CN112005377A - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

Info

Publication number
CN112005377A
CN112005377A CN201980000392.2A CN201980000392A CN112005377A CN 112005377 A CN112005377 A CN 112005377A CN 201980000392 A CN201980000392 A CN 201980000392A CN 112005377 A CN112005377 A CN 112005377A
Authority
CN
China
Prior art keywords
layer
metal
display
barrier wall
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201980000392.2A
Other languages
English (en)
Other versions
CN112005377B (zh
Inventor
黄炜赟
高永益
姜尚勋
胡文博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN112005377A publication Critical patent/CN112005377A/zh
Application granted granted Critical
Publication of CN112005377B publication Critical patent/CN112005377B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/813—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/822—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示基板及其制备方法、显示装置。该显示基板(200/300/400)包括显示区(201/301/401)和开孔区(2011/3011/4011)，显示区(201/301/401)围绕开孔区(2011/3011/4011)，显示区(201/301/401)和开孔区(2011/3011/4011)之间包括第一阻隔墙(2012/3012/4012)，第一阻隔墙(2012/3012/4012)围绕开孔区(2011/3011/4011)；第一阻隔墙(2012/3012/4012)包括第一金属层结构，第一金属层结构的围绕开孔区(2011/3011/4011)的至少一个侧面具有凹口(2012A/3012A/4012A)。该显示基板将摄像装置与显示基板的显示区结合在一起，并且具有更好的封装效果。

Description

PCT国内申请，说明书已公开。

Claims (26)

  1. PCT国内申请，权利要求书已公开。
CN201980000392.2A 2019-03-26 2019-03-26 显示基板及其制备方法、显示装置 Active CN112005377B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/079717 WO2020191623A1 (zh) 2019-03-26 2019-03-26 显示基板及其制备方法、显示装置

Publications (2)

Publication Number Publication Date
CN112005377A true CN112005377A (zh) 2020-11-27
CN112005377B CN112005377B (zh) 2023-04-28

Family

ID=72610734

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201980000392.2A Active CN112005377B (zh) 2019-03-26 2019-03-26 显示基板及其制备方法、显示装置
CN201980002261.8A Active CN112005378B (zh) 2019-03-26 2019-11-01 显示基板及其制备方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201980002261.8A Active CN112005378B (zh) 2019-03-26 2019-11-01 显示基板及其制备方法

Country Status (5)

Country Link
US (4) US11575102B2 (zh)
EP (2) EP3951881A4 (zh)
JP (4) JP7331016B2 (zh)
CN (2) CN112005377B (zh)
WO (2) WO2020191623A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112885977A (zh) * 2021-01-20 2021-06-01 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示面板

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110164916B (zh) * 2018-12-05 2021-02-02 京东方科技集团股份有限公司 显示面板、显示设备及制造显示面板的方法
WO2020191623A1 (zh) * 2019-03-26 2020-10-01 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
WO2020202247A1 (ja) * 2019-03-29 2020-10-08 シャープ株式会社 表示装置
CN110137186B (zh) * 2019-05-30 2021-12-28 京东方科技集团股份有限公司 柔性显示基板及其制造方法
CN110265583B (zh) * 2019-07-26 2022-08-12 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN114335374B (zh) * 2020-09-30 2024-06-04 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN112435581B (zh) * 2020-11-30 2023-01-13 京东方科技集团股份有限公司 一种柔性显示结构、柔性显示屏及电子设备
CN114846617B (zh) * 2020-12-02 2023-11-03 京东方科技集团股份有限公司 显示面板和显示装置
CN112562497B (zh) * 2020-12-03 2022-06-07 合肥维信诺科技有限公司 显示面板和显示面板的制备方法
CN112582569B (zh) * 2020-12-10 2022-12-06 合肥京东方光电科技有限公司 一种显示基板的制备方法、显示基板及显示装置
CN116234377B (zh) * 2021-11-17 2023-12-08 华为终端有限公司 显示面板及其制作方法、电子设备
CN116193924A (zh) * 2021-11-25 2023-05-30 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104821325A (zh) * 2014-02-05 2015-08-05 三星显示有限公司 有机发光显示设备
CN106887523A (zh) * 2015-11-20 2017-06-23 三星显示有限公司 有机发光显示器及其制造方法
CN107579171A (zh) * 2017-08-31 2018-01-12 京东方科技集团股份有限公司 有机电致发光显示基板及其制作方法、显示装置
CN108666347A (zh) * 2018-04-26 2018-10-16 上海天马微电子有限公司 显示面板及其制造方法、显示装置
CN109273483A (zh) * 2017-07-17 2019-01-25 京东方科技集团股份有限公司 显示基板及其制备方法和显示装置
CN109360843A (zh) * 2018-10-18 2019-02-19 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN109427861A (zh) * 2017-09-04 2019-03-05 三星显示有限公司 显示装置及其制造方法
CN110164916A (zh) * 2018-12-05 2019-08-23 京东方科技集团股份有限公司 显示面板、显示设备及制造显示面板的方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101978783B1 (ko) 2012-11-09 2019-05-15 엘지디스플레이 주식회사 플렉서블 유기전계발광소자 및 그 제조방법
JP6372649B2 (ja) 2014-04-10 2018-08-15 日本電気硝子株式会社 ディスプレイ用保護部材及びこれを用いた携帯端末
KR102374833B1 (ko) * 2014-11-25 2022-03-15 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102326069B1 (ko) 2015-07-29 2021-11-12 엘지디스플레이 주식회사 유기발광 다이오드 표시장치
KR102463838B1 (ko) 2015-08-24 2022-11-04 삼성디스플레이 주식회사 가요성 표시 장치와 이의 제조 방법
KR102405695B1 (ko) * 2015-08-31 2022-06-03 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102427249B1 (ko) 2015-10-16 2022-08-01 삼성디스플레이 주식회사 디스플레이 장치
US10205122B2 (en) 2015-11-20 2019-02-12 Samsung Display Co., Ltd. Organic light-emitting display and method of manufacturing the same
KR102490891B1 (ko) 2015-12-04 2023-01-25 삼성디스플레이 주식회사 표시 장치
KR102407869B1 (ko) 2016-02-16 2022-06-13 삼성디스플레이 주식회사 유기 발광 디스플레이 장치와, 이의 제조 방법
JP6815090B2 (ja) 2016-03-31 2021-01-20 株式会社Ｊｏｌｅｄ 表示パネル及びその製造方法
KR102605208B1 (ko) 2016-06-28 2023-11-24 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
JP6807223B2 (ja) 2016-11-28 2021-01-06 株式会社ジャパンディスプレイ 表示装置
KR20180060851A (ko) 2016-11-29 2018-06-07 엘지디스플레이 주식회사 유기 발광 표시 장치
WO2018229991A1 (ja) * 2017-06-16 2018-12-20 シャープ株式会社 表示装置及びその製造方法
WO2019030858A1 (ja) * 2017-08-09 2019-02-14 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置
KR102083646B1 (ko) 2017-08-11 2020-03-03 삼성디스플레이 주식회사 표시 패널 및 이를 포함하는 전자 장치
CN107808896B (zh) 2017-10-27 2021-02-02 上海天马微电子有限公司 一种显示面板、显示面板的制作方法及显示装置
CN108666547A (zh) 2018-04-24 2018-10-16 芜湖浙鑫新能源有限公司 碳包覆的高镍锂离子电池正极材料及其制备方法
KR102551790B1 (ko) 2018-06-29 2023-07-07 삼성디스플레이 주식회사 유기발광 디스플레이 장치
CN109742121B (zh) * 2019-01-10 2023-11-24 京东方科技集团股份有限公司 一种柔性基板及其制备方法、显示装置
KR20200091050A (ko) 2019-01-21 2020-07-30 삼성디스플레이 주식회사 디스플레이 장치
WO2020191623A1 (zh) * 2019-03-26 2020-10-01 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN110212113B (zh) 2019-05-31 2021-11-09 京东方科技集团股份有限公司 电致发光显示基板及其制备方法、电致发光显示装置
CN110164945B (zh) 2019-06-03 2021-02-26 京东方科技集团股份有限公司 一种显示基板的制备方法、显示基板及显示装置
CN110246984A (zh) 2019-06-21 2019-09-17 京东方科技集团股份有限公司 一种显示面板、显示装置和显示面板的制作方法
CN110265583B (zh) * 2019-07-26 2022-08-12 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104821325A (zh) * 2014-02-05 2015-08-05 三星显示有限公司 有机发光显示设备
CN106887523A (zh) * 2015-11-20 2017-06-23 三星显示有限公司 有机发光显示器及其制造方法
CN109273483A (zh) * 2017-07-17 2019-01-25 京东方科技集团股份有限公司 显示基板及其制备方法和显示装置
CN107579171A (zh) * 2017-08-31 2018-01-12 京东方科技集团股份有限公司 有机电致发光显示基板及其制作方法、显示装置
CN109427861A (zh) * 2017-09-04 2019-03-05 三星显示有限公司 显示装置及其制造方法
CN108666347A (zh) * 2018-04-26 2018-10-16 上海天马微电子有限公司 显示面板及其制造方法、显示装置
CN109360843A (zh) * 2018-10-18 2019-02-19 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN110164916A (zh) * 2018-12-05 2019-08-23 京东方科技集团股份有限公司 显示面板、显示设备及制造显示面板的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112885977A (zh) * 2021-01-20 2021-06-01 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示面板

Also Published As

Publication number Publication date
US11575103B2 (en) 2023-02-07
JP2024020320A (ja) 2024-02-14
JP7386811B2 (ja) 2023-11-27
WO2020192121A1 (zh) 2020-10-01
EP3955305A4 (en) 2022-12-21
US11903234B2 (en) 2024-02-13
US20210151707A1 (en) 2021-05-20
JP2023156420A (ja) 2023-10-24
WO2020191623A1 (zh) 2020-10-01
US20240040819A1 (en) 2024-02-01
JP7331016B2 (ja) 2023-08-22
US11575102B2 (en) 2023-02-07
US20230145922A1 (en) 2023-05-11
EP3955305A1 (en) 2022-02-16
US20210210718A1 (en) 2021-07-08
CN112005378B (zh) 2024-06-18
JP2022524561A (ja) 2022-05-09
EP3951881A1 (en) 2022-02-09
CN112005378A (zh) 2020-11-27
CN112005377B (zh) 2023-04-28
EP3951881A4 (en) 2022-10-26
JP2022534630A (ja) 2022-08-03

Similar Documents

Publication Publication Date Title
CN112005377B (zh) 显示基板及其制备方法、显示装置
CN112186023B (zh) 一种显示基板及其制备方法、显示装置
JP6136578B2 (ja) 表示装置および表示装置の製造方法ならびに電子機器
CN111933822B (zh) 显示面板的制作方法、显示面板以及显示装置
CN111480246A (zh) 显示基板及其制备方法、显示装置
WO2019114204A1 (en) Organic light-emitting diode apparatus, fabircation method thereof, display panel, and display apparatus
CN112492890A (zh) 显示基板及其制备方法、显示装置
CN113439338A (zh) 显示基板及其制备方法
CN113439339A (zh) 显示基板及其制备方法
CN110785868B (zh) 显示基板、显示装置和制造显示基板的方法
CN216698369U (zh) 显示基板及显示装置
CN114156325A (zh) 一种显示基板、显示装置及显示基板的制备方法
CN113632234A (zh) 显示基板及其制作方法、显示装置
WO2023093252A1 (zh) 显示基板及其制备方法、显示装置
KR20160017371A (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
CN116744746A (zh) 一种显示基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant