JP7344880B2 - 照明モジュールおよびこれを備えた照明装置 - Google Patents
照明モジュールおよびこれを備えた照明装置 Download PDFInfo
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- JP7344880B2 JP7344880B2 JP2020537496A JP2020537496A JP7344880B2 JP 7344880 B2 JP7344880 B2 JP 7344880B2 JP 2020537496 A JP2020537496 A JP 2020537496A JP 2020537496 A JP2020537496 A JP 2020537496A JP 7344880 B2 JP7344880 B2 JP 7344880B2
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Classifications
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- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
Description
図1は発明の実施例に係る照明装置を示した平面図であり、図2は図1の照明装置のA-A側断面図であり、図3は図2の照明装置の部分拡大図であり、図4は図2の照明装置の上に拡散層を配置した例である。
図1~図4のように、前記基板401は、印刷回路基板(PCB:Printed Circuit Board)を含み、例えば、樹脂系の印刷回路基板(PCB)、メタルコア(Metal Core)PCB、フレキシブル(Flexible)PCB、リジッドPCB、セラミックPCBまたはFR-4基板を含むことができる。前記基板401は、回路パターンを有する層を1つまたは2つ以上有することができ、一面に回路パターンを有するPCBまたは両面に回路パターンを有するPCBを含むことができる。前記基板401は、前記光源400が配置された領域およびその周辺領域に回路パターンが配置される。
前記基板401は、絶縁層410、前記絶縁層410の上に金属層420、前記金属層420の上に保護層430を含むことができる。前記絶縁層410は、エポキシ樹脂、ガラス繊維、難燃剤、プリプレグ物質(Preimpregnated Materials)、フェノール樹脂、不飽和ポリエステル樹脂のうち少なくとも1つまたは2つ以上を含むことができる。前記基板401は、放熱のために前記絶縁層410の下部に金属材質の支持層がさらに配置される。前記金属層420は、絶縁層410の上に配置され、Cu、Au、Al、Agのうち少なくとも1つを含み、単層または多層で提供される。前記金属層420は、例えばCuまたはAu/Cuを含むことができる。前記金属層420は、第1金属層421と第2金属層423を含むことができる。前記金属層420は、前記第1金属層421と前記第2金属層423は相互電気的にオープンされる。前記第1金属層421と前記第2金属層423は、物理的に分離することができる。前記第1金属層421は、前記光源100と隣接または前記光源100の下部領域に配置される。前記第1金属層421は、回路パターンを有する配線層として機能し、前記光源100と電気的に連結される。前記第1金属層421は、前記複数の光源を直列、並列または直-並列に連結することができる。前記第2金属層423は、図1で反射領域の下に配置される。前記第2金属層423は、前記第1金属層421と同じ金属を含むことができる。前記第2金属層423の上面面積は、前記基板401の上面面積の50%以上または70%以上有することができる。前記第2金属層423は、前記光源100と電気的にオープンされる。前記第2金属層423は、前記反射領域A1の下に単一プレートとして提供される。前記第2金属層423のトップビュー形状が多角形形状を有することができる。前記第2金属層423の上面は、前記第1金属層421の上面と同じ平面上に配置される。前記第2金属層423の下面は、前記第1金属層421の下面と同じ平面上に配置される。前記金属層420の厚さは、35μm以上、例えば35~70μmまたは35~100μmの範囲を有することができる。前記金属層420の厚さは、電気伝導率および熱伝導率のために35μm以上に形成され、モジュールの厚さやフレキシブル特性を考慮して100μm以下に提供される。
図1および図3を参照すると、前記光源100は、前記基板401の上に配置され、前記樹脂層450によって密封される。前記光源100は、前記基板401の上に配置され、前記樹脂層450の内部に埋め込まれる。前記光源100は、前記樹脂層450の側面のうちの少なくとも第1側面S1に隣接するように配置され、前記第1側面S1の反対側方向に光を放出することになる。前記光源100は、第1側面S1から離隔するので、湿気流入経路を長く提供することができる。図1のように、前記光源100は、前記反射領域A1から離隔することができる。
前記突起P1は、前記金属層420の開口部Raの上に配置される。前記突起P1は、金属性突起を含むことができる。前記突起P1は、Ag、Au、Pt、Sn、Cu、Zn、In、Bi、Tiなどを含む群から選択された1つの物質または2つ以上の合金を含むことができる。前記突起P1は、前記第2金属層423とボンディングまたは結合される。前記突起P1は、金属、合金または金属性材質であってもよい。前記突起P1は、ソルダペーストを含むことができる。前記ソルダペーストは、パウダー粒子またはパーティクル粒子とフラックスの混合により形成されてもよい。前記ソルダペーストは、Ag-Sn系、Cu-Sn系、Au-Sn系またはSn-Ag-Cu系のうち少なくとも1つを含むことができる。前記ソルダペーストの材質において、各金属の重量%は相互異なってもよい。前記突起P1がソルダペースト材質である場合、基板401の上で前記開口部Raを通じて第2金属層423の上に形成する際に、印刷性と濡れ性が良く、ボイド(void)の発生を減らすことができる。前記突起P1の材質は、前記金属層420の材質と異なってもよい。前記突起P1は、前記保護層430の開口部Raの上に液状の材料で形成されて硬化し、前記突起の表面は、硬化する際に表面張力がよって曲面形状に形成される。
前記樹脂層450は、前記基板401の上に配置される。前記樹脂層450は、前記基板401の上面全体または一部領域上に配置される。前記樹脂層450の下面面積は、前記基板401の上面面積と同一または小さくてもよい。前記樹脂層450の各側面は、前記基板401の各側面と同じ平面上に配置される。前記樹脂層450は、前記突起P1と前記基板401の保護層430に接触することができる。前記樹脂層450は、前記光源100の表面に接触し、前記出射面101に接触することができる。前記樹脂層450の上面は、平坦な面または凹凸形状を有する粗い面であってもよい。前記樹脂層450の一部は、前記突起P1の間にそれぞれ配置される。前記樹脂層450は、前記突起P1の間の反射部R1に接触することができる。前記樹脂層450は、前記突起P1の盛り上がっている曲面と反射部R1の平坦な上面に接触することができる。
Claims (11)
- 絶縁層と、前記絶縁層の上に配置された第1金属層と、前記絶縁層の上に配置され、前記第1金属層から分離された第2金属層とを含む基板と、
前記基板の上に第1方向に配列された複数の光源と、
前記第2金属層の上に前記第1方向に長い長さを有し、第2方向に配列される複数の突起と、
前記複数の光源および前記複数の突起の上に配置された樹脂層と、
前記第1、2金属層と前記樹脂層の間に配置された絶縁材質の保護層と、
を含み、
前記樹脂層は、前記複数の光源および前記複数の突起を密封し、
前記第1金属層は、前記光源と電気的に連結され、
前記第2金属層は、前記複数の突起と結合され、
前記第2金属層の材質は、前記複数の突起の材質と異なり、
前記保護層は、前記複数の突起のそれぞれが突出する複数の開口部を含み、
前記複数の突起は、前記第1方向と直交する前記第2方向に相互離隔し、
前記複数の光源は、前記第2方向に向かって光を放出する、照明装置。 - 前記基板は、前記保護層を含み、
前記保護層は、白色材質であり、前記複数の突起の間に配置された反射部を含み、
前記反射部と前記複数の突起は、互いに異なる高さを有する、請求項1に記載の照明装置。 - 前記第2金属層の上に配置された前記複数の突起のそれぞれの最上面は、前記第2金属層の上に配置された前記反射部の上面より高く配置される、請求項2に記載の照明装置。
- 前記樹脂層は、第1側面と、前記第1側面と対向する第2側面を含み、
前記第1側面と前記第2側面のうち少なくとも一つは、前記基板の外側面の上に露出し 、
前記複数の光源は、前記第1側面に隣接するように配置され、前記第2側面に向かって光を出射するように出射面を有する、請求項1から3のいずれか一項に記載の照明装置。 - 前記複数の突起は、上面が盛り上がっている曲面を含み、
前記複数の突起は、前記基板の第1方向の長さの70%以上の長さを有する、請求項1から4のいずれか一項に記載の照明装置。 - 前記第2金属層は、複数が前記第2方向に分離され、
前記複数の突起のそれぞれは、分離された第2金属層のそれぞれに配置される、請求項2から5のいずれか一項に記載の照明装置。 - 前記保護層の反射部は、前記複数に分離された第2金属層の間にそれぞれ配置される、請求項6に記載の照明装置。
- 前記複数の突起のうちの少なくとも一部は、前記第1方向に相互離隔して配置される、請求項1から7のいずれか一項に記載の照明装置。
- 前記複数の突起は、Ag-Sn系、Cu-Sn系、Au-Sn系またはSn-Ag-Cu系のうちの少なくとも一つを含む、請求項1から8のいずれか一項に記載の照明装置。
- 前記複数の突起は、前記光源と前記樹脂層の一側面の間に配置される、請求項1から9のいずれか一項に記載の照明装置。
- 基板と、
前記基板の上に第1方向に配列された複数の光源と、
前記基板の上に前記第1方向と直交する第2方向に配列された複数の突起と、
前記基板の上部に配置され、前記複数の光源および前記複数の突起を覆う樹脂層と、
を含み、
前記基板は、絶縁層と、前記絶縁層の上に金属層とを含み、
前記金属層は、前記絶縁層と前記複数の光源の間に設けられる第1金属層と、前記絶縁層と前記複数の突起の間に設けられる第2金属層とを含み、
前記第1、2金属層は、前記絶縁層と前記樹脂層の間に配置され、
前記第1金属層と前記第2金属層は物理的に分離され、
前記第1金属層は、前記複数の光源と電気的に連結され、
前記第1金属層と前記第2金属層は同じ金属を含み、
前記複数の光源の下部に配置された前記第1金属層の上面は、前記第2金属層の上面と同じ平面に配置され、
前記複数の突起のそれぞれの第1方向の長さは、前記第2方向の幅より大きく、
前記複数の突起と前記金属層の材質は相互に異なり、
前記複数の光源は、前記第2方向に向かって光を放出する照明装置。
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113900301A (zh) | 2021-09-24 | 2022-01-07 | 佛山市国星光电股份有限公司 | 一种光源模组及背光显示模组 |
KR102627010B1 (ko) * | 2022-04-01 | 2024-01-23 | 주식회사 금호에이치티 | 슬림 면광원 및 슬림 면광원 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241282A (ja) | 2003-02-06 | 2004-08-26 | Nichia Chem Ind Ltd | 面発光装置および面発光装置の製造方法 |
US20130128610A1 (en) | 2011-11-23 | 2013-05-23 | Industrial Technology Research Institute | Plane light source and flexible plane light source |
JP2014032919A (ja) | 2012-08-06 | 2014-02-20 | Panasonic Corp | 照明器具 |
JP2016181394A (ja) | 2015-03-24 | 2016-10-13 | 大日本印刷株式会社 | 面光源装置 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08129174A (ja) | 1994-10-31 | 1996-05-21 | Kyocera Corp | 液晶表示装置用照明装置 |
US5980054A (en) * | 1996-05-09 | 1999-11-09 | Matsushita Electric Industrial Co., Ltd. | Panel-form illuminating system |
JPH10282343A (ja) | 1996-11-25 | 1998-10-23 | Konica Corp | 導光板及び面光源装置 |
JP2000315414A (ja) | 1999-04-30 | 2000-11-14 | Matsushita Electric Ind Co Ltd | 表示装置のバックライト装置 |
KR100601461B1 (ko) | 2003-12-03 | 2006-07-14 | 삼성전기주식회사 | 인쇄회로기판의 솔더 레지스트 패턴 형성 방법 |
JP3976757B2 (ja) | 2004-08-16 | 2007-09-19 | Necディスプレイソリューションズ株式会社 | 照明装置及び投射型表示装置 |
US20060246233A1 (en) * | 2005-04-28 | 2006-11-02 | Fuji Photo Film Co., Ltd. | Light diffusion film, anti-reflection film, polarizing plate and image display device |
US7478930B2 (en) | 2006-01-12 | 2009-01-20 | Samsung Corning Precision Glass Co., Ltd. | Backlight unit with an oxide compound-laminated optical layer |
CN100543539C (zh) | 2006-06-02 | 2009-09-23 | 群康科技(深圳)有限公司 | 半穿半反式液晶显示器制造方法 |
JP2008052940A (ja) * | 2006-08-22 | 2008-03-06 | Citizen Electronics Co Ltd | 導光板及びその製造方法とその導光板を用いたバックライトユニット |
EP2067065B1 (en) * | 2006-09-19 | 2017-05-31 | Philips Lighting Holding B.V. | Illumination system, luminaire and display device |
GB2443849A (en) | 2006-11-20 | 2008-05-21 | Sharp Kk | Backlight and display |
CN101191860A (zh) * | 2006-11-30 | 2008-06-04 | 林清彬 | 二合一导光板 |
KR100948397B1 (ko) | 2007-07-31 | 2010-03-19 | 주식회사 옵토필 | 발광다이오드를 이용한 면발광 조명장치 |
JP2009229877A (ja) | 2008-03-24 | 2009-10-08 | Sumitomo Chemical Co Ltd | 集光層付き光拡散板 |
JP5225744B2 (ja) * | 2008-05-08 | 2013-07-03 | 林テレンプ株式会社 | 自動車用照明装置並びに導光体及びその製造方法 |
JP5210061B2 (ja) * | 2008-07-10 | 2013-06-12 | 株式会社小糸製作所 | 灯具 |
TWI391752B (zh) * | 2009-03-24 | 2013-04-01 | Au Optronics Corp | 具熱隔離層之背光模組及顯示裝置 |
KR101693657B1 (ko) | 2010-04-16 | 2017-01-06 | 엘지전자 주식회사 | 백라이트 유닛 및 디스플레이 장치 |
EP2470952B1 (en) * | 2009-08-27 | 2016-02-10 | LG Electronics Inc. | Backlight unit and display device |
KR101091304B1 (ko) | 2010-01-20 | 2011-12-07 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 그 제조방법 |
TWI738824B (zh) | 2010-03-26 | 2021-09-11 | 友輝光電股份有限公司 | 一種形成光學膜的方法 |
KR101130450B1 (ko) | 2010-05-06 | 2012-03-27 | 주식회사 디에스 | 조명 시스템 |
CN102374493A (zh) | 2010-08-16 | 2012-03-14 | 深圳帝光电子有限公司 | 一种导光板、背光源及照明装置 |
KR20120026369A (ko) | 2010-09-09 | 2012-03-19 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
JP5449274B2 (ja) | 2011-03-25 | 2014-03-19 | シャープ株式会社 | 照明装置、および表示装置 |
JP5747712B2 (ja) | 2011-07-25 | 2015-07-15 | セイコーエプソン株式会社 | 照明装置、液晶表示装置および電子機器 |
KR101943447B1 (ko) | 2012-02-23 | 2019-01-29 | 엘지이노텍 주식회사 | 조명 유닛 및 그를 이용한 디스플레이 장치 |
CN102679243B (zh) | 2012-05-15 | 2014-10-08 | 深圳市华星光电技术有限公司 | 背光模块及显示装置 |
CN104181697A (zh) | 2013-05-28 | 2014-12-03 | 群创光电股份有限公司 | 显示装置及其发光模块 |
US9952042B2 (en) * | 2013-07-12 | 2018-04-24 | Magic Leap, Inc. | Method and system for identifying a user location |
KR102224459B1 (ko) | 2014-02-05 | 2021-03-08 | 엘지이노텍 주식회사 | 입체조명장치 및 이를 이용하는 차량조명장치 |
US10069050B2 (en) | 2015-09-25 | 2018-09-04 | Lg Innotek Co., Ltd. | Light emitting device, light emitting device package including the device, and lighting apparatus including the package |
KR101811005B1 (ko) | 2015-09-25 | 2017-12-20 | 엘지이노텍 주식회사 | 발광소자, 이를 포함하는 발광소자 패키지 및 패키지를 포함하는 조명 장치 |
JP6468600B2 (ja) | 2015-11-30 | 2019-02-13 | 大口マテリアル株式会社 | Ledパッケージ及び多列型led用リードフレーム、並びにそれらの製造方法 |
FR3051541B1 (fr) | 2016-05-18 | 2020-04-17 | Valeo Vision | Projecteur a led a dioptre creant coupure pour vehicules |
CN106154398A (zh) * | 2016-07-27 | 2016-11-23 | 京东方科技集团股份有限公司 | 一种侧入式背光模组及显示装置 |
JP6868388B2 (ja) * | 2016-12-26 | 2021-05-12 | 日亜化学工業株式会社 | 発光装置および集積型発光装置 |
-
2018
- 2018-01-12 KR KR1020180004658A patent/KR20190086300A/ko not_active IP Right Cessation
-
2019
- 2019-01-08 CN CN201980008292.4A patent/CN111602001B/zh active Active
- 2019-01-08 US US16/960,128 patent/US11519568B2/en active Active
- 2019-01-08 WO PCT/KR2019/000294 patent/WO2019139336A1/ko unknown
- 2019-01-08 EP EP19739133.7A patent/EP3739258B1/en active Active
- 2019-01-08 JP JP2020537496A patent/JP7344880B2/ja active Active
-
2022
- 2022-11-07 US US17/981,772 patent/US11796139B2/en active Active
-
2023
- 2023-12-18 KR KR1020230184715A patent/KR102660451B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241282A (ja) | 2003-02-06 | 2004-08-26 | Nichia Chem Ind Ltd | 面発光装置および面発光装置の製造方法 |
US20130128610A1 (en) | 2011-11-23 | 2013-05-23 | Industrial Technology Research Institute | Plane light source and flexible plane light source |
JP2014032919A (ja) | 2012-08-06 | 2014-02-20 | Panasonic Corp | 照明器具 |
JP2016181394A (ja) | 2015-03-24 | 2016-10-13 | 大日本印刷株式会社 | 面光源装置 |
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KR102660451B1 (ko) | 2024-04-25 |
WO2019139336A1 (ko) | 2019-07-18 |
US20230053397A1 (en) | 2023-02-23 |
US11519568B2 (en) | 2022-12-06 |
JP2021510446A (ja) | 2021-04-22 |
CN111602001A (zh) | 2020-08-28 |
KR20240004135A (ko) | 2024-01-11 |
KR20190086300A (ko) | 2019-07-22 |
EP3739258B1 (en) | 2023-10-11 |
US20210071823A1 (en) | 2021-03-11 |
EP3739258A4 (en) | 2021-03-17 |
CN111602001B (zh) | 2022-08-05 |
US11796139B2 (en) | 2023-10-24 |
EP3739258A1 (en) | 2020-11-18 |
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