KR102918871B1 - 수지 조성물, 막, 광학 필터, 고체 촬상 소자, 화상 표시 장치, 수지 및 화합물 - Google Patents

수지 조성물, 막, 광학 필터, 고체 촬상 소자, 화상 표시 장치, 수지 및 화합물

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KR102918871B1
KR102918871B1 KR1020227044440A KR20227044440A KR102918871B1 KR 102918871 B1 KR102918871 B1 KR 102918871B1 KR 1020227044440 A KR1020227044440 A KR 1020227044440A KR 20227044440 A KR20227044440 A KR 20227044440A KR 102918871 B1 KR102918871 B1 KR 102918871B1
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resin composition
japanese patent
formula
resin
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KR20230013086A (ko
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마사오미 마키노
타카시 카와시마
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후지필름 가부시키가이샤
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • H10F39/152One-dimensional array CCD image sensors

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Materials For Photolithography (AREA)
KR1020227044440A 2020-07-22 2021-07-19 수지 조성물, 막, 광학 필터, 고체 촬상 소자, 화상 표시 장치, 수지 및 화합물 Active KR102918871B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-124896 2020-07-22
JP2020124896 2020-07-22
PCT/JP2021/026919 WO2022019253A1 (ja) 2020-07-22 2021-07-19 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および化合物

Publications (2)

Publication Number Publication Date
KR20230013086A KR20230013086A (ko) 2023-01-26
KR102918871B1 true KR102918871B1 (ko) 2026-01-29

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KR1020227044440A Active KR102918871B1 (ko) 2020-07-22 2021-07-19 수지 조성물, 막, 광학 필터, 고체 촬상 소자, 화상 표시 장치, 수지 및 화합물

Country Status (5)

Country Link
JP (1) JP7385758B2 (https=)
KR (1) KR102918871B1 (https=)
CN (1) CN115768833B (https=)
TW (1) TWI895462B (https=)
WO (1) WO2022019253A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022176788A1 (ja) * 2021-02-18 2022-08-25 富士フイルム株式会社 樹脂組成物、膜、光学フィルタ、固体撮像素子、画像表示装置、樹脂および樹脂の製造方法
KR20250034472A (ko) * 2022-10-28 2025-03-11 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009276722A (ja) 2008-05-19 2009-11-26 Chisso Corp カラーフィルター用着色組成物
JP2010185934A (ja) 2009-02-10 2010-08-26 Toyo Ink Mfg Co Ltd カラーフィルタ用着色組成物及びカラーフィルタ
JP2015101465A (ja) 2013-11-27 2015-06-04 株式会社日立プラントメカニクス バケット重量測定装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH047333A (ja) * 1990-04-25 1992-01-10 Japan Carlit Co Ltd:The 新規ポリイミド
US6900271B2 (en) * 2002-05-31 2005-05-31 Elsicon, Inc Hybrid polymer materials for liquid crystal alignment layers
JP5427688B2 (ja) * 2010-04-30 2014-02-26 公立大学法人首都大学東京 ポリイミド樹脂およびその利用
US8729178B2 (en) * 2011-11-01 2014-05-20 Chi Mei Corporation Polysiloxane-grafted polyimide resin composition and applications thereof
JP6209499B2 (ja) * 2014-03-18 2017-10-04 富士フイルム株式会社 着色硬化性樹脂組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、固体撮像素子、画像表示装置、化合物およびカチオン
JP6589305B2 (ja) 2015-03-13 2019-10-16 東洋インキScホールディングス株式会社 カラーフィルタ用着色組成物、およびカラーフィルタ
JP6686657B2 (ja) * 2015-04-22 2020-04-22 Jsr株式会社 着色組成物、着色硬化膜、カラーフィルタ、表示素子及び固体撮像素子
CN110226129A (zh) * 2017-02-23 2019-09-10 富士胶片株式会社 感光性组合物、固化膜、滤色器、固体摄像元件及图像显示装置
US11702565B2 (en) * 2017-08-02 2023-07-18 Asahi Kasei Kabushiki Kaisha Polyimide varnish and method for producing same
KR20200055715A (ko) * 2017-09-29 2020-05-21 도레이 카부시키가이샤 감광성 수지 조성물, 경화막, 경화막을 구비하는 소자 및 유기 el 디스플레이, 그리고 유기 el 디스플레이의 제조 방법
JP7229354B2 (ja) * 2019-07-11 2023-02-27 富士フイルム株式会社 樹脂組成物、膜、カラーフィルタ、固体撮像素子、画像表示装置、樹脂および化合物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009276722A (ja) 2008-05-19 2009-11-26 Chisso Corp カラーフィルター用着色組成物
JP2010185934A (ja) 2009-02-10 2010-08-26 Toyo Ink Mfg Co Ltd カラーフィルタ用着色組成物及びカラーフィルタ
JP2015101465A (ja) 2013-11-27 2015-06-04 株式会社日立プラントメカニクス バケット重量測定装置

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Publication number Publication date
KR20230013086A (ko) 2023-01-26
TWI895462B (zh) 2025-09-01
JP7385758B2 (ja) 2023-11-22
TW202206554A (zh) 2022-02-16
CN115768833A (zh) 2023-03-07
CN115768833B (zh) 2024-07-23
JPWO2022019253A1 (https=) 2022-01-27
WO2022019253A1 (ja) 2022-01-27

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