JP2020181903A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2020181903A JP2020181903A JP2019084359A JP2019084359A JP2020181903A JP 2020181903 A JP2020181903 A JP 2020181903A JP 2019084359 A JP2019084359 A JP 2019084359A JP 2019084359 A JP2019084359 A JP 2019084359A JP 2020181903 A JP2020181903 A JP 2020181903A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- ground
- flexible substrate
- region
- flex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000007787 solid Substances 0.000 claims description 12
- 238000009434 installation Methods 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 31
- 238000005452 bending Methods 0.000 description 28
- 230000005540 biological transmission Effects 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000005611 electricity Effects 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- -1 smartphones Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
- H05K2201/0792—Means against parasitic impedance; Means against eddy currents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09345—Power and ground in the same plane; Power planes for two voltages in one plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
113 メインシャーシ
113b 屈曲部
113c 平面部
115 操作フレキ
120 中継フレキ
115c 差動信号線群
115d、120d、120g グラウンド線
115d1、115d2、120d1、120d2 グラウンド配線領域
121 両面テープ
120TH2〜120TH5 スルーホール
Claims (9)
- 屈曲部及び平面部を備える構造体と、前記構造体に沿って配置される第1のフレキシブル基板及び第2のフレキシブル基板を備える電子機器であって、
前記第1のフレキシブル基板の一の面には、差動信号線が配線され、前記第1のフレキシブル基板の他の面には、前記差動信号線のインピーダンスコントロールを行うための第1のグラウンド線が前記差動信号線の裏側の位置に配線され、
前記第2のフレキシブル基板の一の面には、前記差動信号線のインピーダンスコントロールを行うための第2のグラウンド線が配線され、
前記第1のフレキシブル基板は、前記構造体及び前記第2のフレキシブル基板の間に配置され、
前記第1のフレキシブル基板の一の面は、前記第2のフレキシブル基板の一の面と向かい合うように配置され、
前記第1のグラウンド線及び前記第2のグラウンド線は、前記構造体の屈曲部に沿う領域と前記構造体の平面部に沿う領域とで配線密度が異なることを特徴とする電子機器。 - 前記第1のグラウンド線及び前記第2のグラウンド線は、前記構造体の屈曲部に沿う領域において複数の開口部を有することを特徴とする請求項1記載の電子機器。
- 前記第1のグラウンド線の配線密度及び前記第2のグラウンド線の配線密度は、前記開口部の形状又は大きさを変えることによって調整されることを特徴とする請求項2記載の電子機器。
- 前記第2のグラウンド線において、前記構造体の屈曲部に沿う領域の配線密度が前記構造体の平面部に沿う領域の配線密度より低いことを特徴とする請求項1乃至3のいずれか1項に記載の電子機器。
- 前記第2のグラウンド線における前記構造体の平面部に沿う領域は、ベタ配線であることを特徴とする請求項4記載の電子機器。
- 前記第1のグラウンド線において、前記構造体の平面部に沿う領域の配線密度が前記構造体の屈曲部に沿う領域の配線密度より低いことを特徴とする請求項4又は5記載の電子機器。
- 前記第1のフレキシブル基板は、前記第2のフレキシブル基板と所定の厚さの固定部材で接着されることを特徴とする請求項1乃至6のいずれか1項に記載の電子機器。
- 前記第2のフレキシブル基板の他の面に第3のグラウンド線が配線され、
前記第2のフレキシブル基板において前記第2のグラウンド線及び前記第3のグラウンド線は、スルーホールによって電気的に導通され、
前記第2のフレキシブル基板において前記構造体の平面部に沿う領域より多くの前記スルーホールが前記構造体の屈曲部に沿う領域に配置されることを特徴とする請求項1乃至7のいずれか1項に記載の電子機器。 - 前記第2のフレキシブル基板の前記構造体の屈曲部に沿う領域において、少なくとも2つの前記スルーホールが隣接して配置されることを特徴とする請求項8記載の電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019084359A JP7346069B2 (ja) | 2019-04-25 | 2019-04-25 | 電子機器 |
US16/850,523 US11147155B2 (en) | 2019-04-25 | 2020-04-16 | Electronic apparatus equipped with flexible boards |
CN202010332659.2A CN111866334B (zh) | 2019-04-25 | 2020-04-24 | 配备有柔性板的电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019084359A JP7346069B2 (ja) | 2019-04-25 | 2019-04-25 | 電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020181903A true JP2020181903A (ja) | 2020-11-05 |
JP2020181903A5 JP2020181903A5 (ja) | 2022-04-15 |
JP7346069B2 JP7346069B2 (ja) | 2023-09-19 |
Family
ID=72917580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019084359A Active JP7346069B2 (ja) | 2019-04-25 | 2019-04-25 | 電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11147155B2 (ja) |
JP (1) | JP7346069B2 (ja) |
CN (1) | CN111866334B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7375472B2 (ja) * | 2019-10-31 | 2023-11-08 | ブラザー工業株式会社 | 画像形成装置 |
EP4329438A1 (en) * | 2021-08-05 | 2024-02-28 | Samsung Electronics Co., Ltd. | Flexible connection member and electronic device comprising same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015115437A (ja) * | 2013-12-11 | 2015-06-22 | キヤノン株式会社 | フレキシブル配線基板、及び電子機器 |
JP2016004875A (ja) * | 2014-06-16 | 2016-01-12 | 日本メクトロン株式会社 | フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 |
JP2018036300A (ja) * | 2016-08-29 | 2018-03-08 | 株式会社ジャパンディスプレイ | 表示装置の製造方法、及び表示装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2217591C (en) * | 1997-10-07 | 2003-07-29 | 700674 Ontario Limited, Doing Business As Carroll Associates | Wireless test fixture |
JPH11248457A (ja) * | 1998-02-27 | 1999-09-17 | Alps Electric Co Ltd | 振動型ジャイロスコープ |
TW476229B (en) | 1998-08-24 | 2002-02-11 | Adv Flexible Circuits Co Ltd | Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time |
CN101222815A (zh) * | 2006-12-15 | 2008-07-16 | 富葵精密组件(深圳)有限公司 | 软性印刷电路板 |
JP2010131972A (ja) * | 2008-10-28 | 2010-06-17 | Canon Inc | フレキシブル配線基板およびこれを用いた液体吐出ヘッド |
JP5574867B2 (ja) * | 2010-07-28 | 2014-08-20 | キヤノン株式会社 | 電子機器 |
JP2012038851A (ja) * | 2010-08-05 | 2012-02-23 | Panasonic Corp | フレキシブルプリント配線基板 |
JP5269157B2 (ja) * | 2011-07-22 | 2013-08-21 | キヤノン株式会社 | 撮像装置 |
JP6218481B2 (ja) * | 2012-09-27 | 2017-10-25 | 三菱電機株式会社 | フレキシブル基板、基板接続構造及び光モジュール |
TWI544844B (zh) * | 2012-10-16 | 2016-08-01 | A hardware and software circuit board with impedance control structure | |
JP2017028500A (ja) * | 2015-07-22 | 2017-02-02 | ホシデン株式会社 | フレキシブル配線基板 |
KR102150553B1 (ko) * | 2015-10-06 | 2020-09-01 | 삼성전기주식회사 | 회로 기판 및 도체 패턴 구조 |
CN208861757U (zh) * | 2016-04-14 | 2019-05-14 | 株式会社村田制作所 | 无源元件阵列以及印刷布线板 |
JP6812221B2 (ja) * | 2016-12-06 | 2021-01-13 | キヤノン株式会社 | 電子機器 |
US10288825B2 (en) * | 2016-12-23 | 2019-05-14 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
CN107072032B (zh) * | 2017-02-15 | 2019-12-13 | 大连藏龙光电子科技有限公司 | 一种柔性印制电路板构造 |
JP6982962B2 (ja) * | 2017-02-16 | 2021-12-17 | 日本ルメンタム株式会社 | 光モジュール |
JP2019106473A (ja) * | 2017-12-13 | 2019-06-27 | 住友電気工業株式会社 | フレキシブルプリント基板及び光モジュール |
-
2019
- 2019-04-25 JP JP2019084359A patent/JP7346069B2/ja active Active
-
2020
- 2020-04-16 US US16/850,523 patent/US11147155B2/en active Active
- 2020-04-24 CN CN202010332659.2A patent/CN111866334B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015115437A (ja) * | 2013-12-11 | 2015-06-22 | キヤノン株式会社 | フレキシブル配線基板、及び電子機器 |
JP2016004875A (ja) * | 2014-06-16 | 2016-01-12 | 日本メクトロン株式会社 | フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 |
JP2018036300A (ja) * | 2016-08-29 | 2018-03-08 | 株式会社ジャパンディスプレイ | 表示装置の製造方法、及び表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7346069B2 (ja) | 2023-09-19 |
CN111866334A (zh) | 2020-10-30 |
US11147155B2 (en) | 2021-10-12 |
US20200344871A1 (en) | 2020-10-29 |
CN111866334B (zh) | 2022-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3338322B1 (en) | Electronic device | |
US20140111953A1 (en) | Electronic Devices With Components Mounted to Touch Sensor Substrates | |
US8476532B2 (en) | Multilayer flexible printed circuit board and electronic device | |
US7384272B2 (en) | Flexible printed circuit board assembly, method for manufacturing the same, and portable terminal comprising the same | |
WO2020259614A1 (zh) | 电子设备 | |
CN109151122B (zh) | 显示屏组件、电子设备及显示屏组件的组装方法 | |
JP7346069B2 (ja) | 電子機器 | |
JP2006042102A (ja) | 折畳式携帯無線機 | |
CN115191154A (zh) | 包括插入器的电子装置 | |
JP4477082B2 (ja) | 電子機器 | |
JP5269157B2 (ja) | 撮像装置 | |
CN111193979A (zh) | 无线耳机 | |
US20080220626A1 (en) | Electronic product connection means | |
CN108539369A (zh) | 天线组件、天线组件的制作方法及电子设备 | |
JP6112263B2 (ja) | 電子機器 | |
JP2015115437A (ja) | フレキシブル配線基板、及び電子機器 | |
KR20150041725A (ko) | 디스플레이 모듈 및 그를 포함하는 전자 기기 | |
JP2007221468A (ja) | 電子機器 | |
JP2012146900A (ja) | フレキシブル基板 | |
JP6861742B2 (ja) | アンテナ装置及び電子機器 | |
JP6297203B2 (ja) | 防水空間内にアンテナが備えられた電子機器 | |
JP7538936B1 (ja) | 電子機器 | |
JP2008300513A (ja) | 電子機器 | |
JP2018093111A (ja) | 電子機器 | |
JP2007012749A (ja) | 電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220407 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220407 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230302 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230328 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230425 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230808 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230906 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 7346069 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |