JP7336947B2 - 切断用ブレード及びこれを用いた切断装置 - Google Patents

切断用ブレード及びこれを用いた切断装置 Download PDF

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Publication number
JP7336947B2
JP7336947B2 JP2019181352A JP2019181352A JP7336947B2 JP 7336947 B2 JP7336947 B2 JP 7336947B2 JP 2019181352 A JP2019181352 A JP 2019181352A JP 2019181352 A JP2019181352 A JP 2019181352A JP 7336947 B2 JP7336947 B2 JP 7336947B2
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JP
Japan
Prior art keywords
blade
cutting
support
extension
support extension
Prior art date
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JP2019181352A
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English (en)
Japanese (ja)
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JP2020113744A (ja
Inventor
ジン キム，モッ
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Individual
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Individual
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Publication of JP2020113744A publication Critical patent/JP2020113744A/ja
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Publication of JP7336947B2 publication Critical patent/JP7336947B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/002—Materials or surface treatments therefor, e.g. composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Nonmetal Cutting Devices (AREA)
JP2019181352A 2019-01-16 2019-10-01 切断用ブレード及びこれを用いた切断装置 Active JP7336947B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0005497 2019-01-16
KR1020190005497A KR101990013B1 (ko) 2019-01-16 2019-01-16 절단용 블레이드 및 이를 이용한 절단장치

Publications (2)

Publication Number Publication Date
JP2020113744A JP2020113744A (ja) 2020-07-27
JP7336947B2 true JP7336947B2 (ja) 2023-09-01

Family

ID=67064531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019181352A Active JP7336947B2 (ja) 2019-01-16 2019-10-01 切断用ブレード及びこれを用いた切断装置

Country Status (4)

Country Link
JP (1) JP7336947B2 (zh)
KR (1) KR101990013B1 (zh)
CN (1) CN111438829B (zh)
TW (1) TWI687948B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240036346A (ko) 2022-09-13 2024-03-20 주식회사 디큐브 블레이드 홀더

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001009542A (ja) 1999-06-30 2001-01-16 Silver Roi:Kk 工 具
JP2012253346A (ja) 2011-05-31 2012-12-20 Samsung Electro-Mechanics Co Ltd 積層型セラミック電子部品及びその製造方法
JP2014162206A (ja) 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール、ホルダーユニット、スクライブ装置及びスクライビングホイールの製造方法
JP2018103356A (ja) 2016-12-27 2018-07-05 株式会社新日本テック ブレード加工装置及びブレード加工方法
JP2018203559A (ja) 2017-06-01 2018-12-27 住友電気工業株式会社 多結晶ダイヤモンドおよびその製造方法、スクライブツール、スクライブホイール、ドレッサー、回転工具、ウォータージェット用オリフィス、伸線ダイス、切削工具、電極ならびに多結晶ダイヤモンドを用いた加工方法

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JPS60102786A (ja) * 1983-11-09 1985-06-06 Toshiba Corp 棒状単結晶体製造方法
JP2719221B2 (ja) * 1990-07-11 1998-02-25 三菱マテリアル株式会社 切断用カッタ
JPH05172709A (ja) * 1991-12-20 1993-07-09 Sumitomo Electric Ind Ltd ミクロトーム用ダイヤモンドナイフおよびその製造方法
DE4328778C2 (de) * 1993-08-26 1996-01-25 Rieter Automatik Gmbh Schneidleiste mit einer Schneidschicht aus hochverschleißfestem Material
CN2331487Y (zh) * 1998-07-06 1999-08-04 中国纺织大学 刀刃接合式切断刀
JP3440888B2 (ja) * 1999-06-21 2003-08-25 株式会社村田製作所 ダイシングブレード及び電子部品の製造方法
JP4348583B2 (ja) * 1999-12-27 2009-10-21 並木精密宝石株式会社 ダイヤモンドドリル及びその製造方法
JP2004273737A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 半導体チップの製造方法
KR100719072B1 (ko) * 2005-10-28 2007-05-16 (주) 아모센스 엘이디 패키지의 세라믹의 경사면 형성 방법
CN201026625Y (zh) * 2006-08-31 2008-02-27 朱洪兵 一种切断刀
CN200957640Y (zh) * 2006-08-31 2007-10-10 朱洪兵 一种可换的切断刀
JP5765952B2 (ja) * 2011-01-28 2015-08-19 フタバ産業株式会社 トーションビーム式サスペンション
EP2733230B1 (en) * 2011-10-03 2017-12-20 Hitachi Metals, Ltd. Thin strip of alloy containing initial ultrafine crystals and method for cutting same, and thin strip of nanocrystalline soft-magnetic alloy and magnetic part employing same
CN102709409B (zh) * 2012-05-31 2015-06-03 东莞洲磊电子有限公司 一种四元系led芯片的切割方法
JP2014172100A (ja) * 2013-03-06 2014-09-22 Nippon Steel & Sumikin Electronics Devices Inc 押圧溝形成用スリット刃及びセラミックパッケージの製造方法
CN203346532U (zh) * 2013-07-17 2013-12-18 新疆齐鲁有限公司 一种用在涤纶短纤维生产中纤维切断设备中的切断刀片
JP2017024093A (ja) * 2015-07-17 2017-02-02 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6846795B2 (ja) * 2016-09-09 2021-03-24 三星ダイヤモンド工業株式会社 ツールホルダ
CN106182475B (zh) * 2016-09-24 2019-04-16 深圳市能华钨钢科技有限公司 一种用于晶片、导光板切断的超硬刀
CN208305422U (zh) * 2018-05-21 2019-01-01 中国石油集团渤海钻探工程有限公司 液压劈芯机用复合刀板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001009542A (ja) 1999-06-30 2001-01-16 Silver Roi:Kk 工 具
JP2012253346A (ja) 2011-05-31 2012-12-20 Samsung Electro-Mechanics Co Ltd 積層型セラミック電子部品及びその製造方法
JP2014162206A (ja) 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール、ホルダーユニット、スクライブ装置及びスクライビングホイールの製造方法
JP2018103356A (ja) 2016-12-27 2018-07-05 株式会社新日本テック ブレード加工装置及びブレード加工方法
JP2018203559A (ja) 2017-06-01 2018-12-27 住友電気工業株式会社 多結晶ダイヤモンドおよびその製造方法、スクライブツール、スクライブホイール、ドレッサー、回転工具、ウォータージェット用オリフィス、伸線ダイス、切削工具、電極ならびに多結晶ダイヤモンドを用いた加工方法

Also Published As

Publication number Publication date
KR101990013B1 (ko) 2019-06-17
TWI687948B (zh) 2020-03-11
CN111438829A (zh) 2020-07-24
CN111438829B (zh) 2022-10-14
TW202029238A (zh) 2020-08-01
JP2020113744A (ja) 2020-07-27

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