrasive distribution shown in FIGS. 3 and 4 or the non-uniform abrasive distribution shown in FIGS. 5 and 6 can be realized by adjusting the above-mentioned factors. In any case, it is important that the abrasive particles have a high density as they come into contact with each other, and it is not a superposition whether the abrasive particles have a uniform distribution or a non-uniform distribution.

ベースはテープ、シート、ディスク状任意の形に加工
して使用出来るものである。
The base can be processed into an arbitrary shape such as a tape, a sheet, and a disk.

研磨材としてはダイヤモンド、CBN、シリコーンカー
バイド、単結晶アルミナ、電融アルミナ粉砕粉、酸化ク
ロム、酸化鉄、酸化セリウム等があるが、特に電融アル
ミナ及びダイヤモンドが好ましい。アルミニウム表面と
かめっき表面を有する金属板等のテクスチャリングでは
電融アルミナが特に好ましいが、最近のように薄いガラ
ス基板に磁気記録層を被着した磁気記録媒体のテクスチ
ャリングではより硬い例えばダイヤモンドを使用する必
要があることが分かった。
Examples of the abrasive include diamond, CBN, silicone carbide, single crystal alumina, pulverized fused alumina, chromium oxide, iron oxide, cerium oxide, and the like, and particularly preferred is fused alumina and diamond. Fused alumina is particularly preferred for texturing aluminum plates or metal plates with plated surfaces, but for texturing magnetic recording media with a magnetic recording layer applied to a thin glass substrate, use harder, for example, diamond. I knew I needed to.

研磨材の粒径は平均粒子径(D50)が1〜12μm、好
ましくは1〜6μmのものが望ましい。ハードディスク
のテクスチャリング深さを表面粗さRaで表わして20〜10
0Åの範囲にするにはベースの柔軟性にもよるがほぼこ
の範囲の平均粒子径が必要である。ベースが柔軟ならば
研磨材の粒子径は大きめでも良いが柔軟性を欠くベース
の場合には小さい粒子径の研磨材が必要である。
The abrasive preferably has an average particle diameter (D 50 ) of 1 to 12 μm, preferably 1 to 6 μm. Expressing the texturing depth of the hard disk as surface roughness Ra
Although it depends on the flexibility of the base, an average particle diameter in this range is required to make the range of 0 °. If the base is flexible, the particle size of the abrasive may be large, but if the base lacks flexibility, an abrasive having a small particle size is required.

バインダー樹脂としては熱硬化性樹脂及び熱可塑性樹
脂が使用でき熱硬化性樹脂としてはポリエステル又はア
クリルポリオールウレタン系樹脂、塩素化ポリプロピレ
ン変性アクリルポリオールウレタン系樹脂、アクリル−
キレート硬化型樹脂、エポキシ又はエポキシペンダント
アクリル樹脂+アミンペンダントアクリル系樹脂、ポリ
オルガノシロキサン系樹脂、各種UV硬化型樹脂、ウレタ
ン化油系樹脂、湿気硬化ポリウレタン系樹脂、ふっ素系
樹脂等100℃以下で硬化反応が進行するものが適してい
る。
As the binder resin, a thermosetting resin and a thermoplastic resin can be used. As the thermosetting resin, polyester or acrylic polyol urethane resin, chlorinated polypropylene-modified acrylic polyol urethane resin, acrylic
Chelate curable resin, epoxy or epoxy pendant acrylic resin + amine pendant acrylic resin, polyorganosiloxane resin, various UV curable resins, urethane oil resin, moisture-curable polyurethane resin, fluorine resin, etc. Those in which the curing reaction proceeds are suitable.

熱可塑性樹脂としては純アクリル系樹脂、塩化ビニル
系樹脂、ニトロセルロース系樹脂、ニトロセルロース−
アクリル系樹脂、変形アクリル系樹脂、アルキッド系、
ポリオレフィン系樹脂、ポリエステル系樹脂、ゴム系樹
脂であるウレタンエラストマー、ニトリルゴム、シリコ
ンゴム、エチレン酢ビゴム、ふっ素ゴム系樹脂、その他
水溶性樹脂、エマルジョン系樹脂のものが使用される。
ベースフィルム基体としてはプラスチックフィルムとし
てポリエチレンテレフタレート、ポリイミド、ポリカー
ボネート及びそれらの表面処理したフィルムその他合成
紙、不織布その他金属箔等が用いられる。
As the thermoplastic resin, pure acrylic resin, vinyl chloride resin, nitrocellulose resin, nitrocellulose
Acrylic resin, deformed acrylic resin, alkyd,
Polyolefin resins, polyester resins, urethane elastomers such as rubber resins, nitrile rubber, silicone rubber, ethylene vinyl acetate rubber, fluororubber resins, other water-soluble resins, and emulsion resins are used.
As the base film substrate, a plastic film such as polyethylene terephthalate, polyimide, polycarbonate, a film obtained by treating the surface thereof, a synthetic paper, a nonwoven fabric, a metal foil, or the like is used.

(研磨具の製法) 研磨材粒子はバインダー樹脂及び溶剤と混合されたう
え、適当な塗布手段により研磨材粒子の粒度分布により
適当な塗布厚に調整されフィルム等の基体に塗布され
る。
(Manufacturing Method of Polishing Tool) The abrasive particles are mixed with a binder resin and a solvent, then adjusted to an appropriate coating thickness by an appropriate coating means according to the particle size distribution of the abrasive particles, and applied to a substrate such as a film.

例えば、メイヤバーコーター、グラビアコーダー、リ
バースロールコーター、ナイフコーター等が使用し得
る。
For example, a Meyer bar coater, a gravure coder, a reverse roll coater, a knife coater and the like can be used.

こうして得られた被膜は乾燥又は硬化処理により基体
に固着される。
The coating thus obtained is fixed to the substrate by a drying or curing treatment.

第3〜4図は均一な研磨材粒子分布の単層構造の研磨
層を示す。
3 and 4 show a polishing layer having a single layer structure with a uniform distribution of abrasive particles.

第5〜6図は不均一な研磨材粒子分布の単層構造の研
磨層を示す。
5 and 6 show a single-layer polishing layer having a non-uniform distribution of abrasive particles.

均一研磨材粒子と不均一研磨材粒子分子の単層構造の
研磨層はバインダー樹脂中の分散剤の比率により調節し
た。
The polishing layer having a single layer structure of the uniform abrasive particles and the non-uniform abrasive particles was adjusted by the ratio of the dispersant in the binder resin.

次に本発明の実施例について説明する。 Next, examples of the present invention will be described.

実施例1 この実施例は、本発明による研磨フィルムを試作実験
する為研磨層のバインダー樹脂として熱可塑性樹脂を使
用した場合の例であり、先ず表1に示す様な組成の塗工
液が準備された。
Example 1 This example is an example in which a thermoplastic resin was used as a binder resin of a polishing layer in order to experimentally produce a polishing film according to the present invention. First, a coating solution having a composition shown in Table 1 was prepared. Was done.

研磨材粒子としては電融アルミナの粉砕粉WAを用い平
均粒径の異なった各種メッシュのものを使用した。な
お、使用した研磨材粒子は次の通りであった。
As the abrasive particles, various types of meshes having different average particle diameters using pulverized powder of fused alumina WA were used. The abrasive particles used were as follows.

WA2500(D50=6.0μm) WA3000(D50=4.5μm) WA4000(D50=3.0μm) WA6000(D50=2.0μm) 表1の組成(ポリエステル樹脂は東洋紡社製のV200で
ある)の塗工液をグラビアロールコーターで25μmの厚
さのポリエチレンテレフタレートフィルム上に各種粒径
に応じた塗布厚で塗布し溶剤を乾燥後、所定の幅にスリ
ットしテープ状に加工しハードディスク用ニッケルメッ
キ基板のテクスチャリング研磨に供した。表2及び表3
はそれぞれは均一分布型及び不均一分布型の研磨テープ
の表面粗さの測定結果を表わす。いずれの数サンプルの
平均である。均一分布型と不均一分布型の研磨テープは
単層構造であれば表面粗さは殆ど同等であり、用いる粒
子の平均粒径(D50)と表面粗差Rzはほぼ等しく、Rmax
は研磨材の最大粒子径よりも小さい値を取る。均一分布
型の研磨テープは研磨材粒子が分散剤によりベースに単
層上で均一に分布した構造を有している。不均一型の研
磨テープは研磨材粒子がベース上に単層で存在するが粒
子の比較的大きな粒子が集合し、微小な粒子がその集合
体の間隙を埋めている構造をしている。
WA2500 (D 50 = 6.0μm) WA3000 (D 50 = 4.5μm) WA4000 (D 50 = 3.0μm) WA6000 (D 50 = 2.0μm) A coating liquid having a composition shown in Table 1 (polyester resin is V200 manufactured by Toyobo Co., Ltd.) is applied on a 25 μm-thick polyethylene terephthalate film with a gravure roll coater at an application thickness corresponding to various particle sizes, and the solvent is dried. Then, it was slit into a predetermined width, processed into a tape shape, and subjected to texturing polishing of a nickel-plated substrate for a hard disk. Table 2 and Table 3
Represents the measurement results of the surface roughness of the uniform distribution type and the non-uniform distribution type polishing tape. Average of all several samples. The polishing tapes of the uniform distribution type and the non-uniform distribution type have almost the same surface roughness as long as they have a single layer structure, and the average particle diameter (D 50 ) of the particles used and the surface roughness difference Rz are almost equal.
Takes a value smaller than the maximum particle size of the abrasive. The uniform distribution type polishing tape has a structure in which abrasive particles are uniformly distributed on a single layer to a base by a dispersant. A non-uniform polishing tape has a structure in which abrasive particles are present in a single layer on a base, but relatively large particles are aggregated, and fine particles fill gaps in the aggregate.

表においてRa、Rz、RmaxはJIS規格による表面粗さを
表わす。
In the table, Ra, Rz, and Rmax represent surface roughness according to JIS standards.

次に上記研磨テープの切断面の顕微鏡写真を観察した
所、全ての研磨テープにおいて研磨粒子の重畳は100個
に付き1個以下であった。
Next, when a micrograph of the cut surface of the above-mentioned polishing tape was observed, the superposition of the abrasive particles was 1 or less per 100 in all the polishing tapes.

比較例1 実施例1で使用した研磨材粒子を使用し、通常の方法
で製造された多層高密度型でベナールセル構造を有する
研磨材テープを用いてハードディスクのテクスチャリン
グ研磨を行ない、これを本発明の実施例の研磨テープと
比較した。この研磨テープを使用して表4に示したよう
な研磨表面を得るような条件下に実施例の研磨テープで
ハードディスクのテクスチャリングを行なったところ、
表5、6の結果を得た。
Comparative Example 1 Using the abrasive particles used in Example 1, a hard disk was subjected to texturing polishing using a multilayer high-density type abrasive tape having a Benard cell structure manufactured by an ordinary method, and the present invention was applied thereto. The comparison was made with the polishing tape of Example. When the hard disk was subjected to texturing with the polishing tape of the example under such a condition that a polishing surface as shown in Table 4 was obtained using this polishing tape,
The results of Tables 5 and 6 were obtained.

なお、表において異常個数とは目立つ大きさのえぐれ
の個数を示し、スクラッチの個数とは通常の研磨筋より
も大きい筋の個数を表わす。
In the table, the abnormal number indicates the number of conspicuously-sized scuffs, and the number of scratches indicates the number of streaks larger than a normal polishing streak.

上の表から明らかなように、本発明の単層構造の研磨
層を有する研磨テープは通常の研磨筋のみからなる被研
磨表面を提供することが分かる。
As is clear from the above table, it can be seen that the polishing tape having the polishing layer of the single-layer structure of the present invention provides a surface to be polished consisting of only ordinary polishing streaks.

次に、表4、5、6の研磨試験において、研磨時間と
表面粗さの経時変化を調べた。結果は数サンプルの平均
値である。その結果を第7図のグラフに示す。図から明
らかなように従来品は研磨時間が約30秒で一定の表面粗
さを達するのに対して本発明品はその約3分の2程度の
時間で目的の表面粗さに達する。
Next, in the polishing tests of Tables 4, 5, and 6, changes over time in polishing time and surface roughness were examined. The result is the average of several samples. The results are shown in the graph of FIG. As is clear from the figure, the conventional product reaches a certain surface roughness in about 30 seconds, while the product of the present invention reaches the target surface roughness in about two-thirds of the time.

実施例2 次に重畳粒子がどの程度まで許容されるかを調べるた
めに、実施例1の研磨材塗料の単位面積あたりの塗布量
を段階適に変えた。最小限のスクラッチが表われたもの
について切片を取り顕微鏡観察したところ、平均して百
個につき1個以下の場合にハードディスクのテクスチャ
リングに使用可能であることが分かった。
Example 2 Next, the amount of the abrasive coating material of Example 1 applied per unit area was changed in a stepwise manner in order to examine how much the superimposed particles were allowed. Sections were taken of those showing minimal scratches and observed under a microscope, and found to be usable for hard disk texturing when the average was less than one per hundred.

第8図にスクラッチの数(相対値)と単位面積当たり
の重畳粒子の数の関係を示す。図より重畳粒子が100個
につき1個り小さくなるとスクラッチがなくなることが
確認された。
FIG. 8 shows the relationship between the number of scratches (relative value) and the number of superposed particles per unit area. From the figure, it was confirmed that scratches disappeared when the number of superimposed particles was reduced by one per 100 particles.

実施例3 この実施例は、研磨層のバインダー樹脂として熱硬化
性樹脂を使用し、研磨材としてダイヤモンドを使用した
場合の例であり、先ず表7に示す様な組成の塗工液を準
備した。
Example 3 In this example, a thermosetting resin was used as a binder resin of a polishing layer, and diamond was used as a polishing material. First, a coating liquid having a composition shown in Table 7 was prepared. .

研磨材粒子としてはダイヤモンド粉を用い、粒径4〜
6ミクロンm及び6〜12μmの2種の異なったものを使
用した。なお、本例では粒子径は平均径ではなくて実質
的にこの範囲外の粒子は存在しないことを意味する極め
て尖鋭な粒度分布の粉末を表わす。
Diamond particles were used as abrasive particles,
Two different ones, 6 microns and 6-12 microns, were used. In this example, the particle diameter is not an average diameter, but represents a powder having an extremely sharp particle size distribution, which means that particles substantially outside this range do not exist.

表1の組成(熱硬化性樹脂はポリウレタンプレポリマ
ー(日本ポリウレタン社製)を使用した。又組成を充分
混合した後硬化剤としてポリイソシアネートを50重量部
配合した)の塗工液をグラビアロールコーターで25μm
の厚さのポリエチレンテレフタレートフィルム上に各種
粒径に応じた塗布厚で塗布し溶剤を乾燥後、熱硬化し、
所定の幅にスリットしテープ状に加工した。粒子は部分
的に接触したものが多数存在するほぼ均一分布型の単層
構造であった。
A gravure roll coater was used to apply a coating liquid having the composition shown in Table 1 (a thermosetting resin used was a polyurethane prepolymer (manufactured by Nippon Polyurethane Co., Ltd.). 25 μm
On a polyethylene terephthalate film with a thickness of 3 mm, applying a coating thickness according to various particle diameters, drying the solvent, heat curing,
It was slit into a predetermined width and processed into a tape shape. The particles had a substantially uniform distribution type single layer structure in which a large number of particles partially contacted each other.

次に上記研磨テープの切断面の顕微鏡写真を観察した
所、全ての研磨テープにおいて研磨粒子の重畳は1000個
につき1個以下であった。
Next, when a micrograph of the cut surface of the polishing tape was observed, the superposition of the abrasive particles was not more than 1 per 1000 particles in all the polishing tapes.

次にこれらの研磨テープをハードディスク用3.5イン
チガラスディスク基板のテクスチャリング研磨に供し
た。加工条件として、研磨テープに一定の圧力を加え研
磨液を流しながら、研磨テープの送り速度150mm/分で、
ディスクスペーススピンドルの回転数、研磨時間及び振
動数(ディスクの研磨面の内縁と外縁との間で研磨テー
プを振動させた時の振動数)を変えて研磨試験を行なっ
た。どの試料もスクラッチは生じなかった。又表面粗度
を測定した結果を表8に示す。測定はディスクの中央部
(内外周面の中間の円)について行なった。
Next, these polishing tapes were subjected to texturing polishing of a 3.5-inch glass disk substrate for a hard disk. As processing conditions, while applying a certain pressure to the polishing tape and flowing the polishing liquid, at a feed rate of the polishing tape of 150 mm / min,
The polishing test was performed by changing the number of revolutions, the polishing time, and the frequency of the disk space spindle (the frequency when the polishing tape was vibrated between the inner edge and the outer edge of the polished surface of the disk). None of the samples scratched. Table 8 shows the results of measuring the surface roughness. The measurement was performed on the center of the disk (the middle circle between the inner and outer peripheral surfaces).

上の表からRaの値は研磨時間60秒後でも全て100Å以
下であるので、本発明の研磨具として好適なテクスチャ
リングに使用出来る。又表から時間によって表面粗さRa
が次第に増加するが4〜6μの粒子径では50μ以下、6
〜12μの粒子径では80μ以下となっており、必要なテク
スチャリングにより使い分けることが出来る。
From the above table, the values of Ra are all 100 ° or less even after a polishing time of 60 seconds, so that they can be used for texturing suitable as a polishing tool of the present invention. Also from the table, the surface roughness Ra depends on time
Gradually increases, but at a particle diameter of 4 to 6 μ, the particle diameter is
For a particle size of ~ 12μ, the particle size is 80μ or less, and can be used properly depending on the required texturing.

実施例4 次に実施例3と同じ方法で厚さ25μm及び50μmのポ
リエチレンテレフタレート製ベースに研磨材を塗布して
熱硬化型の研磨テープを製造し、これらを使用して他の
研磨実験を行なった。研磨テープは振動しないで研磨し
た。いずれの場合もスクラッチは生じなかった。又表面
粗度の測定結果を第9、10、11図のグラフにに示す。こ
れらの図はそれぞれ、ディスクの中央部、内周部、及び
外周部について研磨時間と研磨面の表面粗度ÅRaの関係
を示す。これらの図から、ベースが薄いと研磨材の粒子
径が6〜12μmでも比較的長時間表面粗度の安定性が得
られるが、ベースが厚いと余り粒子径の大きい研磨材は
不適当であることが分かる。逆にベースが薄く又研磨材
の粒子径が小さいと表面粗度の安定性が得られることが
分かる。Ra100Å以下のテクスチャリングはベース厚50
μm,及び研磨材の粒子径6〜12μmの組合せでは得られ
ないが、その他の場合には得られている。
Example 4 Next, an abrasive was applied to a polyethylene terephthalate base having a thickness of 25 μm and 50 μm in the same manner as in Example 3 to produce a thermosetting polishing tape, and other polishing experiments were performed using these. Was. The polishing tape was polished without vibration. No scratch occurred in any case. The measurement results of the surface roughness are shown in the graphs of FIGS. These figures respectively show the relationship between the polishing time and the surface roughness ÅRa of the polished surface at the center, inner circumference, and outer circumference of the disk. From these figures, it can be seen that when the base is thin, the stability of the surface roughness can be obtained for a relatively long time even when the abrasive has a particle diameter of 6 to 12 μm, but when the base is thick, an abrasive having a too large particle diameter is inappropriate. You can see that. Conversely, it can be seen that when the base is thin and the particle size of the abrasive is small, the stability of the surface roughness can be obtained. Texturing less than Ra100Å base thickness 50
It cannot be obtained with a combination of μm and a particle size of the abrasive of 6 to 12 μm, but is obtained in other cases.

(作用効果) 以上のように本発明によると次の作用効果が達成出来
る。
(Operation and Effect) As described above, according to the present invention, the following operation and effect can be achieved.

1)研磨材粒子が実質的に単層でしかも樹脂中に出来る
だけ均一に分散した状態でベース上に接着されているの
で、研磨テープは研磨材粒子径の粒度分布、形状に応じ
た表面粗さを有し、被加工面形状の制御が容易となる。
1) Since the abrasive particles are adhered to the base in a state where the abrasive particles are substantially a single layer and are dispersed as uniformly as possible in the resin, the abrasive tape has a surface roughness according to the particle size distribution and shape of the abrasive particles. And the control of the shape of the work surface is facilitated.

2)研磨材粒子が単層構造をしているため従来の研磨具
と比較して研磨時に凝集塊として脱落する部分がないた
め、深い傷や擦傷のような損傷や不連続な線を与えるこ
となく均一なテクスチャリングを得ることが可能となっ
た。
2) Since the abrasive particles have a single-layer structure, there is no portion that falls off as an agglomerate during polishing as compared with a conventional polishing tool, so that damages such as deep scratches and scratches and discontinuous lines are given. It became possible to obtain a uniform texturing without any.

3)従来のベナールセル構造の表面ではテープ状にスリ
ットとしてテープ状研磨具とした場合にテープ張力や巻
圧力の変動で塗巻がつぶれ、巻き初めと巻終とでは表面
状態が変化し、研磨面にバラツキを生じるが、本発明の
単層構造のものではこのようなことがなく常に同一の研
磨面が得られる。他テープ張力による研磨面の変化がな
いので研磨具の長さを長くすることが出来、研磨具の交
換の時間も短縮することが出来、作業能率が高くなる。
3) On the surface of the conventional Benard cell structure, when a tape-shaped polishing tool is used as a slit in the form of a tape, the coating is crushed due to fluctuations in tape tension and winding pressure, and the surface state changes between the beginning and end of the winding. However, with the single-layer structure of the present invention, the same polished surface can always be obtained without such a problem. Since there is no change in the polishing surface due to the other tape tension, the length of the polishing tool can be increased, the time for exchanging the polishing tool can be shortened, and the working efficiency can be increased.

4)従来のベナールセル構造のテープ状研磨具において
はテープエッジから研磨材凝集塊が脱落し易くスクラッ
チの原因となるが、本発明の研磨具においては凝集塊が
存在しないのでこのような問題はない。
4) In a conventional tape-shaped polishing tool having a Benard cell structure, the abrasive aggregates easily fall off from the tape edge and cause scratching. However, in the polishing tool of the present invention, there is no such a problem because the aggregates do not exist. .

5)本発明の研磨具の研磨層は単層構造を有するにもか
かわらず、粒子間は面内方向に互いに接触するような密
集状態にあるので前記先願の粒子がばらばらな状態にあ
る単層構造よりも研磨効率が高く研磨時間の短縮が出来
る。
5) Despite the fact that the polishing layer of the polishing tool of the present invention has a single-layer structure, the particles are in a dense state in which they come into contact with each other in the in-plane direction. The polishing efficiency is higher than the layer structure, and the polishing time can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

第1図は従来の研磨具の概要を示す平面図、第2図はそ
の断面図、第3図は本発明の実施例による研磨具の平面
図、第4図は同断面図、第5図は本発明の他の実施例に
よる研磨具の平面図、第6図は断面図、第7図は本発明
及び従来の研磨具の研磨時間と表面粗さの関係を示すグ
ラフ、第8図はスクラッチの数(相対値)と単位面積当
たりの重畳粒子の数の関係を示すグラフ、及び第9図、
第10図及び第11図はそれぞれ被研磨表面の中央部、内周
部及び外周部の研磨時間と表面粗度の関係を示すグラフ
である。
1 is a plan view showing an outline of a conventional polishing tool, FIG. 2 is a sectional view thereof, FIG. 3 is a plan view of a polishing tool according to an embodiment of the present invention, FIG. Is a plan view of a polishing tool according to another embodiment of the present invention, FIG. 6 is a cross-sectional view, FIG. 7 is a graph showing the relationship between polishing time and surface roughness of the polishing tool of the present invention and a conventional polishing tool, and FIG. A graph showing the relationship between the number of scratches (relative value) and the number of superimposed particles per unit area, and FIG.
10 and 11 are graphs showing the relationship between the polishing time and the surface roughness of the central portion, the inner peripheral portion and the outer peripheral portion of the surface to be polished, respectively.

フロントページの続き (56)参考文献 特開 昭63−169270(JP,A) 特開 昭63−185579(JP,A) 特開 平1−205978(JP,A) 特開 昭62−94271(JP,A) 実開 昭62−153053(JP,U) (58)調査した分野(Int.Cl.6,DB名) B24D 11/00Continuation of the front page (56) References JP-A-63-169270 (JP, A) JP-A-63-185579 (JP, A) JP-A-1-205978 (JP, A) JP-A-62-94271 (JP) , A) Actual opening 621-253053 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) B24D 11/00

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】研磨材粒子をバインダー樹脂に分散した塗
膜をベース上に100個につき1個以下の重畳粒子しか有
さず、単位面積あたり50%以上の研磨材粒子濃度(面積
占有率)でほぼ単層構造で接着してなる研磨層を形成さ
せたことを特徴とする磁気ディスクテクスチャリング用
研磨具。
1. A coating film in which abrasive particles are dispersed in a binder resin has only one or less superimposed particles per 100 particles on a base and an abrasive particle concentration of 50% or more per unit area (area occupancy). A polishing tool for texturing a magnetic disk, characterized in that a polishing layer formed by bonding with a substantially single-layer structure is formed.
【請求項2】平均粒子径が(D50)が1〜6μmの研磨
材粒子と使用する前記第1項記載の研磨具。
2. The polishing tool according to claim 1, which is used with abrasive particles having an average particle diameter (D 50 ) of 1 to 6 μm.
【請求項3】研磨材粒子が、ベース上に均一に施されて
いる前記第1項又は2項記載の研磨具。
3. The polishing tool according to claim 1, wherein the abrasive particles are uniformly applied on the base.
【請求項4】研磨材粒子が、ベース上に不均一に施され
ている前記第1項又は第2項記載の研磨具。
4. The polishing tool according to claim 1, wherein the abrasive particles are unevenly applied on the base.
JP27487689A 1989-09-08 1989-10-24 Polishing tool Expired - Lifetime JP2856783B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27487689A JP2856783B2 (en) 1989-09-08 1989-10-24 Polishing tool

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-231724 1989-09-08
JP23172489 1989-09-08
JP27487689A JP2856783B2 (en) 1989-09-08 1989-10-24 Polishing tool

Publications (2)

Publication Number Publication Date
JPH03178776A JPH03178776A (en) 1991-08-02
JP2856783B2 true JP2856783B2 (en) 1999-02-10

Family

ID=26530052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27487689A Expired - Lifetime JP2856783B2 (en) 1989-09-08 1989-10-24 Polishing tool

Country Status (1)

Country Link
JP (1) JP2856783B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5429844B2 (en) * 2007-10-04 2014-02-26 Mipox株式会社 Cleaning tape and manufacturing method thereof
JP7408356B2 (en) * 2019-11-14 2024-01-05 株式会社三井ハイテック surface processing equipment

Also Published As

Publication number Publication date
JPH03178776A (en) 1991-08-02

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