JP7403654B2 - 電子部品装着機及び電子部品装着機の制御方法 - Google Patents
電子部品装着機及び電子部品装着機の制御方法 Download PDFInfo
- Publication number
- JP7403654B2 JP7403654B2 JP2022534525A JP2022534525A JP7403654B2 JP 7403654 B2 JP7403654 B2 JP 7403654B2 JP 2022534525 A JP2022534525 A JP 2022534525A JP 2022534525 A JP2022534525 A JP 2022534525A JP 7403654 B2 JP7403654 B2 JP 7403654B2
- Authority
- JP
- Japan
- Prior art keywords
- rotational position
- feeder
- tape feeder
- electronic component
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 29
- 238000004891 communication Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 8
- 238000007726 management method Methods 0.000 description 83
- 239000000758 substrate Substances 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 11
- 230000032258 transport Effects 0.000 description 11
- 238000012546 transfer Methods 0.000 description 10
- 238000007689 inspection Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000013523 data management Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/026517 WO2022009298A1 (ja) | 2020-07-07 | 2020-07-07 | 電子部品装着機及び電子部品装着機の制御方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022009298A1 JPWO2022009298A1 (https=) | 2022-01-13 |
| JP7403654B2 true JP7403654B2 (ja) | 2023-12-22 |
Family
ID=79552300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022534525A Active JP7403654B2 (ja) | 2020-07-07 | 2020-07-07 | 電子部品装着機及び電子部品装着機の制御方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7403654B2 (https=) |
| CN (1) | CN115669251A (https=) |
| DE (1) | DE112020007391T5 (https=) |
| WO (1) | WO2022009298A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025181906A1 (ja) * | 2024-02-27 | 2025-09-04 | 株式会社Fuji | 外段取りシステム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234669A (ja) | 2006-02-27 | 2007-09-13 | Juki Corp | 表面実装装置 |
| WO2018163384A1 (ja) | 2017-03-09 | 2018-09-13 | 株式会社Fuji | 供給部品検査装置 |
| WO2019058562A1 (ja) | 2017-09-25 | 2019-03-28 | 株式会社Fuji | テープフィーダ |
| WO2019229958A1 (ja) | 2018-05-31 | 2019-12-05 | 株式会社Fuji | フィーダおよび部品実装機 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5641889B2 (https=) | 1973-09-12 | 1981-10-01 | ||
| US20080047652A1 (en) * | 2006-06-20 | 2008-02-28 | Charles Gutentag | Component handling using adhesive-backed carrier tape |
| JP2010221563A (ja) * | 2009-03-24 | 2010-10-07 | Brother Ind Ltd | テープカセット及びテープ印刷装置 |
| JP2013012572A (ja) * | 2011-06-29 | 2013-01-17 | Panasonic Corp | テープフィーダ |
| JP2014110322A (ja) * | 2012-12-03 | 2014-06-12 | Panasonic Corp | 電子部品実装装置におけるキャリアテープのセット正否判定システムおよびキャリアテープのセット正否判定方法 |
| JP5982649B2 (ja) * | 2013-08-05 | 2016-08-31 | パナソニックIpマネジメント株式会社 | 部品実装方法および部品実装装置 |
| JP6326551B2 (ja) * | 2015-04-23 | 2018-05-16 | ヤマハ発動機株式会社 | 部品実装機、部品実装機の制御方法、部品実装機の制御プログラム、記録媒体、部品実装システム |
| JP6918162B2 (ja) * | 2015-06-02 | 2021-08-11 | ヤマハ発動機株式会社 | 部品供給装置、表面実装機、及び部品の供給方法 |
| JP6717861B2 (ja) * | 2016-02-17 | 2020-07-08 | 株式会社Fuji | 部品実装ライン |
| JP6322257B2 (ja) * | 2016-10-24 | 2018-05-09 | ヤマハ発動機株式会社 | 電子部品装着装置及び電子部品装着装置における自動ローディング方法 |
| JP6752372B2 (ja) * | 2017-08-08 | 2020-09-09 | 株式会社Fuji | 製造システムおよび製造システムの制御方法 |
-
2020
- 2020-07-07 CN CN202080101509.9A patent/CN115669251A/zh active Pending
- 2020-07-07 JP JP2022534525A patent/JP7403654B2/ja active Active
- 2020-07-07 WO PCT/JP2020/026517 patent/WO2022009298A1/ja not_active Ceased
- 2020-07-07 DE DE112020007391.2T patent/DE112020007391T5/de active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234669A (ja) | 2006-02-27 | 2007-09-13 | Juki Corp | 表面実装装置 |
| WO2018163384A1 (ja) | 2017-03-09 | 2018-09-13 | 株式会社Fuji | 供給部品検査装置 |
| WO2019058562A1 (ja) | 2017-09-25 | 2019-03-28 | 株式会社Fuji | テープフィーダ |
| WO2019229958A1 (ja) | 2018-05-31 | 2019-12-05 | 株式会社Fuji | フィーダおよび部品実装機 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115669251A (zh) | 2023-01-31 |
| DE112020007391T5 (de) | 2023-04-20 |
| JPWO2022009298A1 (https=) | 2022-01-13 |
| WO2022009298A1 (ja) | 2022-01-13 |
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