JP7332479B2 - 樹脂材料、積層構造体及び多層プリント配線板 - Google Patents
樹脂材料、積層構造体及び多層プリント配線板 Download PDFInfo
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- JP7332479B2 JP7332479B2 JP2019554576A JP2019554576A JP7332479B2 JP 7332479 B2 JP7332479 B2 JP 7332479B2 JP 2019554576 A JP2019554576 A JP 2019554576A JP 2019554576 A JP2019554576 A JP 2019554576A JP 7332479 B2 JP7332479 B2 JP 7332479B2
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- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 46
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- Compositions Of Macromolecular Compounds (AREA)
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- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
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JP2018158415 | 2018-08-27 | ||
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JP7124657B2 (ja) * | 2018-11-14 | 2022-08-24 | 味の素株式会社 | 樹脂組成物、樹脂シート、プリント配線板及び半導体装置 |
JP6984579B2 (ja) * | 2018-11-29 | 2021-12-22 | 信越化学工業株式会社 | エポキシ樹脂組成物、並びに該樹脂組成物を用いて製造された接着フィルム、プリプレグ、多層プリント配線板、及び半導体装置 |
JP2020090570A (ja) * | 2018-12-03 | 2020-06-11 | 味の素株式会社 | 樹脂組成物 |
CN109825081B (zh) * | 2019-01-30 | 2021-06-04 | 广东生益科技股份有限公司 | 一种热固性树脂组合物、包含其的预浸料以及覆金属箔层压板和印制电路板 |
TW202112904A (zh) * | 2019-08-01 | 2021-04-01 | 日商積水化學工業股份有限公司 | 樹脂材料及多層印刷佈線板 |
JP7478008B2 (ja) * | 2020-03-27 | 2024-05-02 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
JP7409223B2 (ja) * | 2020-05-14 | 2024-01-09 | 味の素株式会社 | 樹脂組成物 |
TWI748898B (zh) | 2021-03-15 | 2021-12-01 | 晉一化工股份有限公司 | 熱固性樹脂組成物、難燃樹脂組成物、液態封裝材及其用途、薄膜及其用途 |
JP7523871B2 (ja) | 2021-08-02 | 2024-07-29 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
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CN101443368B (zh) * | 2006-05-18 | 2012-08-29 | 弗来克塞斯股份有限公司 | 含有双柠康酰亚胺、双衣康酰亚胺和/或柠康酰亚氨基衣康酰亚胺的组合物 |
JP2013211348A (ja) * | 2012-03-30 | 2013-10-10 | Nippon Steel & Sumikin Chemical Co Ltd | チップ用保護膜形成フィルム |
JP2014001289A (ja) * | 2012-06-18 | 2014-01-09 | Nippon Steel & Sumikin Chemical Co Ltd | 半導体封止用樹脂組成物 |
SG10201903484XA (en) | 2015-01-13 | 2019-05-30 | Hitachi Chemical Co Ltd | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
WO2018038179A1 (ja) * | 2016-08-24 | 2018-03-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
JP7442255B2 (ja) | 2016-12-06 | 2024-03-04 | 三菱瓦斯化学株式会社 | 電子材料用樹脂組成物 |
JP6805338B2 (ja) * | 2018-03-28 | 2020-12-23 | 積水化学工業株式会社 | 樹脂材料、積層構造体及び多層プリント配線板 |
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