JP7332479B2 - 樹脂材料、積層構造体及び多層プリント配線板 - Google Patents

樹脂材料、積層構造体及び多層プリント配線板 Download PDF

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Publication number
JP7332479B2
JP7332479B2 JP2019554576A JP2019554576A JP7332479B2 JP 7332479 B2 JP7332479 B2 JP 7332479B2 JP 2019554576 A JP2019554576 A JP 2019554576A JP 2019554576 A JP2019554576 A JP 2019554576A JP 7332479 B2 JP7332479 B2 JP 7332479B2
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compound
resin material
material according
resin
maleimide compound
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Japanese (ja)
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JPWO2020045408A1 (ja
Inventor
悠子 川原
達史 林
顕紀子 久保
幸平 竹田
誠実 新土
さやか 脇岡
悠太 大當
祥人 新井
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2019554576A 2018-08-27 2019-08-27 樹脂材料、積層構造体及び多層プリント配線板 Active JP7332479B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018158415 2018-08-27
JP2018158415 2018-08-27
PCT/JP2019/033469 WO2020045408A1 (ja) 2018-08-27 2019-08-27 樹脂材料、積層構造体及び多層プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2020045408A1 JPWO2020045408A1 (ja) 2021-08-10
JP7332479B2 true JP7332479B2 (ja) 2023-08-23

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ID=69643295

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JP2019554576A Active JP7332479B2 (ja) 2018-08-27 2019-08-27 樹脂材料、積層構造体及び多層プリント配線板

Country Status (5)

Country Link
JP (1) JP7332479B2 (zh)
KR (1) KR20210050521A (zh)
CN (1) CN112601778A (zh)
TW (1) TWI822841B (zh)
WO (1) WO2020045408A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7124657B2 (ja) * 2018-11-14 2022-08-24 味の素株式会社 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP6984579B2 (ja) * 2018-11-29 2021-12-22 信越化学工業株式会社 エポキシ樹脂組成物、並びに該樹脂組成物を用いて製造された接着フィルム、プリプレグ、多層プリント配線板、及び半導体装置
JP2020090570A (ja) * 2018-12-03 2020-06-11 味の素株式会社 樹脂組成物
CN109825081B (zh) * 2019-01-30 2021-06-04 广东生益科技股份有限公司 一种热固性树脂组合物、包含其的预浸料以及覆金属箔层压板和印制电路板
KR20220043123A (ko) * 2019-08-01 2022-04-05 세키스이가가쿠 고교가부시키가이샤 수지 재료 및 다층 프린트 배선판
JP7478008B2 (ja) * 2020-03-27 2024-05-02 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7409223B2 (ja) * 2020-05-14 2024-01-09 味の素株式会社 樹脂組成物
TWI748898B (zh) 2021-03-15 2021-12-01 晉一化工股份有限公司 熱固性樹脂組成物、難燃樹脂組成物、液態封裝材及其用途、薄膜及其用途
WO2024009831A1 (ja) * 2022-07-04 2024-01-11 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017027482A1 (en) 2015-08-08 2017-02-16 Designer Molecules, Inc. Anionic curable compositions

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0407661B2 (en) * 1989-07-11 1996-01-24 Akzo Nobel N.V. Biscitraconimide (co)polymer and process for curing biscitraconimides with an anionic catalyst
CN101443368B (zh) * 2006-05-18 2012-08-29 弗来克塞斯股份有限公司 含有双柠康酰亚胺、双衣康酰亚胺和/或柠康酰亚氨基衣康酰亚胺的组合物
JP2013211348A (ja) * 2012-03-30 2013-10-10 Nippon Steel & Sumikin Chemical Co Ltd チップ用保護膜形成フィルム
JP2014001289A (ja) * 2012-06-18 2014-01-09 Nippon Steel & Sumikin Chemical Co Ltd 半導体封止用樹脂組成物
SG11201705654PA (en) 2015-01-13 2017-08-30 Hitachi Chemical Co Ltd Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
US10689496B2 (en) * 2016-08-24 2020-06-23 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board
JP7442255B2 (ja) 2016-12-06 2024-03-04 三菱瓦斯化学株式会社 電子材料用樹脂組成物
CN111836857A (zh) * 2018-03-28 2020-10-27 积水化学工业株式会社 树脂材料、叠层结构体及多层印刷布线板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017027482A1 (en) 2015-08-08 2017-02-16 Designer Molecules, Inc. Anionic curable compositions

Also Published As

Publication number Publication date
TWI822841B (zh) 2023-11-21
WO2020045408A1 (ja) 2020-03-05
TW202020022A (zh) 2020-06-01
JPWO2020045408A1 (ja) 2021-08-10
CN112601778A (zh) 2021-04-02
KR20210050521A (ko) 2021-05-07

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