JP7385758B2 - 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 - Google Patents

樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 Download PDF

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JP7385758B2
JP7385758B2 JP2022537992A JP2022537992A JP7385758B2 JP 7385758 B2 JP7385758 B2 JP 7385758B2 JP 2022537992 A JP2022537992 A JP 2022537992A JP 2022537992 A JP2022537992 A JP 2022537992A JP 7385758 B2 JP7385758 B2 JP 7385758B2
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JPWO2022019253A1 (https=
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雅臣 牧野
敬史 川島
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/152—One-dimensional array CCD image sensors

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Materials For Photolithography (AREA)
JP2022537992A 2020-07-22 2021-07-19 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 Active JP7385758B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020124896 2020-07-22
JP2020124896 2020-07-22
PCT/JP2021/026919 WO2022019253A1 (ja) 2020-07-22 2021-07-19 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物

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JPWO2022019253A1 JPWO2022019253A1 (https=) 2022-01-27
JP7385758B2 true JP7385758B2 (ja) 2023-11-22

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JP2022537992A Active JP7385758B2 (ja) 2020-07-22 2021-07-19 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物

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JP (1) JP7385758B2 (https=)
KR (1) KR102918871B1 (https=)
CN (1) CN115768833B (https=)
TW (1) TWI895462B (https=)
WO (1) WO2022019253A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022176788A1 (https=) * 2021-02-18 2022-08-25

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250034472A (ko) * 2022-10-28 2025-03-11 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231281A (ja) 2010-04-30 2011-11-17 Tokyo Metropolitan Univ ポリイミド樹脂およびその利用
JP2013095921A (ja) 2011-11-01 2013-05-20 Chi Mei Corp ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用

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JPH047333A (ja) * 1990-04-25 1992-01-10 Japan Carlit Co Ltd:The 新規ポリイミド
US6900271B2 (en) * 2002-05-31 2005-05-31 Elsicon, Inc Hybrid polymer materials for liquid crystal alignment layers
JP2009276722A (ja) 2008-05-19 2009-11-26 Chisso Corp カラーフィルター用着色組成物
JP2010185934A (ja) 2009-02-10 2010-08-26 Toyo Ink Mfg Co Ltd カラーフィルタ用着色組成物及びカラーフィルタ
JP6203612B2 (ja) 2013-11-27 2017-09-27 株式会社日立プラントメカニクス バケット重量測定装置
JP6209499B2 (ja) * 2014-03-18 2017-10-04 富士フイルム株式会社 着色硬化性樹脂組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、画像表示装置、化合物およびカチオン
JP6589305B2 (ja) 2015-03-13 2019-10-16 東洋インキＳｃホールディングス株式会社 カラーフィルタ用着色組成物、およびカラーフィルタ
JP6686657B2 (ja) * 2015-04-22 2020-04-22 Jsr株式会社 着色組成物、着色硬化膜、カラーフィルタ、表示素子及び固体撮像素子
CN110226129A (zh) * 2017-02-23 2019-09-10 富士胶片株式会社 感光性组合物、固化膜、滤色器、固体摄像元件及图像显示装置
US11702565B2 (en) * 2017-08-02 2023-07-18 Asahi Kasei Kabushiki Kaisha Polyimide varnish and method for producing same
KR20200055715A (ko) * 2017-09-29 2020-05-21 도레이 카부시키가이샤 감광성 수지 조성물, 경화막, 경화막을 구비하는 소자 및 유기 el 디스플레이, 그리고 유기 el 디스플레이의 제조 방법
JP7229354B2 (ja) * 2019-07-11 2023-02-27 富士フイルム株式会社 樹脂組成物、膜、カラーフィルタ、固体撮像素子、画像表示装置、樹脂および化合物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231281A (ja) 2010-04-30 2011-11-17 Tokyo Metropolitan Univ ポリイミド樹脂およびその利用
JP2013095921A (ja) 2011-11-01 2013-05-20 Chi Mei Corp ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022176788A1 (https=) * 2021-02-18 2022-08-25
JP7820350B2 (ja) 2021-02-18 2026-02-25 富士フイルム株式会社 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および樹脂の製造方法

Also Published As

Publication number Publication date
KR20230013086A (ko) 2023-01-26
TWI895462B (zh) 2025-09-01
TW202206554A (zh) 2022-02-16
CN115768833A (zh) 2023-03-07
CN115768833B (zh) 2024-07-23
KR102918871B1 (ko) 2026-01-29
JPWO2022019253A1 (https=) 2022-01-27
WO2022019253A1 (ja) 2022-01-27

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