JP7325899B2 - 金属張積層板の製造方法、被覆加圧ロールの製造方法及び修復方法 - Google Patents

金属張積層板の製造方法、被覆加圧ロールの製造方法及び修復方法 Download PDF

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JP7325899B2
JP7325899B2 JP2019111879A JP2019111879A JP7325899B2 JP 7325899 B2 JP7325899 B2 JP 7325899B2 JP 2019111879 A JP2019111879 A JP 2019111879A JP 2019111879 A JP2019111879 A JP 2019111879A JP 7325899 B2 JP7325899 B2 JP 7325899B2
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Prior art keywords
polyimide
metal
roll
clad laminate
film
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JP2019111879A
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Japanese (ja)
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JP2020006685A (ja
Inventor
克文 平石
哲平 西山
正一 井伊
円 寺嶋
伸二 小嶺
和明 金子
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2019111879A 2018-06-29 2019-06-17 金属張積層板の製造方法、被覆加圧ロールの製造方法及び修復方法 Active JP7325899B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018124002 2018-06-29
JP2018124002 2018-06-29

Publications (2)

Publication Number Publication Date
JP2020006685A JP2020006685A (ja) 2020-01-16
JP7325899B2 true JP7325899B2 (ja) 2023-08-15

Family

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JP2019111879A Active JP7325899B2 (ja) 2018-06-29 2019-06-17 金属張積層板の製造方法、被覆加圧ロールの製造方法及び修復方法

Country Status (4)

Country Link
JP (1) JP7325899B2 (ko)
KR (1) KR102592679B1 (ko)
CN (1) CN110662358A (ko)
TW (1) TWI810329B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111703185B (zh) * 2020-07-09 2021-11-05 昆山乐邦精密科技有限公司 一种聚酰亚胺网版热压装置及其使用方法
JP6900138B1 (ja) * 2020-09-18 2021-07-07 株式会社日本製鋼所 積層成形プレス装置、積層成形システム、および積層成形方法
CN112739048A (zh) * 2020-12-10 2021-04-30 厦门柔性电子研究院有限公司 一种双面柔性电路板的卷式制作方法及其制作的柔性电路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001046963A (ja) 1999-08-13 2001-02-20 Kanegafuchi Chem Ind Co Ltd 金属表面の補修方法
JP2004358677A (ja) 2003-06-02 2004-12-24 Nippon Steel Chem Co Ltd 積層体の製造方法
JP2007118477A (ja) 2005-10-31 2007-05-17 Toray Ind Inc 両面金属箔積層板およびその製造方法
JP2009262534A (ja) 2008-03-31 2009-11-12 Toray Ind Inc 金属箔積層フィルムの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335991A (ja) * 1986-07-30 1988-02-16 森本　吉春 濃淡図形を表示するブラインド
JPH06335991A (ja) * 1993-05-28 1994-12-06 Mitsui Toatsu Chem Inc 耐熱性樹脂被覆弾性ロール
JP3989145B2 (ja) 1999-11-01 2007-10-10 株式会社カネカ 積層板の製造方法
KR20060117337A (ko) * 2003-12-26 2006-11-16 가부시키가이샤 가네카 연성 적층판의 제조 방법
JP5217321B2 (ja) 2007-09-13 2013-06-19 東レ株式会社 フレキシブル金属積層板の製造方法
FI20106107A (fi) * 2010-10-26 2012-03-19 Metso Paper Inc Menetelmä kuiturainakoneen telan valmistamiseksi ja kuiturainakoneen tela

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001046963A (ja) 1999-08-13 2001-02-20 Kanegafuchi Chem Ind Co Ltd 金属表面の補修方法
JP2004358677A (ja) 2003-06-02 2004-12-24 Nippon Steel Chem Co Ltd 積層体の製造方法
JP2007118477A (ja) 2005-10-31 2007-05-17 Toray Ind Inc 両面金属箔積層板およびその製造方法
JP2009262534A (ja) 2008-03-31 2009-11-12 Toray Ind Inc 金属箔積層フィルムの製造方法

Also Published As

Publication number Publication date
KR102592679B1 (ko) 2023-10-24
TWI810329B (zh) 2023-08-01
JP2020006685A (ja) 2020-01-16
KR20200002637A (ko) 2020-01-08
TW202000477A (zh) 2020-01-01
CN110662358A (zh) 2020-01-07

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