JP7331016B2 - 表示基板及びその製造方法、表示装置 - Google Patents
表示基板及びその製造方法、表示装置 Download PDFInfo
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- JP7331016B2 JP7331016B2 JP2020563401A JP2020563401A JP7331016B2 JP 7331016 B2 JP7331016 B2 JP 7331016B2 JP 2020563401 A JP2020563401 A JP 2020563401A JP 2020563401 A JP2020563401 A JP 2020563401A JP 7331016 B2 JP7331016 B2 JP 7331016B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/813—Anodes characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023130348A JP7600323B2 (ja) | 2019-03-26 | 2023-08-09 | 表示基板及びその製造方法、表示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/079717 WO2020191623A1 (zh) | 2019-03-26 | 2019-03-26 | 显示基板及其制备方法、显示装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023130348A Division JP7600323B2 (ja) | 2019-03-26 | 2023-08-09 | 表示基板及びその製造方法、表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022534630A JP2022534630A (ja) | 2022-08-03 |
| JP7331016B2 true JP7331016B2 (ja) | 2023-08-22 |
Family
ID=72610734
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020563401A Active JP7331016B2 (ja) | 2019-03-26 | 2019-03-26 | 表示基板及びその製造方法、表示装置 |
| JP2020562581A Active JP7386811B2 (ja) | 2019-03-26 | 2019-11-01 | 表示基板及びその製造方法 |
| JP2023130348A Active JP7600323B2 (ja) | 2019-03-26 | 2023-08-09 | 表示基板及びその製造方法、表示装置 |
| JP2023190826A Active JP7751622B2 (ja) | 2019-03-26 | 2023-11-08 | 表示基板及びその製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020562581A Active JP7386811B2 (ja) | 2019-03-26 | 2019-11-01 | 表示基板及びその製造方法 |
| JP2023130348A Active JP7600323B2 (ja) | 2019-03-26 | 2023-08-09 | 表示基板及びその製造方法、表示装置 |
| JP2023190826A Active JP7751622B2 (ja) | 2019-03-26 | 2023-11-08 | 表示基板及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (5) | US11575102B2 (enExample) |
| EP (5) | EP3951881B1 (enExample) |
| JP (4) | JP7331016B2 (enExample) |
| CN (3) | CN112005377B (enExample) |
| WO (2) | WO2020191623A1 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110164916B (zh) | 2018-12-05 | 2021-02-02 | 京东方科技集团股份有限公司 | 显示面板、显示设备及制造显示面板的方法 |
| JP7331016B2 (ja) * | 2019-03-26 | 2023-08-22 | 京東方科技集團股▲ふん▼有限公司 | 表示基板及びその製造方法、表示装置 |
| WO2020202247A1 (ja) * | 2019-03-29 | 2020-10-08 | シャープ株式会社 | 表示装置 |
| CN110137186B (zh) * | 2019-05-30 | 2021-12-28 | 京东方科技集团股份有限公司 | 柔性显示基板及其制造方法 |
| KR102721171B1 (ko) | 2019-06-21 | 2024-10-25 | 삼성디스플레이 주식회사 | 표시 장치 |
| JP7441838B2 (ja) * | 2019-06-28 | 2024-03-01 | 株式会社半導体エネルギー研究所 | 表示装置 |
| CN110265583B (zh) * | 2019-07-26 | 2022-08-12 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
| KR102809348B1 (ko) * | 2020-04-13 | 2025-05-19 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN114335374B (zh) | 2020-09-30 | 2024-06-04 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
| CN112435581B (zh) * | 2020-11-30 | 2023-01-13 | 京东方科技集团股份有限公司 | 一种柔性显示结构、柔性显示屏及电子设备 |
| US20230422588A1 (en) * | 2020-12-02 | 2023-12-28 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel and display device |
| CN112562497B (zh) * | 2020-12-03 | 2022-06-07 | 合肥维信诺科技有限公司 | 显示面板和显示面板的制备方法 |
| CN112582569B (zh) * | 2020-12-10 | 2022-12-06 | 合肥京东方光电科技有限公司 | 一种显示基板的制备方法、显示基板及显示装置 |
| CN112885977B (zh) * | 2021-01-20 | 2024-07-26 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示面板 |
| WO2022226686A1 (zh) * | 2021-04-25 | 2022-11-03 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
| CN113451531B (zh) * | 2021-06-29 | 2023-04-07 | 合肥鑫晟光电科技有限公司 | 显示面板及其制备方法、显示设备 |
| US12295240B2 (en) * | 2021-07-28 | 2025-05-06 | Boe Technology Group Co., Ltd. | Display substrate and display apparatus |
| CN116156934A (zh) * | 2021-11-17 | 2023-05-23 | 华为终端有限公司 | 显示面板及其制作方法、电子设备 |
| CN114039015B (zh) * | 2021-11-24 | 2023-05-02 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
| CN116193924A (zh) * | 2021-11-25 | 2023-05-30 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
| CN114122029B (zh) * | 2021-11-30 | 2026-03-06 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
| CN114899334A (zh) * | 2022-03-23 | 2022-08-12 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
| CN114678407B (zh) * | 2022-03-24 | 2026-01-27 | 京东方科技集团股份有限公司 | 显示基板和显示装置 |
| CN116940154B (zh) * | 2022-03-30 | 2026-01-27 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法、显示装置 |
| CN114975481A (zh) * | 2022-05-09 | 2022-08-30 | 武汉华星光电半导体显示技术有限公司 | 阵列基板及其制作方法、显示面板 |
| EP4566431A1 (en) * | 2022-08-01 | 2025-06-11 | Applied Materials, Inc. | Bezel-less camera and sensor hole |
| KR20240032263A (ko) | 2022-09-01 | 2024-03-12 | 삼성디스플레이 주식회사 | 표시 패널 |
| JP2024043634A (ja) * | 2022-09-20 | 2024-04-02 | 株式会社ジャパンディスプレイ | 計測方法及び計測装置 |
| CN115867079A (zh) * | 2022-12-27 | 2023-03-28 | 上海天马微电子有限公司 | 显示面板及显示装置 |
| US20240224652A1 (en) * | 2022-12-29 | 2024-07-04 | Lg Display Co., Ltd. | Display device |
| CN116322120A (zh) * | 2023-03-21 | 2023-06-23 | 京东方科技集团股份有限公司 | 显示装置、显示面板及其制备方法 |
| CN116347917A (zh) * | 2023-04-20 | 2023-06-27 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置 |
| CN116322163A (zh) * | 2023-04-24 | 2023-06-23 | 京东方科技集团股份有限公司 | 一种发光面板及发光装置 |
| CN118946183A (zh) * | 2023-05-12 | 2024-11-12 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
| KR20250023931A (ko) * | 2023-08-10 | 2025-02-18 | 허페이 비젼녹스 테크놀로지 컴퍼니 리미티드 | 표시 패널, 표시 장치 및 표시 패널의 제조 방법 |
| KR20250036504A (ko) * | 2023-09-07 | 2025-03-14 | 엘지디스플레이 주식회사 | 박막트랜지스터를 포함하는 표시장치 및 그 제조방법 |
| CN121773739A (zh) * | 2024-07-30 | 2026-03-31 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
| WO2026055927A1 (zh) * | 2024-09-13 | 2026-03-19 | 京东方科技集团股份有限公司 | 显示基板、显示装置 |
Citations (4)
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| US20160149155A1 (en) | 2014-11-25 | 2016-05-26 | Lg Display Co., Ltd. | Organic light-emitting display device and method of manufacturing the same |
| US20170062755A1 (en) | 2015-08-31 | 2017-03-02 | Lg Display Co., Ltd. | Organic Light Emitting Display Device and Method of Manufacturing the Same |
| US20170148856A1 (en) | 2015-11-20 | 2017-05-25 | Samsung Display Co., Ltd | Organic light-emitting display and method of manufacturing the same |
| CN109360843A (zh) | 2018-10-18 | 2019-02-19 | 京东方科技集团股份有限公司 | Oled显示基板及其制作方法、显示装置 |
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| KR102463838B1 (ko) | 2015-08-24 | 2022-11-04 | 삼성디스플레이 주식회사 | 가요성 표시 장치와 이의 제조 방법 |
| KR102427249B1 (ko) | 2015-10-16 | 2022-08-01 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
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