JP7335964B2 - 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、樹脂、及び、樹脂の製造方法 - Google Patents

硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、樹脂、及び、樹脂の製造方法 Download PDF

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JP7335964B2
JP7335964B2 JP2021542927A JP2021542927A JP7335964B2 JP 7335964 B2 JP7335964 B2 JP 7335964B2 JP 2021542927 A JP2021542927 A JP 2021542927A JP 2021542927 A JP2021542927 A JP 2021542927A JP 7335964 B2 JP7335964 B2 JP 7335964B2
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group
compound
formula
resin composition
curable resin
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JPWO2021039782A1 (https=
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敦靖 野崎
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2021542927A 2019-08-26 2020-08-25 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、樹脂、及び、樹脂の製造方法 Active JP7335964B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019153444 2019-08-26
JP2019153444 2019-08-26
PCT/JP2020/032002 WO2021039782A1 (ja) 2019-08-26 2020-08-25 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、樹脂、及び、樹脂の製造方法

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JPWO2021039782A1 JPWO2021039782A1 (https=) 2021-03-04
JP7335964B2 true JP7335964B2 (ja) 2023-08-30

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JP (1) JP7335964B2 (https=)
TW (1) TW202112907A (https=)
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7556263B2 (ja) * 2020-03-19 2024-09-26 住友ベークライト株式会社 ネガ型感光性樹脂組成物、ネガ型感光性ポリマー及びその用途
TW202248755A (zh) * 2021-03-22 2022-12-16 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化物、積層體、硬化物的製造方法以及半導體元件
JPWO2022270541A1 (https=) * 2021-06-25 2022-12-29
TW202424051A (zh) 2022-09-30 2024-06-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件
KR20250055605A (ko) 2022-09-30 2025-04-24 후지필름 가부시키가이샤 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스
CN121175622A (zh) 2023-03-15 2025-12-19 富士胶片株式会社 感光性树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件
WO2026070763A1 (ja) * 2024-09-30 2026-04-02 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002083659A1 (en) 2001-04-13 2002-10-24 Kaneka Corporation Diamine, acid dianhydride, polyimide composition having reactive group obtained therefrom, and processes for producing these
JP2002317046A (ja) 2001-04-20 2002-10-31 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムおよびその製造方法ならびにそれを使用した積層体および多層プリント配線板
JP2003167139A (ja) 2001-11-30 2003-06-13 Kanegafuchi Chem Ind Co Ltd 光導波路、それに用いる桂皮酸構造を有するポリイミド前駆体およびポリイミド

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6303742B1 (en) * 1998-04-01 2001-10-16 Kanekafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide compositions
JP2005347423A (ja) * 2004-06-01 2005-12-15 Fuji Photo Film Co Ltd 金属パターン形成方法、及び導電性パターン材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002083659A1 (en) 2001-04-13 2002-10-24 Kaneka Corporation Diamine, acid dianhydride, polyimide composition having reactive group obtained therefrom, and processes for producing these
JP2002317046A (ja) 2001-04-20 2002-10-31 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムおよびその製造方法ならびにそれを使用した積層体および多層プリント配線板
JP2003167139A (ja) 2001-11-30 2003-06-13 Kanegafuchi Chem Ind Co Ltd 光導波路、それに用いる桂皮酸構造を有するポリイミド前駆体およびポリイミド

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JPWO2021039782A1 (https=) 2021-03-04
WO2021039782A1 (ja) 2021-03-04

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