JP7334040B2 - 高温耐性、2成分、低粘度シリコーン組成物 - Google Patents
高温耐性、2成分、低粘度シリコーン組成物 Download PDFInfo
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- JP7334040B2 JP7334040B2 JP2018500571A JP2018500571A JP7334040B2 JP 7334040 B2 JP7334040 B2 JP 7334040B2 JP 2018500571 A JP2018500571 A JP 2018500571A JP 2018500571 A JP2018500571 A JP 2018500571A JP 7334040 B2 JP7334040 B2 JP 7334040B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5445—Silicon-containing compounds containing nitrogen containing at least one Si-N bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/14—Sealings between relatively-stationary surfaces by means of granular or plastic material, or fluid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Description
芝刈り機、リーフブロワー、発電機などに使用される小型の内燃機関が普及している。これらのエンジンは、典型的には、動くエンジン部品の大部分を囲んで支持するブロックを有する。シリンダ、ヘッド、カバー、インテークマニホールド、エキゾーストマニホールド等の他のエンジン部品がブロックにまたは互いに取り付けられている。トランスミッションまたは他のユニットをエンジンに取り付けて、一部のアプリケーションにパワートレインを提供することができる。大部分の小型内燃機関は、冷却のために液体でよりむしろ空気に頼っている。これらの空冷エンジンは、液体冷却エンジンよりも高い温度で作動することができ、空冷エンジンの構成要素は、液体冷却エンジンよりも高い作動温度を有することができる。
<詳細な説明>
Claims (13)
- 2パート硬化性組成物であって、
第1のパートは、オルガノシロキサンポリマー、第1のパートの全成分の重量に基づき、0~1重量%のヘキサメチルジシラザン(HMDS)、20~60重量%の充填剤および水を含み、
第2のパートは、第2のパートの全成分の重量に基づき、0.1~12重量%のヘキサメチルジシラザン(HMDS)、20~65重量%の充填剤、架橋剤、接着促進剤および触媒を含み、
いずれかまたは両方のパートは、さらに任意にビニルトリメトキシシラン、可塑剤、着色剤および添加剤の1種以上を含むことができ、
いずれかまたは両方のパートは、クリストバライト充填剤を含み、
架橋剤は、アセトキシ化合物、オキシム化合物、アルコキシ化合物、ベンズアミド化合物、アミン化合物およびアミノキシ化合物からなる群から選択され、
接着促進剤は、アミノシラン化合物、オクチルトリメトキシシラン、グリシジルトリメトキシシラン、メタクリルオキシプロピルトリメトキシシラン、ビニルトリメトキシシラン、テトラエトキシシランおよびその部分縮合生成物からなる群から選択され、
混合組成物は、200,000cP未満の粘度および100g/分を超える押出速度を有し、
硬化性組成物の硬化した生成物が、250℃の温度に42日間まで曝した後にその硬化した引張強度および伸びおよび硬度および重ね剪断強度特性の70%~120%を保持する2パート硬化性組成物。 - オルガノシロキサンポリマーが、ヒドロキシ末端ポリジメチルシロキサンである、請求項1に記載の2パート硬化性組成物。
- 第1のパートが、シリカ充填剤をさらに含み、水がシリカ充填剤に結合される、請求項1または2に記載の2パート硬化性組成物。
- 石英充填剤をさらに含む、請求項1~3のいずれか1項に記載の2パート硬化性組成物。
- 第2のパートが、可塑剤をさらに含む、請求項1~4のいずれか1項に記載の2パート硬化性組成物。
- 第2のパートが、ポリジメチルシロキサン可塑剤をさらに含む、請求項1~5のいずれか1項に記載の2パート硬化性組成物。
- 接着促進剤が、アミノシラン化合物である、請求項1~6のいずれか1項に記載の2パート硬化性組成物。
- 架橋剤が、オキシム化合物である、請求項1~7のいずれか1項に記載の2パート硬化性組成物。
- 第2のパートが、カーボンブラック、石英、シリカ、銅粉末、酸化鉄およびこれらの組み合わせから選択される充填剤をさらに含む、請求項1~8のいずれか1項に記載の2パート硬化性組成物。
- 請求項1~9のいずれか1項に記載の2パート硬化性組成物の硬化反応生成物。
- 硬化した生成物が、300℃の温度に3日間まで曝した後にその硬化した引張強度および伸びおよび硬度および重ね剪断強度特性の50%~130%を保持する、請求項1~9のいずれか1項に記載の2パート硬化性組成物の硬化反応生成物。
- 請求項1~9のいずれか1項に記載の2パート硬化性組成物の硬化反応生成物を含む2つのシール面の間に配置されたガスケット。
- 2つのシール面の間に配置された、請求項1~9のいずれか1項に記載の2パート硬化性組成物を含むパワートレインコンポーネント。
Priority Applications (1)
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JP2021137948A JP2022008306A (ja) | 2015-07-07 | 2021-08-26 | 高温耐性、2成分、低粘度シリコーン組成物 |
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US201562189251P | 2015-07-07 | 2015-07-07 | |
US62/189,251 | 2015-07-07 | ||
PCT/US2016/036127 WO2017007560A1 (en) | 2015-07-07 | 2016-06-07 | High temperature resistant, two component, low viscosity silicone composition |
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JP2021137948A Division JP2022008306A (ja) | 2015-07-07 | 2021-08-26 | 高温耐性、2成分、低粘度シリコーン組成物 |
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JP2018522108A JP2018522108A (ja) | 2018-08-09 |
JP7334040B2 true JP7334040B2 (ja) | 2023-08-28 |
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JP2018500571A Active JP7334040B2 (ja) | 2015-07-07 | 2016-06-07 | 高温耐性、2成分、低粘度シリコーン組成物 |
JP2021137948A Pending JP2022008306A (ja) | 2015-07-07 | 2021-08-26 | 高温耐性、2成分、低粘度シリコーン組成物 |
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Country Status (8)
Country | Link |
---|---|
US (1) | US10711135B2 (ja) |
EP (1) | EP3320046A4 (ja) |
JP (2) | JP7334040B2 (ja) |
KR (1) | KR20180027435A (ja) |
CN (1) | CN107849355B (ja) |
CA (1) | CA2991599C (ja) |
MX (1) | MX2017016766A (ja) |
WO (1) | WO2017007560A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2020123454A1 (en) * | 2018-12-13 | 2020-06-18 | Henkel IP & Holding GmbH | High strength, silane-modified polymer adhesive composition |
WO2020165288A1 (en) * | 2019-02-13 | 2020-08-20 | Sika Technology Ag | Thermally conductive curable composition |
EP4055085A1 (en) | 2019-11-08 | 2022-09-14 | Henkel AG & Co. KGaA | High temperature resistant dual component silicone adhesive |
CN113459550A (zh) * | 2021-07-20 | 2021-10-01 | 上海昂显机械设备有限公司 | 一种降噪轮胎及吸音层贴敷方法和系统 |
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-
2016
- 2016-06-07 CA CA2991599A patent/CA2991599C/en active Active
- 2016-06-07 KR KR1020177037594A patent/KR20180027435A/ko not_active Application Discontinuation
- 2016-06-07 CN CN201680039967.8A patent/CN107849355B/zh active Active
- 2016-06-07 MX MX2017016766A patent/MX2017016766A/es unknown
- 2016-06-07 EP EP16821784.2A patent/EP3320046A4/en active Pending
- 2016-06-07 WO PCT/US2016/036127 patent/WO2017007560A1/en active Application Filing
- 2016-06-07 JP JP2018500571A patent/JP7334040B2/ja active Active
-
2018
- 2018-01-05 US US15/862,939 patent/US10711135B2/en active Active
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2021
- 2021-08-26 JP JP2021137948A patent/JP2022008306A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US5346940A (en) | 1993-03-24 | 1994-09-13 | Loctite Corporation | Two-part fast curing RTV silicone for formed-on-part automotive gasket |
JP2002012767A (ja) | 2000-06-30 | 2002-01-15 | Shin Etsu Chem Co Ltd | 室温速硬化型シリコーン組成物 |
JP2008150491A (ja) | 2006-12-18 | 2008-07-03 | Momentive Performance Materials Japan Kk | 室温硬化性ポリオルガノシロキサン組成物 |
JP2011507996A (ja) | 2007-12-21 | 2011-03-10 | ダウ・コーニング・コーポレイション | シーラント組成物 |
JP2012533678A (ja) | 2009-07-21 | 2012-12-27 | ヘンケル コーポレイション | 反応性非シロキサン含有樹脂を含む、硬化性シリコーン組成物 |
JP2013139510A (ja) | 2011-12-29 | 2013-07-18 | Dow Corning Toray Co Ltd | 多成分型硬化性シリコーンゴム組成物、それを用いてなる電子部品用材料および太陽電池モジュール |
Also Published As
Publication number | Publication date |
---|---|
US20180127582A1 (en) | 2018-05-10 |
US10711135B2 (en) | 2020-07-14 |
EP3320046A4 (en) | 2019-02-27 |
CA2991599C (en) | 2023-07-11 |
KR20180027435A (ko) | 2018-03-14 |
CN107849355B (zh) | 2021-06-22 |
EP3320046A1 (en) | 2018-05-16 |
JP2018522108A (ja) | 2018-08-09 |
CN107849355A (zh) | 2018-03-27 |
JP2022008306A (ja) | 2022-01-13 |
CA2991599A1 (en) | 2017-01-12 |
WO2017007560A1 (en) | 2017-01-12 |
MX2017016766A (es) | 2018-03-09 |
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