JPWO2022019253A1 - - Google Patents
Info
- Publication number
- JPWO2022019253A1 JPWO2022019253A1 JP2022537992A JP2022537992A JPWO2022019253A1 JP WO2022019253 A1 JPWO2022019253 A1 JP WO2022019253A1 JP 2022537992 A JP2022537992 A JP 2022537992A JP 2022537992 A JP2022537992 A JP 2022537992A JP WO2022019253 A1 JPWO2022019253 A1 JP WO2022019253A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/152—One-dimensional array CCD image sensors
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Filters (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020124896 | 2020-07-22 | ||
| JP2020124896 | 2020-07-22 | ||
| PCT/JP2021/026919 WO2022019253A1 (ja) | 2020-07-22 | 2021-07-19 | 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022019253A1 true JPWO2022019253A1 (https=) | 2022-01-27 |
| JP7385758B2 JP7385758B2 (ja) | 2023-11-22 |
Family
ID=79729571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022537992A Active JP7385758B2 (ja) | 2020-07-22 | 2021-07-19 | 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7385758B2 (https=) |
| KR (1) | KR102918871B1 (https=) |
| CN (1) | CN115768833B (https=) |
| TW (1) | TWI895462B (https=) |
| WO (1) | WO2022019253A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022176788A1 (ja) * | 2021-02-18 | 2022-08-25 | 富士フイルム株式会社 | 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および樹脂の製造方法 |
| KR20250034472A (ko) * | 2022-10-28 | 2025-03-11 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047333A (ja) * | 1990-04-25 | 1992-01-10 | Japan Carlit Co Ltd:The | 新規ポリイミド |
| JP2011231281A (ja) * | 2010-04-30 | 2011-11-17 | Tokyo Metropolitan Univ | ポリイミド樹脂およびその利用 |
| JP2013095921A (ja) * | 2011-11-01 | 2013-05-20 | Chi Mei Corp | ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6900271B2 (en) * | 2002-05-31 | 2005-05-31 | Elsicon, Inc | Hybrid polymer materials for liquid crystal alignment layers |
| JP2009276722A (ja) | 2008-05-19 | 2009-11-26 | Chisso Corp | カラーフィルター用着色組成物 |
| JP2010185934A (ja) | 2009-02-10 | 2010-08-26 | Toyo Ink Mfg Co Ltd | カラーフィルタ用着色組成物及びカラーフィルタ |
| JP6203612B2 (ja) | 2013-11-27 | 2017-09-27 | 株式会社日立プラントメカニクス | バケット重量測定装置 |
| JP6209499B2 (ja) * | 2014-03-18 | 2017-10-04 | 富士フイルム株式会社 | 着色硬化性樹脂組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、画像表示装置、化合物およびカチオン |
| JP6589305B2 (ja) | 2015-03-13 | 2019-10-16 | 東洋インキＳｃホールディングス株式会社 | カラーフィルタ用着色組成物、およびカラーフィルタ |
| JP6686657B2 (ja) * | 2015-04-22 | 2020-04-22 | Jsr株式会社 | 着色組成物、着色硬化膜、カラーフィルタ、表示素子及び固体撮像素子 |
| CN110226129A (zh) * | 2017-02-23 | 2019-09-10 | 富士胶片株式会社 | 感光性组合物、固化膜、滤色器、固体摄像元件及图像显示装置 |
| US11702565B2 (en) * | 2017-08-02 | 2023-07-18 | Asahi Kasei Kabushiki Kaisha | Polyimide varnish and method for producing same |
| KR20200055715A (ko) * | 2017-09-29 | 2020-05-21 | 도레이 카부시키가이샤 | 감광성 수지 조성물, 경화막, 경화막을 구비하는 소자 및 유기 el 디스플레이, 그리고 유기 el 디스플레이의 제조 방법 |
| JP7229354B2 (ja) * | 2019-07-11 | 2023-02-27 | 富士フイルム株式会社 | 樹脂組成物、膜、カラーフィルタ、固体撮像素子、画像表示装置、樹脂および化合物 |
-
2021
- 2021-07-16 TW TW110126156A patent/TWI895462B/zh active
- 2021-07-19 JP JP2022537992A patent/JP7385758B2/ja active Active
- 2021-07-19 KR KR1020227044440A patent/KR102918871B1/ko active Active
- 2021-07-19 CN CN202180045238.4A patent/CN115768833B/zh active Active
- 2021-07-19 WO PCT/JP2021/026919 patent/WO2022019253A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047333A (ja) * | 1990-04-25 | 1992-01-10 | Japan Carlit Co Ltd:The | 新規ポリイミド |
| JP2011231281A (ja) * | 2010-04-30 | 2011-11-17 | Tokyo Metropolitan Univ | ポリイミド樹脂およびその利用 |
| JP2013095921A (ja) * | 2011-11-01 | 2013-05-20 | Chi Mei Corp | ポリシロキサングラフト化ポリイミド樹脂組成物及びその応用 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230013086A (ko) | 2023-01-26 |
| TWI895462B (zh) | 2025-09-01 |
| JP7385758B2 (ja) | 2023-11-22 |
| TW202206554A (zh) | 2022-02-16 |
| CN115768833A (zh) | 2023-03-07 |
| CN115768833B (zh) | 2024-07-23 |
| KR102918871B1 (ko) | 2026-01-29 |
| WO2022019253A1 (ja) | 2022-01-27 |
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