JP7346069B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP7346069B2
JP7346069B2 JP2019084359A JP2019084359A JP7346069B2 JP 7346069 B2 JP7346069 B2 JP 7346069B2 JP 2019084359 A JP2019084359 A JP 2019084359A JP 2019084359 A JP2019084359 A JP 2019084359A JP 7346069 B2 JP7346069 B2 JP 7346069B2
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JP
Japan
Prior art keywords
wiring
flexible
ground
ground line
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019084359A
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English (en)
Japanese (ja)
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JP2020181903A (ja
JP2020181903A5 (enExample
Inventor
英明 百瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019084359A priority Critical patent/JP7346069B2/ja
Priority to US16/850,523 priority patent/US11147155B2/en
Priority to CN202010332659.2A priority patent/CN111866334B/zh
Publication of JP2020181903A publication Critical patent/JP2020181903A/ja
Publication of JP2020181903A5 publication Critical patent/JP2020181903A5/ja
Application granted granted Critical
Publication of JP7346069B2 publication Critical patent/JP7346069B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09345—Power and ground in the same plane; Power planes for two voltages in one plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2019084359A 2019-04-25 2019-04-25 電子機器 Active JP7346069B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019084359A JP7346069B2 (ja) 2019-04-25 2019-04-25 電子機器
US16/850,523 US11147155B2 (en) 2019-04-25 2020-04-16 Electronic apparatus equipped with flexible boards
CN202010332659.2A CN111866334B (zh) 2019-04-25 2020-04-24 配备有柔性板的电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019084359A JP7346069B2 (ja) 2019-04-25 2019-04-25 電子機器

Publications (3)

Publication Number Publication Date
JP2020181903A JP2020181903A (ja) 2020-11-05
JP2020181903A5 JP2020181903A5 (enExample) 2022-04-15
JP7346069B2 true JP7346069B2 (ja) 2023-09-19

Family

ID=72917580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019084359A Active JP7346069B2 (ja) 2019-04-25 2019-04-25 電子機器

Country Status (3)

Country Link
US (1) US11147155B2 (enExample)
JP (1) JP7346069B2 (enExample)
CN (1) CN111866334B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7375472B2 (ja) 2019-10-31 2023-11-08 ブラザー工業株式会社 画像形成装置
EP4329438A4 (en) * 2021-08-05 2025-01-15 Samsung Electronics Co., Ltd. FLEXIBLE CONNECTING ELEMENT AND ELECTRONIC DEVICE THEREFOR

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115437A (ja) 2013-12-11 2015-06-22 キヤノン株式会社 フレキシブル配線基板、及び電子機器
JP2016004875A (ja) 2014-06-16 2016-01-12 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
JP2018036300A (ja) 2016-08-29 2018-03-08 株式会社ジャパンディスプレイ 表示装置の製造方法、及び表示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2217591C (en) * 1997-10-07 2003-07-29 700674 Ontario Limited, Doing Business As Carroll Associates Wireless test fixture
JPH11248457A (ja) * 1998-02-27 1999-09-17 Alps Electric Co Ltd 振動型ジャイロスコープ
TW476229B (en) 1998-08-24 2002-02-11 Adv Flexible Circuits Co Ltd Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time
CN101222815A (zh) * 2006-12-15 2008-07-16 富葵精密组件(深圳)有限公司 软性印刷电路板
JP2010131972A (ja) * 2008-10-28 2010-06-17 Canon Inc フレキシブル配線基板およびこれを用いた液体吐出ヘッド
JP5574867B2 (ja) * 2010-07-28 2014-08-20 キヤノン株式会社 電子機器
JP2012038851A (ja) * 2010-08-05 2012-02-23 Panasonic Corp フレキシブルプリント配線基板
JP5269157B2 (ja) * 2011-07-22 2013-08-21 キヤノン株式会社 撮像装置
JP6218481B2 (ja) * 2012-09-27 2017-10-25 三菱電機株式会社 フレキシブル基板、基板接続構造及び光モジュール
TWI544844B (zh) * 2012-10-16 2016-08-01 A hardware and software circuit board with impedance control structure
JP2017028500A (ja) * 2015-07-22 2017-02-02 ホシデン株式会社 フレキシブル配線基板
KR102150553B1 (ko) * 2015-10-06 2020-09-01 삼성전기주식회사 회로 기판 및 도체 패턴 구조
CN209691516U (zh) * 2016-04-14 2019-11-26 株式会社村田制作所 无源元件阵列和印刷布线板
JP6812221B2 (ja) * 2016-12-06 2021-01-13 キヤノン株式会社 電子機器
US10288825B2 (en) * 2016-12-23 2019-05-14 Hisense Broadband Multimedia Technologies Co., Ltd. Optical module
CN107072032B (zh) * 2017-02-15 2019-12-13 大连藏龙光电子科技有限公司 一种柔性印制电路板构造
JP6982962B2 (ja) * 2017-02-16 2021-12-17 日本ルメンタム株式会社 光モジュール
JP2019106473A (ja) * 2017-12-13 2019-06-27 住友電気工業株式会社 フレキシブルプリント基板及び光モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115437A (ja) 2013-12-11 2015-06-22 キヤノン株式会社 フレキシブル配線基板、及び電子機器
JP2016004875A (ja) 2014-06-16 2016-01-12 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
JP2018036300A (ja) 2016-08-29 2018-03-08 株式会社ジャパンディスプレイ 表示装置の製造方法、及び表示装置

Also Published As

Publication number Publication date
US20200344871A1 (en) 2020-10-29
CN111866334A (zh) 2020-10-30
JP2020181903A (ja) 2020-11-05
CN111866334B (zh) 2022-02-11
US11147155B2 (en) 2021-10-12

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