JP7394782B2 - 高耐電圧放熱絶縁性樹脂組成物、およびそれを用いた電子部品 - Google Patents
高耐電圧放熱絶縁性樹脂組成物、およびそれを用いた電子部品 Download PDFInfo
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- JP7394782B2 JP7394782B2 JP2020558077A JP2020558077A JP7394782B2 JP 7394782 B2 JP7394782 B2 JP 7394782B2 JP 2020558077 A JP2020558077 A JP 2020558077A JP 2020558077 A JP2020558077 A JP 2020558077A JP 7394782 B2 JP7394782 B2 JP 7394782B2
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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| JP2018217275 | 2018-11-20 | ||
| JP2018217275 | 2018-11-20 | ||
| PCT/JP2019/026696 WO2020105215A1 (ja) | 2018-11-20 | 2019-07-04 | 高耐電圧放熱絶縁性樹脂組成物、およびそれを用いた電子部品 |
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| JPWO2020105215A1 JPWO2020105215A1 (ja) | 2021-10-14 |
| JP7394782B2 true JP7394782B2 (ja) | 2023-12-08 |
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| JP (1) | JP7394782B2 (zh) |
| CN (1) | CN112823188B (zh) |
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| CN111164151A (zh) * | 2017-10-10 | 2020-05-15 | 味之素株式会社 | 固化体及其制造方法、树脂片材及树脂组合物 |
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| JP2007262398A (ja) | 2006-03-01 | 2007-10-11 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及び電子部品装置 |
| WO2009136542A1 (ja) | 2008-05-08 | 2009-11-12 | 富士高分子工業株式会社 | 熱伝導性樹脂組成物 |
| JP2013189625A (ja) | 2012-02-15 | 2013-09-26 | Nippon Steel & Sumikin Chemical Co Ltd | 高熱伝導性樹脂硬化物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂組成物 |
| WO2014192402A1 (ja) | 2013-05-30 | 2014-12-04 | 住友ベークライト株式会社 | 疎水性無機粒子、放熱部材用樹脂組成物および電子部品装置 |
| JP2015103578A (ja) | 2013-11-21 | 2015-06-04 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、及び、半導体装置の製造方法 |
| JP2015193687A (ja) | 2014-03-31 | 2015-11-05 | ナミックス株式会社 | 樹脂組成物、接着フィルム、および半導体装置 |
| JP2016089169A (ja) | 2014-10-30 | 2016-05-23 | Dic株式会社 | 複合樹脂組成物、成形体、熱伝導材料及び熱伝導材料 |
| WO2018084121A1 (ja) | 2016-11-01 | 2018-05-11 | 太陽ホールディングス株式会社 | プリント配線板用の硬化性絶縁性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板用の硬化性絶縁性組成物の製造方法 |
| WO2018131486A1 (ja) | 2017-01-13 | 2018-07-19 | デンカ株式会社 | 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4920929B2 (ja) * | 2005-08-12 | 2012-04-18 | 太陽ホールディングス株式会社 | ソルダーレジスト組成物、及びその硬化物並びにそれを用いたプリント配線板 |
| JP5089885B2 (ja) * | 2006-01-17 | 2012-12-05 | 太陽ホールディングス株式会社 | 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 |
| US8465666B2 (en) * | 2009-02-25 | 2013-06-18 | Panasonic Corporation | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
| JP5337316B2 (ja) * | 2012-01-30 | 2013-11-06 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 高誘電絶縁性樹脂組成物 |
| JP6366228B2 (ja) * | 2013-06-04 | 2018-08-01 | 日東電工株式会社 | 接着シート、及びダイシング・ダイボンディングフィルム |
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- 2019-07-04 JP JP2020558077A patent/JP7394782B2/ja active Active
- 2019-07-04 CN CN201980067078.6A patent/CN112823188B/zh active Active
- 2019-07-16 TW TW108125065A patent/TWI819033B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007262398A (ja) | 2006-03-01 | 2007-10-11 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及び電子部品装置 |
| WO2009136542A1 (ja) | 2008-05-08 | 2009-11-12 | 富士高分子工業株式会社 | 熱伝導性樹脂組成物 |
| JP2013189625A (ja) | 2012-02-15 | 2013-09-26 | Nippon Steel & Sumikin Chemical Co Ltd | 高熱伝導性樹脂硬化物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂組成物 |
| WO2014192402A1 (ja) | 2013-05-30 | 2014-12-04 | 住友ベークライト株式会社 | 疎水性無機粒子、放熱部材用樹脂組成物および電子部品装置 |
| JP2015103578A (ja) | 2013-11-21 | 2015-06-04 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、及び、半導体装置の製造方法 |
| JP2015193687A (ja) | 2014-03-31 | 2015-11-05 | ナミックス株式会社 | 樹脂組成物、接着フィルム、および半導体装置 |
| JP2016089169A (ja) | 2014-10-30 | 2016-05-23 | Dic株式会社 | 複合樹脂組成物、成形体、熱伝導材料及び熱伝導材料 |
| WO2018084121A1 (ja) | 2016-11-01 | 2018-05-11 | 太陽ホールディングス株式会社 | プリント配線板用の硬化性絶縁性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板用の硬化性絶縁性組成物の製造方法 |
| WO2018131486A1 (ja) | 2017-01-13 | 2018-07-19 | デンカ株式会社 | 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI819033B (zh) | 2023-10-21 |
| CN112823188B (zh) | 2023-08-11 |
| WO2020105215A1 (ja) | 2020-05-28 |
| CN112823188A (zh) | 2021-05-18 |
| TW202024205A (zh) | 2020-07-01 |
| JPWO2020105215A1 (ja) | 2021-10-14 |
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