JP7407811B2 - ワイヤボンドボールグリッドアレイパッケージ化集積回路チップの保護 - Google Patents
ワイヤボンドボールグリッドアレイパッケージ化集積回路チップの保護 Download PDFInfo
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Description
前記集積回路を前記装着帯に取り付けることと、
前記集積回路と前記複数の接点との間に複数のワイヤボンドを接続することと、
前記第2の表面上の周辺領域に複数のはんだボール接続を設けることと、を含み、前記基板を形成することは、前記第1の表面の前記電気接点を前記第2の表面の前記はんだボール接続と接続するために前記基板に複数の導電性トラックを設けることを含む。
以下の添付の図面を参照して、本出願を説明する。
Claims (6)
- 第1の表面と、前記第1の表面と反対側の第2の表面と、を有する基板(8)と、
前記基板(8)の前記第1の表面上の装着帯(22)に取り付けられた集積回路(2)
であって、前記装着帯(22)は、前記基板(8)の装着帯領域を画定し、前記基板の周辺領域によって囲まれている、集積回路(2)と、
前記周辺領域において、前記第1の表面の周りに提供される複数の電気接点(16)と、
前記集積回路(2)と前記複数の電気接点(16)との間に電気接続を提供する複数のワイヤボンド(74)と、
前記第2の表面上の前記周辺領域に設けられた複数のはんだボール接続(80)と、
前記第1の表面の電気接点(16)を前記第2の表面の前記はんだボール接続(80)と接続するために前記基板(8)に設けられた複数の接続(15)と、を備え、
前記基板(8)は、前記基板(8)の前記装着帯領域(42)を通ってルーティングされた少なくとも1つの導電性トラック(72)を含み、
前記少なくとも1つの導電性トラック(72)は、前記集積回路(2)の正常な動作に必要とされる前記集積回路(2)への電気接続を提供し、
チップ(40)は、前記少なくとも1つの導電性トラックの変更が前記集積回路(2)の動作を妨げるように構成され、
前記少なくとも1つの導電性トラック(72)は、少なくとも1つのはんだボール(80)に電気的に接続され、前記少なくとも1つのはんだボール(80)は、前記基板(8)の前記装着帯領域(42)に配置され、
前記少なくとも1つの導電性トラックは、セキュリティメカニズム(82)の一部を形成するセキュリティトラック(86)であり、前記セキュリティメカニズム(82)は、前記セキュリティトラック(86)の完全性への干渉を検出し、それに対して少なくとも1つの対抗措置を有効にするように構成される、
前記セキュリティメカニズム(82)は、前記セキュリティトラック(86)の第1の端部に信号を提供するための前記集積回路(2)上の信号送信器(87)と、
前記信号の変化を検出するための前記セキュリティトラック(86)の第2の端部に接続された検出回路(88)と、を備え
前記セキュリティメカニズム(82)は、さらに前記少なくとも1つの対抗措置の実行を引き起こすための前記検出回路(88)に応答する応答回路(89)をさらに含み、前記少なくとも1つの対抗措置は、前記チップの機能の全部または一部をリセットまたは無効にすることを含む
ことを特徴とする、チップ(40)。 - 接地面(62)が、前記基板(8)の前記装着帯領域(42)内の導電性材料の層として設けられ、前記少なくとも1つの導電性トラック(72)は、前記接地面(62)を分割する隔離された経路をたどる、請求項1に記載のチップ。
- 電源面が、前記基板(8)の前記装着帯領域(42)内の導電性材料の層として設けられ、前記少なくとも1つの導電性トラックは、前記電源面を分割する隔離された経路をたどる、
請求項1に記載のチップ。 - ワイヤボンドパッケージ化ボールグリッドアレイチップを変更から保護するための方法であって、
集積回路用の装着帯を有する第1の表面と、前記第1の表面と反対側の第2の表面と、を有する基板を形成することであって、前記装着帯は前記基板の装着帯領域を画定し、前記装着帯領域を囲む周辺領域において、前記第1の表面の周りに複数の接点を設けることを含む、基板を形成することと、
集積回路を前記装着帯に取り付けることと、
前記集積回路と前記複数の接点との間に複数のワイヤボンドを接続することと、
前記第2の表面上の周辺領域に複数のはんだボール接続を設けることと、を含み、
前記基板を形成することは、前記第1の表面の電気接点を前記第2の表面の前記はんだボール接続と接続するために前記基板に複数の接続を設けることを含み、
前記基板を形成することは、少なくとも1つの導電性トラックを前記基板の前記装着帯領域を通してルーティングすることを含み、
前記少なくとも1つの導電性トラックは、前記集積回路の後続の正常な動作に必要とされる前記集積回路への電気接続を提供し、
チップは、前記少なくとも1つの導電性トラックの変更が前記集積回路の動作を妨げるように構成され、
前記少なくとも1つの導電性トラック(72)は、少なくとも1つのはんだボール(80)に電気的に接続され、前記少なくとも1つのはんだボール(80)は、前記基板(8)の前記装着帯領域(42)に配置され、
前記少なくとも1つの導電性トラックは、セキュリティトラックであり、
前記方法は、前記セキュリティトラックを含むセキュリティメカニズムを提供することをさらに含み、前記セキュリティメカニズムは、前記セキュリティトラックの完全性への干渉を検出し、それに対して少なくとも1つの対抗措置を有効にするように構成され、
前記セキュリティメカニズムによって、前記セキュリティトラックの第1の端部に信号を提供することと、
前記セキュリティトラックの第2の端部で前記信号の変化を検出し、変化の検出に応答して、前記少なくとも1つの対抗措置の実行を引き起すことと、をさらに含み、前記少なくとも1つの対抗措置は、前記チップの機能の全部または一部をリセットまたは無効にする、
ことを特徴とする、方法。 - 接地面として機能する導電性材料の層を、前記基板の前記装着帯領域内に設けることを含み、前記少なくとも1つの導電性トラックが、前記接地面を分割する隔離された経路をたどる、請求項4に記載の方法。
- 電源面として機能する導電性材料の層を、前記基板の前記装着帯領域内に設けることをさらに含み、前記少なくとも1つの導電性トラックが、前記電源面を分割する隔離された経路をたどる、請求項5に記載の方法。
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EP18202853.0A EP3644351A1 (en) | 2018-10-26 | 2018-10-26 | Protection of wire-bond ball grid array packaged integrated circuit chips |
PCT/EP2019/078247 WO2020083745A1 (en) | 2018-10-26 | 2019-10-17 | Protection of wire-bond ball grid array packaged integrated circuit chips |
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JP2010524253A (ja) | 2007-04-13 | 2010-07-15 | マキシム・インテグレーテッド・プロダクツ・インコーポレーテッド | Bgaメッシュ・キャップを有するパッケージ・オン・パッケージ・セキュア・モジュール |
US20100276189A1 (en) | 2009-05-01 | 2010-11-04 | Samsung Electronics Co., Ltd. | Semiconductor package including power ball matrix and power ring having improved power integrity |
JP2014215072A (ja) | 2013-04-23 | 2014-11-17 | セイコーエプソン株式会社 | 物理量センサー、電子機器及び移動体 |
JP2018523290A (ja) | 2015-05-13 | 2018-08-16 | ナグラビジョン エス アー | 物理的及び/又は電気的変化に対する集積回路チップ保護 |
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US7161239B2 (en) * | 2000-12-22 | 2007-01-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
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JP2010524253A (ja) | 2007-04-13 | 2010-07-15 | マキシム・インテグレーテッド・プロダクツ・インコーポレーテッド | Bgaメッシュ・キャップを有するパッケージ・オン・パッケージ・セキュア・モジュール |
US20100276189A1 (en) | 2009-05-01 | 2010-11-04 | Samsung Electronics Co., Ltd. | Semiconductor package including power ball matrix and power ring having improved power integrity |
JP2014215072A (ja) | 2013-04-23 | 2014-11-17 | セイコーエプソン株式会社 | 物理量センサー、電子機器及び移動体 |
JP2018523290A (ja) | 2015-05-13 | 2018-08-16 | ナグラビジョン エス アー | 物理的及び/又は電気的変化に対する集積回路チップ保護 |
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