JP7354249B2 - 電磁鋼板、その製造方法、及び電磁鋼板積層体 - Google Patents
電磁鋼板、その製造方法、及び電磁鋼板積層体 Download PDFInfo
- Publication number
- JP7354249B2 JP7354249B2 JP2021531051A JP2021531051A JP7354249B2 JP 7354249 B2 JP7354249 B2 JP 7354249B2 JP 2021531051 A JP2021531051 A JP 2021531051A JP 2021531051 A JP2021531051 A JP 2021531051A JP 7354249 B2 JP7354249 B2 JP 7354249B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- resin
- steel sheet
- curing agent
- electrical steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000831 Steel Inorganic materials 0.000 title claims description 49
- 239000010959 steel Substances 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 137
- 229920005989 resin Polymers 0.000 claims description 105
- 239000011347 resin Substances 0.000 claims description 105
- 239000003795 chemical substances by application Substances 0.000 claims description 85
- 239000000853 adhesive Substances 0.000 claims description 69
- 230000001070 adhesive effect Effects 0.000 claims description 69
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 37
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 36
- 229920000768 polyamine Polymers 0.000 claims description 23
- 125000001931 aliphatic group Chemical group 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 10
- 229920000178 Acrylic resin Polymers 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 150000002148 esters Chemical class 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 150000007524 organic acids Chemical class 0.000 claims description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000005977 Ethylene Substances 0.000 claims description 6
- 229920000877 Melamine resin Polymers 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 230000007547 defect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 239000011247 coating layer Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910000565 Non-oriented electrical steel Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000007373 indentation Methods 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 239000008199 coating composition Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910001224 Grain-oriented electrical steel Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910001463 metal phosphate Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/011—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of iron alloys or steels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
- H01F1/18—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets with insulating coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/208—Magnetic, paramagnetic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/584—Scratch resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Soft Magnetic Materials (AREA)
- Manufacturing Of Steel Electrode Plates (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
また、溶接、クランピング、インターロッキングなど既存の締結方法を使用せず、電磁鋼板を接着(締結)することができる接着コーティング層についても知られている。
図1に、本発明の一実施形態による電磁鋼板の断面の模式図を示す。図1を参照して、本発明の一実施形態による電磁鋼板の構造を説明する。図1の電磁鋼板は単に本発明を例示するためのものであり、本発明がこれに限定されるのではない。したがって、電磁鋼板の構造を多様に変形することができる。
図1に示すように、本発明の一実施形態による電磁鋼板は、電磁鋼板10上面に位置する上面接着層20および電磁鋼板10下面に位置する下面接着層30を含む。
上面接着層20は、水酸基当量が1~10mgKOH/gである樹脂を含む。樹脂が水酸基を適正量含めば、電磁鋼板10を積層して積層体100を製造時、下面接着層30との接着力を向上させることができる。接着力を向上させて溶接、クランピング、インターロッキングなど既存の締結方法を使用せず、電磁鋼板を接着させることが可能であり、鋼板に変形を付加しなくて、磁性が向上する。
脂肪族ポリアミン硬化剤としては、ジエチレントリアミン、トリエチレンテトラミンなどがあり得る。変性脂肪族ポリアミン硬化剤としては、エポキシポリアミン、オキシエチレンポリアミンなどがあり得る。芳香族ポリアミン硬化剤としては、メタフェニレンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホンなどがあり得る。有機酸無水物系硬化剤としては、テトラヒドロ無水フタル酸、無水ピロメリット酸などがあり得る。
前述の樹脂および硬化剤以外に金属リン酸塩、金属クロム酸塩をさらに含むことができる。
下面接着層30は、水酸基当量が15~20mgKOH/gである樹脂を含む。樹脂が水酸基を適正量含めば、電磁鋼板10を積層して積層体100を製造時、上面接着層20との接着力を向上させることができる。同時に、下面接着層30に対する生産時、ラインのスクラッチ型欠陥を防止することができる。電磁鋼板生産時、ロールと下面が接触して移送される。この時、下面接着層30の水酸基当量が過度に低ければ、スクラッチ型欠陥が多数発生することがある。
前述の樹脂および硬化剤以外に金属リン酸塩、金属クロム酸塩をさらに含むことができる。
本発明の一実施形態による電磁鋼板の製造方法は、電磁鋼板上面に上面接着組成物を塗布して、上面接着層を形成する段階、および電磁鋼板下面に下面接着組成物を塗布して、下面接着層を形成する段階を含む。
電磁鋼板10上面に上面接着組成物を塗布して、上面接着層20を形成する。
上面接着組成物は、水酸基当量が1~10mgKOH/gである樹脂を含む。樹脂が水酸基を適正量含めば、電磁鋼板10を積層して積層体100を製造時、下面接着層30との接着力を向上させることができる。接着力を向上させて溶接、クランピング、インターロッキングなど既存の締結方法を使用せず、電磁鋼板を接着させることが可能であり、鋼板に変形を付加しなくて、磁性が向上する。
図2に、本発明の一実施形態による電磁鋼板積層体の断面の模式図を示す。図2を参照して、本発明の一実施形態による電磁鋼板積層体の構造を説明する。図2の電磁鋼板積層体は単に本発明を例示するためのものであり、本発明がここに限定されるのではない。したがって、電磁鋼板積層体の構造を多様に変形することができる。
図2に示すように、本発明の一実施形態による電磁鋼板積層体100は複数の電磁鋼板10が積層され、電磁鋼板10の間に上面接着層20および下面接着層30の順に介される。
電磁鋼板積層体100を製造する方法は、上面接着層20および下面接着層30が形成された複数の電磁鋼板10を積層し、熱融着する段階を含む。熱融着する段階を通じて上面接着層20および下面接着層30内の樹脂成分が熱融着し、熱融着層を形成するようになる。
熱融着する段階は昇温段階および融着段階を含み、昇温段階の昇温速度は10℃/分~1000℃/分であり得る。
以下、実施例を通じて本発明をより詳細に説明する。しかし、このような実施例は単に本発明を例示するためのものであり、本発明がここに限定されるのではない。
3.15重量%のシリコン(Si)を含有し、板厚さ0.35mm焼鈍処理された無方向性電磁鋼板(50×50mm)を供試片を準備した。この試片を下記表1に整理された固形分から構成された接着組成物をBar Coaterを用いて各準備された供試片に上部と下部に一定の厚さで塗布して板温基準150~250℃で20秒間硬化した後、空気中で徐々に冷却させて、約3.0μm厚さの接着コーティング層を形成した。
20:上面接着層
30:下面接着層
100:電磁鋼板積層体
Claims (11)
- 電磁鋼板上面に位置する上面接着層、および
電磁鋼板下面に位置する下面接着層を含み、
前記上面接着層は鉛筆硬度がF以下であり、
前記下面接着層は鉛筆硬度がH以上である、ことを特徴とする電磁鋼板。 - 前記上面接着層は、重量平均分子量が15,000~50,000である樹脂を含み、
前記下面接着層は、重量平均分子量が1,000~10,000である樹脂を含む、ことを特徴とする請求項1に記載の電磁鋼板。 - 前記上面接着層は硬化剤を3重量%以下さらに含み、
前記下面接着層は硬化剤を5~10重量%さらに含む、ことを特徴とする請求項1又は請求項2に記載の電磁鋼板。 - 前記上面接着層は、水酸基当量が1~10mgKOH/gである樹脂を含み、
前記下面接着層は、水酸基当量が15~20mgKOH/gである樹脂を含む、ことを特徴とする請求項1乃至請求項3のいずれか一項に記載の電磁鋼板。 - 前記上面接着層および前記下面接着層に含まれる樹脂はそれぞれ、エポキシ系樹脂、シロキサン系樹脂、アクリル系樹脂、フェノール系樹脂、スチレン系樹脂、ビニル系樹脂、エチレン系樹脂、エステル系樹脂、およびウレタン系樹脂のうちの1種以上を含む、ことを特徴とする請求項1乃至請求項4のいずれか一項に記載の電磁鋼板。
- 前記上面接着層および前記下面接着層に含まれる硬化剤はそれぞれ、メラミン系硬化剤、ウレタン系硬化剤、脂肪族ポリアミン硬化剤、変性脂肪族ポリアミン硬化剤、芳香族ポリアミン硬化剤、および有機酸無水物系硬化剤のうちの1種以上を含む、ことを特徴とする請求項3乃至請求項5のいずれか一項に記載の電磁鋼板。
- 電磁鋼板上面に上面接着組成物を塗布して、上面接着層を形成する段階、および
電磁鋼板下面に下面接着組成物を塗布して、下面接着層を形成する段階を含み、
前記上面接着組成物は、固形分100重量%に対して、硬化剤を3重量%以下、および水酸基当量が1~10mgKOH/gであり、重量平均分子量が15,000~50,000である樹脂を残部として含み、
前記下面接着組成物は、固形分100重量%に対して、硬化剤を5~10重量%、および水酸基当量が15~20mgKOH/gであり、重量平均分子量が1,000~10,000である樹脂を残部として含み、
製造された前記上面接着層は鉛筆硬度がF以下であり、
製造された前記下面接着層は鉛筆硬度がH以上である、ことを特徴とする電磁鋼板の製造方法。 - 複数の電磁鋼板が積層され、
前記電磁鋼板の間に上面接着層および下面接着層の順に介され、
前記上面接着層は鉛筆硬度がF以下であり、
前記下面接着層は鉛筆硬度がH以上である、ことを特徴とする電磁鋼板積層体。 - 前記上面接着層は、重量平均分子量が15,000~50,000である樹脂を含み、
前記下面接着層は、重量平均分子量が1,000~10,000である樹脂を含む、ことを特徴とする請求項8に記載の電磁鋼板積層体。 - 前記上面接着層は硬化剤を3重量%以下さらに含み、
前記下面接着層は硬化剤を5~10重量%さらに含む、ことを特徴とする請求項8又は請求項9に記載の電磁鋼板積層体。 - 前記上面接着層は、水酸基当量が1~10mgKOH/gである樹脂を含み、
前記下面接着層は、水酸基当量が15~20mgKOH/gである樹脂を含む、ことを特徴とする請求項8乃至請求項10のいずれか一項に記載の電磁鋼板積層体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0153083 | 2018-11-30 | ||
KR1020180153083A KR102156189B1 (ko) | 2018-11-30 | 2018-11-30 | 전기강판 및 그 제조 방법 |
PCT/KR2019/016387 WO2020111742A2 (ko) | 2018-11-30 | 2019-11-26 | 전기강판 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022513168A JP2022513168A (ja) | 2022-02-07 |
JP7354249B2 true JP7354249B2 (ja) | 2023-10-02 |
Family
ID=70852876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021531051A Active JP7354249B2 (ja) | 2018-11-30 | 2019-11-26 | 電磁鋼板、その製造方法、及び電磁鋼板積層体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220041893A1 (ja) |
EP (1) | EP3888906A4 (ja) |
JP (1) | JP7354249B2 (ja) |
KR (1) | KR102156189B1 (ja) |
CN (1) | CN113165332B (ja) |
WO (1) | WO2020111742A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102223865B1 (ko) | 2018-09-27 | 2021-03-04 | 주식회사 포스코 | 전기강판 적층체 |
BR112022014628A2 (pt) * | 2020-06-17 | 2023-01-17 | Nippon Steel Corp | Chapa de aço elétrico, núcleo laminado, e, método para fabricar núcleo laminado |
WO2023195464A1 (ja) * | 2022-04-06 | 2023-10-12 | 日本製鉄株式会社 | 積層コア |
WO2023195465A1 (ja) * | 2022-04-06 | 2023-10-12 | 日本製鉄株式会社 | 積層コア |
TW202420706A (zh) * | 2022-09-08 | 2024-05-16 | 日商日本製鐵股份有限公司 | 積層鐵芯及積層鐵芯的製造方法 |
CN116809357A (zh) * | 2023-06-02 | 2023-09-29 | 山西太钢不锈钢股份有限公司 | 电工钢自粘结复合涂层的生产方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000030923A (ja) | 1998-07-13 | 2000-01-28 | Nippon Steel Corp | 安定した接着強度をもつ積層接着鉄心用電磁鋼板 |
US20070087201A1 (en) | 2005-10-13 | 2007-04-19 | Michael Wimmer | Self-bonding coating composition |
JP2013203964A (ja) | 2012-03-29 | 2013-10-07 | Dic Corp | 水性複合樹脂組成物及びそれを用いたコーティング剤 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715015B2 (ja) * | 1989-06-30 | 1995-02-22 | 積水化学工業株式会社 | 熱硬化性被覆用シートと被覆物 |
JPH0715014B2 (ja) * | 1989-06-30 | 1995-02-22 | 積水化学工業株式会社 | 熱硬化性被覆用シートと被覆物 |
JP3486962B2 (ja) * | 1994-07-15 | 2004-01-13 | 住友金属工業株式会社 | 接着用塗装鋼板 |
JP3196564B2 (ja) * | 1995-04-25 | 2001-08-06 | 株式会社神戸製鋼所 | 感熱接着性樹脂塗装金属板およびその製法並びに該樹脂塗装金属板の接合方法 |
JP3221285B2 (ja) * | 1995-06-05 | 2001-10-22 | 株式会社神戸製鋼所 | 感熱接着性樹脂塗装金属板およびその製造方法 |
JP3732971B2 (ja) * | 1999-05-28 | 2006-01-11 | Jfeスチール株式会社 | 剪断強度及び剥離強度に優れた接着鉄芯用電磁鋼板の製造方法 |
JP4680728B2 (ja) * | 2005-09-14 | 2011-05-11 | 三井化学東セロ株式会社 | 粘着フィルム |
CN102482528B (zh) * | 2009-07-07 | 2014-06-25 | Ak钢铁产权公司 | 涂有聚合物的金属衬底及其制造方法 |
JP5516958B2 (ja) * | 2010-03-31 | 2014-06-11 | Dic株式会社 | ラジカル重合性硬化性組成物、粘着剤及びそれを用いて得られる積層体 |
JP2012124466A (ja) * | 2010-11-18 | 2012-06-28 | Nitto Denko Corp | 半導体装置用接着フィルム、及び、半導体装置 |
CN102746725B (zh) * | 2012-06-29 | 2015-09-23 | 宝山钢铁股份有限公司 | 硅钢水溶性环保极厚绝缘涂层及其制备方法 |
JP6372132B2 (ja) * | 2014-03-31 | 2018-08-15 | 東洋紡株式会社 | 高分子フィルム積層体、および、それを用いたフレキシブル電子デバイスの製造方法 |
JP6086098B2 (ja) * | 2014-06-23 | 2017-03-01 | Jfeスチール株式会社 | 積層電磁鋼板およびその製造方法 |
US20170117758A1 (en) * | 2014-07-29 | 2017-04-27 | Jfe Steel Corporation | Electrical steel sheet for stacking, stacked electrical steel sheet, method of manufacturing stacked electrical steel sheet, and iron core for automotive motor |
JP6632846B2 (ja) * | 2014-09-30 | 2020-01-22 | 日東電工株式会社 | 粘着シート |
KR102444224B1 (ko) * | 2015-12-23 | 2022-09-16 | 주식회사 포스코 | 무방향성 전기강판 접착 코팅 조성물, 무방향성 전기강판 제품, 및 이의 제조 방법 |
BR112022014628A2 (pt) * | 2020-06-17 | 2023-01-17 | Nippon Steel Corp | Chapa de aço elétrico, núcleo laminado, e, método para fabricar núcleo laminado |
-
2018
- 2018-11-30 KR KR1020180153083A patent/KR102156189B1/ko active IP Right Grant
-
2019
- 2019-11-26 CN CN201980079004.4A patent/CN113165332B/zh active Active
- 2019-11-26 EP EP19888551.9A patent/EP3888906A4/en active Pending
- 2019-11-26 JP JP2021531051A patent/JP7354249B2/ja active Active
- 2019-11-26 WO PCT/KR2019/016387 patent/WO2020111742A2/ko unknown
- 2019-11-26 US US17/297,737 patent/US20220041893A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000030923A (ja) | 1998-07-13 | 2000-01-28 | Nippon Steel Corp | 安定した接着強度をもつ積層接着鉄心用電磁鋼板 |
US20070087201A1 (en) | 2005-10-13 | 2007-04-19 | Michael Wimmer | Self-bonding coating composition |
JP2013203964A (ja) | 2012-03-29 | 2013-10-07 | Dic Corp | 水性複合樹脂組成物及びそれを用いたコーティング剤 |
Also Published As
Publication number | Publication date |
---|---|
US20220041893A1 (en) | 2022-02-10 |
KR102156189B1 (ko) | 2020-09-16 |
WO2020111742A2 (ko) | 2020-06-04 |
JP2022513168A (ja) | 2022-02-07 |
WO2020111742A3 (ko) | 2020-09-10 |
CN113165332B (zh) | 2023-08-15 |
CN113165332A (zh) | 2021-07-23 |
KR20200066509A (ko) | 2020-06-10 |
EP3888906A2 (en) | 2021-10-06 |
EP3888906A4 (en) | 2022-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7354249B2 (ja) | 電磁鋼板、その製造方法、及び電磁鋼板積層体 | |
JP2012521649A (ja) | 軟磁性材料による積層コア,及び軟磁性の積層コアを形成する接着力によりコア単層板を接合する方法 | |
EP3395923B1 (en) | Adhesive coating composition for non-oriented electrical steel sheet, non-oriented electrical steel sheet product, and manufacturing method therefor | |
WO2011102328A1 (ja) | 無方向性電磁鋼板及びその製造方法 | |
JP6344537B1 (ja) | 接着性絶縁被膜付き電磁鋼板の製造方法および積層電磁鋼板の製造方法 | |
US11613101B2 (en) | Magnetic material, laminated magnetic material, laminated packet, and laminated core using magnetic material, and magnetic material producing method | |
JP5093411B2 (ja) | 樹脂モールドされる積層鉄芯に使用される電磁鋼板及びその製造方法 | |
JP2022503911A (ja) | 電磁鋼板製品の製造方法 | |
JP2007056303A (ja) | 磁気特性に優れた無方向性電磁鋼板の製造方法 | |
KR101481127B1 (ko) | 절연피막 조성물, 이를 이용한 무방향성 전기강판의 절연피막 형성방법 및 무방향성 전기강판 | |
KR102223865B1 (ko) | 전기강판 적층체 | |
JP5750275B2 (ja) | 絶縁被膜付き電磁鋼板および積層鉄心 | |
JP7529005B2 (ja) | 積鉄心および積鉄心の製造方法 | |
TWI487795B (zh) | Non - directional electromagnetic steel sheet for compressor motor and its manufacturing method | |
JPS6163004A (ja) | 接着ラミネート方向性けい素鋼板 | |
US20240051264A1 (en) | Laminated iron core and manufacturing method thereof | |
KR101448599B1 (ko) | 절연피막 조성물, 이를 이용한 무방향성 전기강판의 절연피막 형성방법 및 무방향성 전기강판 | |
KR20240098314A (ko) | 전기강판 및 그 제조 방법 | |
JP2021002553A (ja) | 磁性材、積層磁性体および積層コア、並びに、磁性材の製造方法および積層磁性体の製造方法 | |
KR20230066067A (ko) | 방향성 전기 강판, 방향성 전기 강판의 제조 방법 및 방향성 전기 강판의 평가 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210607 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210607 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220719 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221019 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20221222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230529 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230822 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230920 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7354249 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |