JP7376597B2 - ディスプレイ装置 - Google Patents
ディスプレイ装置 Download PDFInfo
- Publication number
- JP7376597B2 JP7376597B2 JP2021537113A JP2021537113A JP7376597B2 JP 7376597 B2 JP7376597 B2 JP 7376597B2 JP 2021537113 A JP2021537113 A JP 2021537113A JP 2021537113 A JP2021537113 A JP 2021537113A JP 7376597 B2 JP7376597 B2 JP 7376597B2
- Authority
- JP
- Japan
- Prior art keywords
- light extraction
- extraction pattern
- display device
- light
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000605 extraction Methods 0.000 claims description 229
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 17
- 239000011368 organic material Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 6
- 239000010419 fine particle Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 122
- 239000010408 film Substances 0.000 description 39
- 239000010409 thin film Substances 0.000 description 30
- 238000007789 sealing Methods 0.000 description 17
- 239000003990 capacitor Substances 0.000 description 13
- 238000003860 storage Methods 0.000 description 13
- 239000002346 layers by function Substances 0.000 description 11
- 101100438516 Arabidopsis thaliana CAX1 gene Proteins 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- 101150098429 CAX2 gene Proteins 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- -1 region Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180171135A KR102669515B1 (ko) | 2018-12-27 | 2018-12-27 | 디스플레이 장치 |
| KR10-2018-0171135 | 2018-12-27 | ||
| PCT/KR2019/013432 WO2020138665A1 (ko) | 2018-12-27 | 2019-10-14 | 디스플레이 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022515811A JP2022515811A (ja) | 2022-02-22 |
| JP7376597B2 true JP7376597B2 (ja) | 2023-11-08 |
Family
ID=71125827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021537113A Active JP7376597B2 (ja) | 2018-12-27 | 2019-10-14 | ディスプレイ装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11871608B2 (zh) |
| JP (1) | JP7376597B2 (zh) |
| KR (1) | KR102669515B1 (zh) |
| CN (1) | CN113261127B (zh) |
| TW (1) | TWI832949B (zh) |
| WO (1) | WO2020138665A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220077307A (ko) | 2020-12-01 | 2022-06-09 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN112713249B (zh) * | 2020-12-14 | 2023-04-18 | 广州国显科技有限公司 | 显示面板及其制备方法 |
| CN113629214B (zh) * | 2021-08-06 | 2023-12-26 | 武汉天马微电子有限公司 | 显示面板及其制作方法、显示装置 |
| CN114122285B (zh) * | 2021-10-14 | 2022-12-06 | 云谷（固安）科技有限公司 | 显示面板及显示装置 |
| KR20230103424A (ko) * | 2021-12-31 | 2023-07-07 | 엘지디스플레이 주식회사 | 유기발광 표시장치 및 유기발광 표시패널 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299044A (ja) | 2001-03-30 | 2002-10-11 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置 |
| JP2004020746A (ja) | 2002-06-13 | 2004-01-22 | Sumitomo Bakelite Co Ltd | 発光装置用基板およびこれを用いた発光装置 |
| US20040080264A1 (en) | 2002-03-26 | 2004-04-29 | Dai Nippon Printing Co., Ltd. | Electroluminescent display |
| JP2004205849A (ja) | 2002-12-25 | 2004-07-22 | Seiko Epson Corp | 表示体および表示装置 |
| JP2007248484A (ja) | 2006-03-13 | 2007-09-27 | Sony Corp | 表示装置 |
| JP2010123450A (ja) | 2008-11-20 | 2010-06-03 | Sony Corp | 反射板、表示装置およびその製造方法 |
| JP2010244848A (ja) | 2009-04-06 | 2010-10-28 | Canon Inc | 発光装置 |
| CN107845668A (zh) | 2017-11-14 | 2018-03-27 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板及其制备方法和显示装置 |
| JP2019175619A (ja) | 2018-03-27 | 2019-10-10 | 株式会社ダイセル | 有機ｅｌ表示装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003115377A (ja) | 2001-10-03 | 2003-04-18 | Nec Corp | 発光素子、その製造方法およびこれを用いた表示装置 |
| US7202504B2 (en) | 2004-05-20 | 2007-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element and display device |
| JP2007080579A (ja) * | 2005-09-12 | 2007-03-29 | Toyota Industries Corp | 面発光装置 |
| KR101064016B1 (ko) * | 2008-11-26 | 2011-09-08 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
| KR101137390B1 (ko) * | 2009-12-24 | 2012-04-26 | 삼성모바일디스플레이주식회사 | 광학필름 및 이를 구비하는 유기 발광 디스플레이 장치 |
| JP2012134128A (ja) * | 2010-11-30 | 2012-07-12 | Canon Inc | 表示装置 |
| JP2013073799A (ja) * | 2011-09-28 | 2013-04-22 | Canon Inc | 表示装置 |
| KR101894025B1 (ko) * | 2011-12-16 | 2018-09-03 | 엘지이노텍 주식회사 | 발광소자 |
| KR101975309B1 (ko) * | 2012-07-25 | 2019-09-11 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 소자 및 그 제조 방법 |
| JP2015122248A (ja) | 2013-12-25 | 2015-07-02 | 株式会社ジャパンディスプレイ | 有機ｅｌ表示装置 |
| JP6389044B2 (ja) | 2013-12-26 | 2018-09-12 | 株式会社Ｊｏｌｅｄ | 表示装置、表示装置の製造方法、及び、表示装置の設計方法 |
| KR102086557B1 (ko) * | 2013-12-31 | 2020-03-10 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102189819B1 (ko) * | 2014-09-01 | 2020-12-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102293473B1 (ko) * | 2014-09-17 | 2021-08-24 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| KR20160034457A (ko) | 2014-09-19 | 2016-03-30 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
| KR20160108008A (ko) | 2015-03-06 | 2016-09-19 | 동우 화인켐 주식회사 | 유기발광다이오드용 패널 및 이를 포함하는 유기발광다이오드 디스플레이 |
| KR102425836B1 (ko) * | 2015-03-24 | 2022-07-29 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| US10374197B2 (en) | 2015-10-30 | 2019-08-06 | Lg Display Co., Ltd. | Organic light emitting diode display device with micro lenses |
| KR20170052447A (ko) | 2015-10-30 | 2017-05-12 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| JP2018006212A (ja) * | 2016-07-05 | 2018-01-11 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102601128B1 (ko) | 2016-09-29 | 2023-11-10 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| KR102671370B1 (ko) | 2016-12-06 | 2024-06-04 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR20180076429A (ko) * | 2016-12-27 | 2018-07-06 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 그 제조방법 |
| KR102663231B1 (ko) | 2016-12-30 | 2024-05-02 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| KR20180083469A (ko) * | 2017-01-12 | 2018-07-23 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
-
2018
- 2018-12-27 KR KR1020180171135A patent/KR102669515B1/ko active IP Right Grant
-
2019
- 2019-10-14 CN CN201980085910.5A patent/CN113261127B/zh active Active
- 2019-10-14 JP JP2021537113A patent/JP7376597B2/ja active Active
- 2019-10-14 WO PCT/KR2019/013432 patent/WO2020138665A1/ko active Application Filing
- 2019-10-14 US US17/417,422 patent/US11871608B2/en active Active
- 2019-12-26 TW TW108147950A patent/TWI832949B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002299044A (ja) | 2001-03-30 | 2002-10-11 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置 |
| US20040080264A1 (en) | 2002-03-26 | 2004-04-29 | Dai Nippon Printing Co., Ltd. | Electroluminescent display |
| JP2004020746A (ja) | 2002-06-13 | 2004-01-22 | Sumitomo Bakelite Co Ltd | 発光装置用基板およびこれを用いた発光装置 |
| JP2004205849A (ja) | 2002-12-25 | 2004-07-22 | Seiko Epson Corp | 表示体および表示装置 |
| JP2007248484A (ja) | 2006-03-13 | 2007-09-27 | Sony Corp | 表示装置 |
| JP2010123450A (ja) | 2008-11-20 | 2010-06-03 | Sony Corp | 反射板、表示装置およびその製造方法 |
| JP2010244848A (ja) | 2009-04-06 | 2010-10-28 | Canon Inc | 発光装置 |
| CN107845668A (zh) | 2017-11-14 | 2018-03-27 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板及其制备方法和显示装置 |
| JP2019175619A (ja) | 2018-03-27 | 2019-10-10 | 株式会社ダイセル | 有機ｅｌ表示装置 |
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| Publication number | Publication date |
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| US11871608B2 (en) | 2024-01-09 |
| CN113261127B (zh) | 2023-12-26 |
| CN113261127A (zh) | 2021-08-13 |
| US20220085331A1 (en) | 2022-03-17 |
| KR102669515B1 (ko) | 2024-05-28 |
| TW202029514A (zh) | 2020-08-01 |
| KR20200081627A (ko) | 2020-07-08 |
| JP2022515811A (ja) | 2022-02-22 |
| TWI832949B (zh) | 2024-02-21 |
| WO2020138665A1 (ko) | 2020-07-02 |
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