JP7373436B2 - ダイボンディング装置および半導体装置の製造方法 - Google Patents

ダイボンディング装置および半導体装置の製造方法 Download PDF

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JP7373436B2
JP7373436B2 JP2020039656A JP2020039656A JP7373436B2 JP 7373436 B2 JP7373436 B2 JP 7373436B2 JP 2020039656 A JP2020039656 A JP 2020039656A JP 2020039656 A JP2020039656 A JP 2020039656A JP 7373436 B2 JP7373436 B2 JP 7373436B2
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substrate
imaging
die bonding
die
bonding apparatus
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Japanese (ja)
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JP2021141270A (ja
JP2021141270A5 (ko
Inventor
英晴 小橋
晴之 高野
宜久 中島
大輔 内藤
勇太 糸井
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ファスフォードテクノロジ株式会社
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Priority to JP2020039656A priority Critical patent/JP7373436B2/ja
Priority to TW110100795A priority patent/TWI798619B/zh
Priority to CN202110219292.8A priority patent/CN113380661B/zh
Priority to KR1020210028766A priority patent/KR102506283B1/ko
Publication of JP2021141270A publication Critical patent/JP2021141270A/ja
Publication of JP2021141270A5 publication Critical patent/JP2021141270A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2020039656A 2020-03-09 2020-03-09 ダイボンディング装置および半導体装置の製造方法 Active JP7373436B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020039656A JP7373436B2 (ja) 2020-03-09 2020-03-09 ダイボンディング装置および半導体装置の製造方法
TW110100795A TWI798619B (zh) 2020-03-09 2021-01-08 晶粒接合裝置及半導體裝置之製造方法
CN202110219292.8A CN113380661B (zh) 2020-03-09 2021-02-26 芯片贴装装置及半导体器件的制造方法
KR1020210028766A KR102506283B1 (ko) 2020-03-09 2021-03-04 다이 본딩 장치 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020039656A JP7373436B2 (ja) 2020-03-09 2020-03-09 ダイボンディング装置および半導体装置の製造方法

Publications (3)

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JP2021141270A JP2021141270A (ja) 2021-09-16
JP2021141270A5 JP2021141270A5 (ko) 2022-11-08
JP7373436B2 true JP7373436B2 (ja) 2023-11-02

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JP2020039656A Active JP7373436B2 (ja) 2020-03-09 2020-03-09 ダイボンディング装置および半導体装置の製造方法

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Country Link
JP (1) JP7373436B2 (ko)
KR (1) KR102506283B1 (ko)
CN (1) CN113380661B (ko)
TW (1) TWI798619B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115008007B (zh) * 2022-06-15 2023-09-22 东莞市德镌精密设备有限公司 一种针刺式pcb焊接排晶机

Citations (5)

* Cited by examiner, † Cited by third party
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JP2008170298A (ja) 2007-01-12 2008-07-24 Oki Electric Ind Co Ltd 外観検査装置及び外観検査方法
US20110175997A1 (en) 2008-01-23 2011-07-21 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
JP2013197277A (ja) 2012-03-19 2013-09-30 Hitachi High-Tech Instruments Co Ltd ダイボンダ
JP2015162519A (ja) 2014-02-26 2015-09-07 Juki株式会社 電子部品実装装置及び電子部品実装方法
JP2018166136A (ja) 2017-03-28 2018-10-25 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

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JPH08316259A (ja) * 1995-05-15 1996-11-29 Rohm Co Ltd 半導体製品のワイヤボンディング方法および装置
JP4596422B2 (ja) * 2005-05-20 2010-12-08 キヤノンマシナリー株式会社 ダイボンダ用撮像装置
JP4844431B2 (ja) * 2007-03-01 2011-12-28 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置における情報コードの読取り方法
MY169616A (en) * 2009-02-06 2019-04-23 Agency Science Tech & Res Methods for examining a bonding structure of a substrate and bonding structure inspection devices
DE112010003742T5 (de) * 2009-09-22 2013-06-06 Cyberoptics Corporation Hochschnelles, hochauflösendes, dreidimensionales Solarzellenprüfsystem
JP5421967B2 (ja) * 2011-09-07 2014-02-19 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP2013172011A (ja) * 2012-02-21 2013-09-02 Panasonic Corp 部品実装装置、撮像装置および撮像方法
JP2013187509A (ja) * 2012-03-09 2013-09-19 Seiko Epson Corp 実装部材の位置情報取得方法及び装置、電子デバイスの製造方法
JP6219838B2 (ja) * 2012-11-02 2017-10-25 富士機械製造株式会社 部品実装機
JP2014203917A (ja) * 2013-04-03 2014-10-27 株式会社ディスコ 板状物
JP2014216621A (ja) * 2013-04-30 2014-11-17 株式会社日立製作所 基板処理装置および基板処理方法
US11367703B2 (en) * 2017-10-26 2022-06-21 Shinkawa Ltd. Bonding apparatus
JP6976205B2 (ja) * 2018-03-19 2021-12-08 東レエンジニアリング株式会社 チップ位置測定装置
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7161870B2 (ja) * 2018-06-27 2022-10-27 ファスフォードテクノロジ株式会社 ダイボンダおよび半導体装置の製造方法
JP7102271B2 (ja) * 2018-07-17 2022-07-19 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7105135B2 (ja) * 2018-08-17 2022-07-22 東京エレクトロン株式会社 処理条件補正方法及び基板処理システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008170298A (ja) 2007-01-12 2008-07-24 Oki Electric Ind Co Ltd 外観検査装置及び外観検査方法
US20110175997A1 (en) 2008-01-23 2011-07-21 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
JP2013197277A (ja) 2012-03-19 2013-09-30 Hitachi High-Tech Instruments Co Ltd ダイボンダ
JP2015162519A (ja) 2014-02-26 2015-09-07 Juki株式会社 電子部品実装装置及び電子部品実装方法
JP2018166136A (ja) 2017-03-28 2018-10-25 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JP2021141270A (ja) 2021-09-16
KR102506283B1 (ko) 2023-03-07
TWI798619B (zh) 2023-04-11
KR20210113955A (ko) 2021-09-17
CN113380661B (zh) 2023-09-29
TW202135642A (zh) 2021-09-16
CN113380661A (zh) 2021-09-10

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