JP7331155B2 - 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス - Google Patents

樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Download PDF

Info

Publication number
JP7331155B2
JP7331155B2 JP2021575852A JP2021575852A JP7331155B2 JP 7331155 B2 JP7331155 B2 JP 7331155B2 JP 2021575852 A JP2021575852 A JP 2021575852A JP 2021575852 A JP2021575852 A JP 2021575852A JP 7331155 B2 JP7331155 B2 JP 7331155B2
Authority
JP
Japan
Prior art keywords
group
formula
resin composition
carbon atoms
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021575852A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021157643A1 (https=
Inventor
倫弘 小川
俊栄 青島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2021157643A1 publication Critical patent/JPWO2021157643A1/ja
Priority to JP2023130031A priority Critical patent/JP2023159205A/ja
Application granted granted Critical
Publication of JP7331155B2 publication Critical patent/JP7331155B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/21—Urea; Derivatives thereof, e.g. biuret
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/47—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts comprising two or more dielectric layers having different properties, e.g. different dielectric constants

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
JP2021575852A 2020-02-04 2021-02-04 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Active JP7331155B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023130031A JP2023159205A (ja) 2020-02-04 2023-08-09 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020017329 2020-02-04
JP2020017329 2020-02-04
PCT/JP2021/004054 WO2021157643A1 (ja) 2020-02-04 2021-02-04 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023130031A Division JP2023159205A (ja) 2020-02-04 2023-08-09 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2021157643A1 JPWO2021157643A1 (https=) 2021-08-12
JP7331155B2 true JP7331155B2 (ja) 2023-08-22

Family

ID=77200677

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021575852A Active JP7331155B2 (ja) 2020-02-04 2021-02-04 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP2023130031A Withdrawn JP2023159205A (ja) 2020-02-04 2023-08-09 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023130031A Withdrawn JP2023159205A (ja) 2020-02-04 2023-08-09 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Country Status (5)

Country Link
JP (2) JP7331155B2 (https=)
KR (1) KR102766259B1 (https=)
CN (1) CN115103871A (https=)
TW (1) TWI875941B (https=)
WO (1) WO2021157643A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112573A1 (ja) * 2021-12-14 2023-06-22 富士フイルム株式会社 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液
WO2024095885A1 (ja) * 2022-10-31 2024-05-10 富士フイルム株式会社 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131907A (ja) 2000-10-26 2002-05-09 Asahi Kasei Corp ポリイミド前駆体組成物
JP2010285557A (ja) 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
WO2018043467A1 (ja) 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用
CN108440977A (zh) 2018-03-12 2018-08-24 长安大学 用于高模量抗车辙混凝土的改性沥青、改性剂及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6172022A (ja) * 1984-09-14 1986-04-14 Asahi Chem Ind Co Ltd ポリアミドの製造方法
JPH0749483B2 (ja) * 1988-05-02 1995-05-31 チッソ株式会社 感光性重合体の製造方法
JP4761989B2 (ja) * 2006-02-02 2011-08-31 旭化成イーマテリアルズ株式会社 ポリアミド酸エステル組成物
JP5571990B2 (ja) 2009-06-04 2014-08-13 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置
US9365750B2 (en) * 2012-06-27 2016-06-14 Henkel IP & Holding GmbH Accelerators for curable compositions
TWI634135B (zh) * 2015-12-25 2018-09-01 日商富士軟片股份有限公司 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件
TWI758415B (zh) * 2017-02-20 2022-03-21 日商富士軟片股份有限公司 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置
JP6566150B2 (ja) * 2017-06-30 2019-08-28 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜及び電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131907A (ja) 2000-10-26 2002-05-09 Asahi Kasei Corp ポリイミド前駆体組成物
JP2010285557A (ja) 2009-06-12 2010-12-24 Teijin Ltd 環状カルボジイミドを含有する樹脂組成物
WO2018043467A1 (ja) 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用
CN108440977A (zh) 2018-03-12 2018-08-24 长安大学 用于高模量抗车辙混凝土的改性沥青、改性剂及制备方法

Also Published As

Publication number Publication date
JP2023159205A (ja) 2023-10-31
KR102766259B1 (ko) 2025-02-12
WO2021157643A1 (ja) 2021-08-12
JPWO2021157643A1 (https=) 2021-08-12
CN115103871A (zh) 2022-09-23
TWI875941B (zh) 2025-03-11
KR20220123434A (ko) 2022-09-06
TW202136375A (zh) 2021-10-01

Similar Documents

Publication Publication Date Title
JP7470790B2 (ja) 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7576617B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7300511B2 (ja) 硬化膜の製造方法、光硬化性樹脂組成物、積層体の製造方法、及び、半導体デバイスの製造方法
JP7334268B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7530430B2 (ja) 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、半導体デバイス、ポリイミド前駆体及びその製造方法
JP7492003B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7481462B2 (ja) 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、半導体デバイス、ポリイミド前駆体及びその製造方法
JP7412530B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7595062B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
WO2021157571A1 (ja) 硬化性樹脂組成物、樹脂膜、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
KR102729553B1 (ko) 패턴 형성 방법, 광경화성 수지 조성물, 적층체의 제조 방법, 및, 전자 디바이스의 제조 방법
JP2023153860A (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、樹脂
JP7573026B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
KR20220052342A (ko) 패턴 형성 방법, 감광성 수지 조성물, 적층체의 제조 방법, 및, 반도체 디바이스의 제조 방법
JP7629930B2 (ja) 感光性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
JP7542069B2 (ja) 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法
JP2023159205A (ja) 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP2023153846A (ja) 硬化性樹脂組成物、硬化性樹脂組成物の製造方法、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7498281B2 (ja) 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
WO2022176869A1 (ja) 永久膜の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法
JP7454672B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱硬化性樹脂
JP7526272B2 (ja) ポリイミド前駆体の製造方法、及び、硬化性樹脂組成物の製造方法
JP7558988B2 (ja) 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7653442B2 (ja) 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス
JP7451681B2 (ja) 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220701

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230314

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230511

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230711

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230809

R150 Certificate of patent or registration of utility model

Ref document number: 7331155

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150