JP7396863B2 - 保護部材の形成方法 - Google Patents
保護部材の形成方法 Download PDFInfo
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- JP7396863B2 JP7396863B2 JP2019201389A JP2019201389A JP7396863B2 JP 7396863 B2 JP7396863 B2 JP 7396863B2 JP 2019201389 A JP2019201389 A JP 2019201389A JP 2019201389 A JP2019201389 A JP 2019201389A JP 7396863 B2 JP7396863 B2 JP 7396863B2
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- thermoplastic resin
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- 238000000034 method Methods 0.000 title claims description 23
- 230000001681 protective effect Effects 0.000 title claims description 23
- 229920005989 resin Polymers 0.000 claims description 116
- 239000011347 resin Substances 0.000 claims description 116
- 229920005992 thermoplastic resin Polymers 0.000 claims description 57
- 238000001816 cooling Methods 0.000 claims description 13
- 230000000644 propagated effect Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000007666 vacuum forming Methods 0.000 description 27
- 230000032258 transport Effects 0.000 description 16
- 239000007788 liquid Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
なお、真空形成チャンバー2の上面における支持柱11の貫通部分には、真空形成チャンバー2内の真空を維持するための真空シール2aが設けられている。
なお、粒状の熱可塑性樹脂Pが樹脂載置面23から落ちないように、樹脂載置面23の外周には環状の凸部を形成してもよい。
この状態で、制御手段70は、真空ポンプ7を制御して、真空形成チャンバー2内を真空引きする。
したがって、制御手段70は、たとえば、超音波受信器33によって受信される超音波振動の振幅が所定値以上となった場合に、ウェーハ保持面13と樹脂載置面23との間に挟まれている熱可塑性樹脂Pが溶けて一体化されている(液状化されている)、と判断する。
なお、ウェーハ搬送手段40は、ウェーハWの第1面Waを保持してもよい。
2:真空形成チャンバー、3:カバー、5:カバー開閉手段、7:真空ポンプ、
10:ウェーハ保持手段、12:ウェーハ保持テーブル、13:ウェーハ保持面、
14:エア供給源、15:通気路、16:吸引源、
17:超音波発信部、18:超音波発振器、
20:ステージ、22:樹脂載置テーブル、23:樹脂載置面、
24:ペルチェ素子、24a:上面、24b:下面、
25:第1電力線、26:第2電力線、
27:切換手段、28:直流電源、33:超音波受信器、34:超音波受信部
30:上下移動手段、60:荷重検知手段、
40:ウェーハ搬送手段、50:樹脂搬送手段、
70:制御手段、
S:溶融樹脂層、
W:ウェーハ、Wb:第2面
Claims (1)
- 熱可塑性樹脂を溶かして、ウェーハの一方の面の全面に押し広げた該熱可塑性樹脂を硬化させ、保護部材を形成する保護部材の形成方法であって、
ステージの樹脂載置面に、複数の粒状の該熱可塑性樹脂を配置する樹脂供給工程と、
ウェーハ保持手段のウェーハ保持面によってウェーハの他方の面を保持するウェーハ保持工程と、
上下移動手段を用いて、該ウェーハ保持手段と該ステージとを相対的に接近する方向に移動させることにより、粒状の該熱可塑性樹脂に、該ウェーハ保持手段に保持されたウェーハの一方の面を接触させる接触工程と、
該ウェーハの一方の面に接触している粒状の該熱可塑性樹脂を加熱するとともに、該樹脂載置面と該ウェーハ保持面との間で超音波振動を伝播させ、該ウェーハ保持面に保持されたウェーハの一方の面と該樹脂載置面との間に挟まれている該熱可塑性樹脂が一体化されているか否かを認識する樹脂状態認識工程と、
該樹脂状態認識工程で一体化されていると認識された該熱可塑性樹脂を、該ウェーハによって、該ウェーハの一方の面の全面に押し広げる押し広げ工程と、
該押し広げられた該熱可塑性樹脂を冷却して硬化させる硬化工程と、
を備え、ウェーハの一方の面の全面を保護する保護部材を形成する、
保護部材の形成方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019201389A JP7396863B2 (ja) | 2019-11-06 | 2019-11-06 | 保護部材の形成方法 |
TW109136723A TWI844744B (zh) | 2019-11-06 | 2020-10-22 | 保護構件之形成方法 |
CN202011189624.4A CN112786487A (zh) | 2019-11-06 | 2020-10-30 | 保护部件的形成方法 |
KR1020200145296A KR20210055007A (ko) | 2019-11-06 | 2020-11-03 | 보호 부재의 형성 방법 |
DE102020213864.8A DE102020213864A1 (de) | 2019-11-06 | 2020-11-04 | Ausbildungsverfahren für Schutzelement |
US17/089,070 US11325284B2 (en) | 2019-11-06 | 2020-11-04 | Protective member forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019201389A JP7396863B2 (ja) | 2019-11-06 | 2019-11-06 | 保護部材の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021077695A JP2021077695A (ja) | 2021-05-20 |
JP7396863B2 true JP7396863B2 (ja) | 2023-12-12 |
Family
ID=75485567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019201389A Active JP7396863B2 (ja) | 2019-11-06 | 2019-11-06 | 保護部材の形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11325284B2 (ja) |
JP (1) | JP7396863B2 (ja) |
KR (1) | KR20210055007A (ja) |
CN (1) | CN112786487A (ja) |
DE (1) | DE102020213864A1 (ja) |
TW (1) | TWI844744B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102467529B1 (ko) * | 2019-11-07 | 2022-11-16 | 세메스 주식회사 | 반송 유닛, 이를 포함하는 기판 처리 장치 및 기판 처리 방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156683A (ja) | 2004-11-29 | 2006-06-15 | Tokyo Ohka Kogyo Co Ltd | サポートプレートの貼り付け方法 |
JP2007311727A (ja) | 2006-05-22 | 2007-11-29 | Sumitomo Bakelite Co Ltd | 半導体素子の製造方法および半導体パッケージの製造方法 |
JP2010186776A (ja) | 2009-02-10 | 2010-08-26 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
JP2012146871A (ja) | 2011-01-13 | 2012-08-02 | Disco Abrasive Syst Ltd | ワーク保持装置 |
JP2013175647A (ja) | 2012-02-27 | 2013-09-05 | Disco Abrasive Syst Ltd | 樹脂貼付装置 |
US20170121552A1 (en) | 2014-03-28 | 2017-05-04 | Lintec Corporation | Protective film-forming film and method of manufacturing semiconductor chip with protective film |
JP2018142630A (ja) | 2017-02-28 | 2018-09-13 | 日化精工株式会社 | ウェーハ仮止め用ワックス及びウェーハの仮止め方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6602702B2 (ja) | 2016-03-15 | 2019-11-06 | 株式会社ディスコ | 保護部材形成装置 |
JP7105053B2 (ja) * | 2017-11-06 | 2022-07-22 | 株式会社ディスコ | 保護部材形成装置 |
DE102018200656A1 (de) * | 2018-01-16 | 2019-07-18 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers |
-
2019
- 2019-11-06 JP JP2019201389A patent/JP7396863B2/ja active Active
-
2020
- 2020-10-22 TW TW109136723A patent/TWI844744B/zh active
- 2020-10-30 CN CN202011189624.4A patent/CN112786487A/zh active Pending
- 2020-11-03 KR KR1020200145296A patent/KR20210055007A/ko unknown
- 2020-11-04 DE DE102020213864.8A patent/DE102020213864A1/de active Granted
- 2020-11-04 US US17/089,070 patent/US11325284B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156683A (ja) | 2004-11-29 | 2006-06-15 | Tokyo Ohka Kogyo Co Ltd | サポートプレートの貼り付け方法 |
JP2007311727A (ja) | 2006-05-22 | 2007-11-29 | Sumitomo Bakelite Co Ltd | 半導体素子の製造方法および半導体パッケージの製造方法 |
JP2010186776A (ja) | 2009-02-10 | 2010-08-26 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
JP2012146871A (ja) | 2011-01-13 | 2012-08-02 | Disco Abrasive Syst Ltd | ワーク保持装置 |
JP2013175647A (ja) | 2012-02-27 | 2013-09-05 | Disco Abrasive Syst Ltd | 樹脂貼付装置 |
US20170121552A1 (en) | 2014-03-28 | 2017-05-04 | Lintec Corporation | Protective film-forming film and method of manufacturing semiconductor chip with protective film |
JP2018142630A (ja) | 2017-02-28 | 2018-09-13 | 日化精工株式会社 | ウェーハ仮止め用ワックス及びウェーハの仮止め方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI844744B (zh) | 2024-06-11 |
JP2021077695A (ja) | 2021-05-20 |
TW202119540A (zh) | 2021-05-16 |
US20210129394A1 (en) | 2021-05-06 |
KR20210055007A (ko) | 2021-05-14 |
US11325284B2 (en) | 2022-05-10 |
CN112786487A (zh) | 2021-05-11 |
DE102020213864A1 (de) | 2021-05-06 |
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